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Surface mount RALEC RTA02-4D100JTH thick film array chip resistors for compact electronic assemblies

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Surface mount RALEC RTA02-4D100JTH thick film array chip resistors for compact electronic assemblies

Number of Resistors : 4

Number of Pins : 8

Tolerance : ±5%

Resistance : 10Ω

Power(Watts) : 62.5mW

Temperature Coefficient : ±200ppm/℃

Description : 4 ±5% 10Ω 62.5mW ±200ppm/℃ 0402x4 Resistor Networks, Arrays RoHS

Mfr. Part # : RTA02-4D100JTH

Model Number : RTA02-4D100JTH

Package : 0402x4

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RTA Series Thick Film Array Chip Resistors

The RTA series thick film array chip resistors are lead-free, halogen-free, and RoHS compliant, designed for general electronic applications. They offer reliable performance and are suitable for various general electronic purposes.

Product Attributes

  • Brand: RALEC
  • Certifications: RoHS compliant, Lead-free, Halogen-free

Technical Specifications

Type Rated Power Max. Rated Voltage Max. Overload Voltage T.C.R. (ppm/) Resistance Range Number of Terminals Number of Resistors Rated Current (JUMPER 0) Max. Resistance (JUMPER 0)
RTA02-2D (0402) 1 W 25V 50V 300 (1R<10), 200 (10R10M) 1R<10, 10R10M 4 2 1A 25m MAX.
RTA02-4D (0402) 1 W 25V 50V 300 (1R<10), 200 (10R10M) 1R<10, 10R10M 8 4 1A 25m MAX.
RTA02-8D (0402) 1 W 25V 50V 250 (10R10M) 10R10M 16 8 1A 50m MAX.
RTA03-2D (0603) 1 W 50V 100V 200 (10R10M) 10R10M 4 2 1A 50m MAX.
RTA03-4D (0603) 1 W 50V 100V 200 (22R470K), 200 (1R10M) 22R470K, 1R10M 8 4 1A 25m MAX.
RTA02-2C (0402) 1 W 25V 50V 650 (3R10), 200 (10R<1M) 3R10, 10R<1M 4 2 1A 50m MAX.
RTA02-4C (0402) 1 W 25V 50V 400 (1R<10), 200 (10R1M) 1R<10, 10R1M 8 4 1A 50m MAX.

Dimensions (mm)

Type L W H L1 L2 P Q
RTA02-2D (0402) 1.000.10 1.000.10 0.300.05 0.150.10 0.250.10 (0.67) 0.330.10
RTA02-4D (0402) 2.000.10 1.000.10 0.400.10 0.200.10 0.250.10 (0.50) 0.300.10
RTA02-8D (0402) 4.000.20 1.600.10 0.400.10 0.300.15 0.300.10 (0.50) 0.250.10
RTA03-2D (0603) 1.600.15 1.600.15 0.450.10 0.300.15 0.300.15 (0.80) 0.600.10
RTA03-4D (0603) 3.200.20 1.600.15 0.500.10 0.300.15 0.300.15 (0.80) 0.500.10
RTA02-2C (0402) 1.000.10 1.000.10 0.300.10 0.180.10 0.250.10 (0.50) 0.300.10
RTA02-4C (0402) 2.000.10 1.000.10 0.400.10 0.150.10 0.250.10 (0.50) 0.300.10

Structure Diagram

D (Convex) Type: 1. Ceramic substrate, 2. 2nd Protective coating, 3. Bottom inner electrode, 4. Top inner electrode, 5. Resistive layer, 6. 1st Protective coating, 7. Terminal inner electrode, 8. Marking, 9. Ni plating, 10. Sn plating.

C (Concave) Type: 1. Ceramic substrate, 2. 2nd Protective coating, 3. Bottom inner electrode, 4. Top inner electrode, 5. Resistive layer, 6. 1st Protective coating, 7. Terminal inner electrode, 8. Marking, 9. Ni plating, 10. Sn plating.

