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Ceramic substrate thick film chip array resistor LIZ CA034AJA0750G with ruthenium oxide resistive layer

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Ceramic substrate thick film chip array resistor LIZ CA034AJA0750G with ruthenium oxide resistive layer

Number of Resistors : 4

Number of Pins : 8

Tolerance : ±5%

Resistance : 75Ω

Power(Watts) : 100mW

Temperature Coefficient : ±200ppm/℃

Description : 4 ±5% 75Ω 100mW ±200ppm/℃ 0603x4 Resistor Networks, Arrays RoHS

Mfr. Part # : CA034AJA0750G

Model Number : CA034AJA0750G

Package : 0603x4

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Product Overview

The CA Series Thick Film Chip Array Resistors are Pb-free and halogen-free components designed for various electronic applications. These resistors offer a wide resistance range and are available in different sizes and tolerances to meet diverse design requirements. They are constructed with a ceramic substrate, silver electrodes, and a ruthenium oxide resistive layer, encapsulated for protection. The series is suitable for applications requiring reliable performance under various environmental conditions, as evidenced by their adherence to stringent performance specifications.

Product Attributes

  • Brand: (LIZHI)
  • Origin: Kunshan City, Jiangsu Province, China
  • Material: Ceramic substrate (Al2O3), Silver electrodes (Ag), Resistive layer (RuO2 + glass), Inner protective layer (Glass), Outer protective layer (Epoxy), Marking (Epoxy), Nickel plating layer (Ni), Tin plating layer (Matte Tin)
  • Compliance: Pb-free, Halogen-free, RoHS exemption

Technical Specifications

Model/Type Size (8P4R) Rated Power Tolerance Resistance Value Packing Code Dimensions (mm) L x W x H Max Working Voltage Max Overload Voltage Dielectric Withstanding Voltage Zero Ohm Resistance Value Zero Ohm Rated Current Operating Temperature Range Storage Conditions
CA024A 0402 1/16W 1%, 2%, 5% 1 ~ 1M G (reel), V (bulk), S (Double Standard Quantity) 2.000.10 x 1.000.10 x 0.400.05 50V 100V 220V <50m 1A -55 ~ +155 530, 3075%RH
CA034A 0603 1/10W 1%, 2%, 5% 1 ~ 1M G (reel), V (bulk), S (Double Standard Quantity) 3.200.20 x 1.500.20 x 0.550.05 50V 100V 430V <50m 1A -55 ~ +155 530, 3075%RH

Performance Specifications

Item Test Method Test Conditions Specification
Temperature Coefficient JIS C 5201 4.8 R0: Resistance at room temperature; R: Resistance at 125 or -55; t0: Room temperature; t: Test temperature (125 or -55) 200 PPM/
Solderability JIS C 5201 4.17 Dip in flux, then in soldering bath at 2455 for 30.5 sec. Min 95% coverage
Insulation Resistance JIS C 5201 4.6 Applied dielectric withstanding voltage on the center of body for 605 seconds. >10G
Dielectric Withstanding Voltage JIS C 5201 4.7 Applied dielectric withstanding voltage on the center of body for 605 seconds. No evidence of flashover, arcing or insulation breakdown
Short-time Overload JIS C 5201 4.13 Applied 2.5 times of rated voltage for 5 seconds. Measure resistance variation. (1.0% +0.05) Max
Temperature Cycling JIS C 5201 4.19 1552 to -553, 5 cycles. Measure resistance variation. (2.0%+0.05) Max
Humidity JIS C 5201 4.24 402, 90~95% RH; Applied rated voltage for 1.5h, rest for 0.5h, repeated for 1000 +48/-0 hours. Measure resistance variation. (2.0%+0.05) Max
Load Life JIS C 5201 4.25.1 702, ON TIME:1.5H, OFF TIME:0.5H, applied rated voltage for 1000 +24/-0 hours. Measure resistance variation. (2.0%+0.05) Max
Terminal Bending JIS C 5201 4.33 Mounted on test board, bend board 1 +0.2/0 mm, maintained for 201 sec. Measure resistance variation. (1.0%+0.05) Max
Moisture Resistance MIL-STD-202 METHOD 106 25C~65C, 90~100%RH, 2.5h; 65C 90~100%RH, 3h; 65C~25C, 80~100%RH, 2.5h, 10 cycles. Measurement at 244 hours after test conclusion. (2.0% +0.05) Max

Packaging Specifications

Tapping Specification

Reel Dimensions (mm)

Model A B C F W Quantity per Reel
CA024A 1782.0 60.01.0 13.50.5 11.40.1 9.000.3 10,000 pcs
CA034A 1782.0 60.01.0 13.50.5 11.40.1 9.000.3 5,000 pcs

Carrier Tape Dimensions (mm)

Model A B D F P0 P1 P2 W
CA024A 1.200.10 2.200.10 1.500.0 1.0 3.500.05 4.000.10 4.000.10 2.000.05
CA034A 1.900.15 3.400.20 1.500.0 1.0 3.500.05 4.000.10 4.000.10 2.000.05

Peel Force of Top Cover Tape

Top cover tape is pulled at a speed of 200 mm/min at an angle of 165 to 180 degrees.

  • Paper carrier tape peel force: 0.1N to 0.7N (10 to 70 g)
  • Plastic carrier tape peel force: 0.15N to 0.80N (15 to 80 g)

Soldering

Recommended Reflow Soldering Profile

(Profile details not provided in the source text.)

Recommended Wave Soldering Profile

(Profile details not provided in the source text.)

Hand Soldering Temperature

Iron temperature: 35010. Hand soldering time less than 3S. Avoid direct contact of solder iron tip with the component body.


2410121222_LIZ-CA034AJA0750G_C5381607.pdf


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