Reliability Test Items

Electrical Performance Test

ItemConditionsSpecifications
Temperature Coefficient of Resistance(R2-R1)/R1(T2-T1)106 R1:Resistance at room temp., R2:Resistance at -55 or +125, T1:Room temp., T2:-55 or +125According to JIS-C5201-1 4.8
Short Time OverloadApply 2.5 times rated voltage for 5 sec, rest 30 min.0.5%, 1%: R=1.0%; 5%: R=2.0% (Ref. 3. Specification Table)
Insulation Resistance TestApply 100 VDC for 1 min between electrodes and protective layer/substrate.109 (According to JIS-C5201-1 4.6)
Dielectric Withstand VoltageApply 300 VAC for 1 min between electrodes.No short circuit or burn. (According to JIS-C5201-1 4.7)
Intermittent Overload1 sec ON, 25 sec OFF, 10,000 cycles.R=5.0% (Ref. 3. Specification Table, According to JIS-C5201-1 4.13)

Mechanical Performance Test

ItemConditionsSpecifications
Resistance to SolventImmerse in Isopropanol (20~25) for 50.5 min, rest 48 hrs.R=0.5% (Ref. 3. Specification Table, According to JIS-C5201-1 4.29)
SolderabilityPre-treatment: 4 hrs aging at 105, 100% RH, 1.22105 pa. Test: Immerse in 2355 solder bath for 20.5 sec.Soldered area > 95% (According to JIS-C5201-1 4.17)
Resistance to Soldering HeatTest 1: Immerse in 260+5/-0 solder bath for 10 sec+1/-0, rest 60 min. Test 2: Immerse in 260+5/-0 solder bath for 30 sec+1/-0, then clean.Test 1: R%=1.0%. Test 2: Soldered area > 95%, no underlying material visible at electrode edge. (Ref. 3. Specification Table, According to JIS-C5201-1 4.18)
Joint Strength of Solder (Bending Test)Apply force to center of test board, D=5mm.R%=1.0% (Ref. 3. Specification Table, According to JIS-C5201-1 4.33)

Environmental Test

ItemConditionsSpecifications
Resistance to Dry Heat10004 hr at 1555 oven, rest 1 hr.0.5%, 1%: R=1.0%; 5%: R=2.0% (Ref. 3. Specification Table, According to JIS-C5201-1 4.25)
Thermal Shock-55 for 15 min, +125 for 15 min, 300 cycles, rest 60 min.R=1.0% (Ref. 3. Specification Table, According to MIL-STD 202 Method 107)
Moisture Load Test402, 90-95% RH, rated voltage applied, 90 min ON, 30 min OFF, 1,000 hr, rest 60 min.0.5%, 1%: R=2.0%; 5%: R=3.0% (Ref. 3. Specification Table, According to JIS-C5201-1 4.24)
Load Life702 oven, rated voltage applied, 90 min ON, 30 min OFF, 1,000 hrs, rest 60 min.0.5%, 1%: R=2.0%; 5%: R=3.0% (Ref. 3. Specification Table, According to JIS-C5201-1 4.25)

Plating Thickness

  • Nickel Layer (Ni): 2m
  • Pure Tin Layer (Sn): 3m (Matte tin)

Technical Application Notes

  • Recommended Soldering Conditions:
    (a) Lead Free IR-Reflow Soldering Profile (J-STD-020 compliant): Max. component temp. 260+5/-0, 10 sec.
    (b) Soldering Iron Method: 35010 within 3 seconds.
  • Recommended Land Pattern Design (For Reflow Soldering): Design considerations for resistance value changes due to soldering area and amount.
  • Environmental Precautions: This product is for general electronic use. RALEC is not responsible for damages or losses in special environments. Confirmation with RALEC is required for applications in high temp/humidity, corrosive atmospheres (Cl2, H2S, NH3, SO2, NO2), unverified liquids, unverified sealing/coating materials, or when using water-soluble cleaning agents post-soldering.
  • Transient Overload Precautions: Be aware of potential function loss due to transient overloads. Avoid applying transient currents exceeding product specifications.
  • Handling and Operation Precautions: Protect resistor edges and coating from mechanical stress. Handle PCBs carefully to avoid bending stress on resistors. Operate within rated power limits to prevent damage from overheating. Consider pulse load impacts and implement fail-safe designs. Evaluate and confirm in your actual application.

Storage and Handling Conditions

  • Storage: 2 years under 255, 6015% RH.
  • Avoid adverse environments: sea breeze, corrosive gases (Cl2, H2S, NH3, SO2, NO2), direct sunlight, condensation.
  • Handle boxes with correct orientation; avoid dropping or squeezing to prevent damage to electrodes or body.

2411221110_RALEC-RTA02-4D100JTH_C102626.pdf


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