RTA Series Thick Film Array Chip Resistors
The RTA series are lead-free, halogen-free thick film array chip resistors that comply with RoHS directives. They are designed for general electronic applications.
Product Attributes
- Brand: RALEC
- Certifications: RoHS compliant
Technical Specifications
| Type | Rated Power | Max. Rated Voltage | Max. Overload Voltage | T.C.R (ppm/) | Resistance Range | Number of Terminals | Number of Resistors | Rated Current (JUMPER 0) | Max. Resistance (JUMPER 0) |
| RTA02-2D (0402) | 1 W | 25V | 50V | 300 | 1R<10 (D:0.5%), 10R10M (D:0.5%), 1R<10 (F:1%), 10R10M (F:1%), 1R<10 (J:5%), 10R10M (J:5%) | 4 | 2 | 1A | 25m MAX. |
| RTA02-4D (0402) | 1 W | 25V | 50V | 300 | 1R<10 (D:0.5%), 10R10M (D:0.5%), 1R<10 (F:1%), 10R10M (F:1%), 1R<10 (J:5%), 10R10M (J:5%) | 8 | 4 | 1A | 25m MAX. |
| RTA02-8D (0402) | 1 W | 25V | 50V | 250 | 10R10M (D:0.5%), 1R10M (D:0.5%), 10R10M (F:1%), 10R10M (J:5%) | 16 | 8 | 1A | 50m MAX. |
| RTA03-2D (0603) | 1 W | 50V | 100V | 200 | 10R10M (D:0.5%), 1R10M (D:0.5%), 10R10M (F:1%), 1R10M (F:1%), 10R10M (J:5%) | 4 | 2 | 1A | 50m MAX. |
| RTA03-4D (0603) | 1 W | 50V | 100V | 200 | 22R470K (F:1%), 1R10M (D:0.5%), 1R10M (F:1%), 1R10M (J:5%) | 8 | 4 | 1A | 25m MAX. |
| RTA02-2C (0402) | 1 W | 25V | 50V | 650 | 3R10 (D:0.5%), 3R<10 (F:1%), 10R<1M (D:0.5%), 10R1M (F:1%), 10R<1M (J:5%), 10R1M (J:5%) | 4 | 2 | 1A | 50m MAX. |
| RTA02-4C (0402) | 1 W | 25V | 50V | 400 | 1R<10 (D:0.5%), 1R<10 (F:1%), 10R1M (D:0.5%), 10R1M (F:1%), 10R1M (J:5%) | 8 | 4 | 1A | 50m MAX. |
Operating Temperature Range: -55 ~ +155
Power Derating Curve: Power can be adjusted according to the curve when ambient temperature exceeds 70 to 155.
Rated Voltage/Current Calculation: Formulas are provided for calculating rated voltage (E=(RP)) and rated current (I=(P/R)) based on resistance and rated power, with limits set by the maximum values in the specification table.
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
| RTA02-2D (0402) | 1.000.10 | 1.000.10 | 0.300.05 | 0.150.10 | 0.250.10 | (0.67) | 0.330.10 |
| RTA02-4D (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.200.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-8D (0402) | 4.000.20 | 1.600.10 | 0.400.10 | 0.300.15 | 0.300.10 | (0.50) | 0.250.10 |
| RTA03-2D (0603) | 1.600.15 | 1.600.15 | 0.450.10 | 0.300.15 | 0.300.15 | (0.80) | 0.600.10 |
| RTA03-4D (0603) | 3.200.20 | 1.600.15 | 0.500.10 | 0.300.15 | 0.300.15 | (0.80) | 0.500.10 |
| RTA02-2C (0402) | 1.000.10 | 1.000.10 | 0.300.10 | 0.180.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-4C (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.150.10 | 0.250.10 | (0.50) | 0.300.10 |
Structure Diagram
Diagrams for D (Convex) Type and C (Concave) Type are provided, illustrating the layers of ceramic substrate, electrodes, resistive layer, protective coatings, and plating.
Reliability Test Items
Electrical Performance Tests
| Item | Conditions | Specifications |
| Temperature Coefficient of Resistance (TCR) | Measured at room temperature, -55, and +125. Formula: TCR = (R2-R1)/R1(T2-T1) 10 | Refer to 3. Specification Table |
| Short Time Overload | Apply 2.5 times rated voltage for 5 seconds, rest for 30 minutes. Measure resistance change rate. | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Insulation Resistance Test | Apply 100 VDC for 1 minute between electrodes and protective layer/substrate. | 10 |
| Dielectric Withstand Voltage | Apply 300 VAC for 1 minute between electrodes. | No short circuit or burnout. |
| Intermittent Overload | 1 second ON, 25 seconds OFF at 2.5 times rated voltage for 10,000 cycles. Measure resistance change. | R=5.0% |
Mechanical Performance Tests
| Item | Conditions | Specifications |
| Resistance to Solvent | Immerse in isopropanol at 20-25 for 50.5 minutes. Measure resistance change rate after 48 hrs. | R=0.5% |
| Solderability | Pre-treatment: 4 hours aging at 105, 100% RH, 1.2210 pa. Test: Immerse in 2355 solder for 20.5 seconds. Observe solder coverage. | Conductor tin coverage should be >95%. |
| Resistance to Soldering Heat | Test 1: Immerse in 260+5/-0 solder bath for 10+1/-0 seconds. Measure resistance change. Test 2: Immerse in 260+5/-0 solder bath for 30+1/-0 seconds. Observe solder coverage. | Test 1: R%=1.0%. Test 2: Conductor tin coverage >95%. No underlying material visible at electrode edges. |
| Joint Strength of Solder (Bending Test) | Solder onto bending test board, apply downward force of 5mm at center. Measure resistance change rate. | R%=1.0% |
Environmental Tests
| Item | Conditions | Specifications |
| Resistance to Dry Heat | Place in oven at 1555 for 10004 hours. Measure resistance change rate. | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Thermal Shock | Cycle between -55 (15 min) and +125 (15 min) for 300 cycles. Measure resistance change rate. | R=1.0% |
| Moisture Load Test | Place in constant temperature/humidity chamber (402, 90-95% RH) with rated voltage applied, 90 min ON, 30 min OFF for 1,000 hours. Measure resistance change rate. | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
| Load Life | Place in oven at 702 with rated voltage applied, 90 min ON, 30 min OFF for 1,000 hours. Measure resistance change rate. | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
Plating Thickness
- Nickel Layer (Ni): 2m
- Pure Tin Layer (Sn): 3m (Matte tin)
Technical Application Notes
- Recommended Soldering Conditions: Lead-Free IR-Reflow Soldering Profile (J-STD-020 compliant, max temp 260+5/-0 for 10 sec); Soldering Iron: 35010 within 3 seconds.
- Recommended Land Pattern Design: Design considerations for reflow soldering are provided with dimensions (A, B, P, Q1, Q2) for various types.
- Usage Environment Precautions: Not recommended for special environments (high temp/humidity, corrosive gases like Cl2, H2S, NH3, SO2, NO2, unverified liquids, unverified sealing/coating materials). Cleaning after soldering is recommended, even with no-clean flux.
- Transient Overload Precautions: Be mindful of transient overloads that may cause functional loss.
- Handling and Operation Precautions: Avoid mechanical stress on resistor edges and protective layers. Handle PCBs carefully to prevent bending stress on resistors. Operate within rated power limits. Consider pulse load impacts and implement fail-safe design.
Storage and Handling Conditions
- Storage: 2 years under 255, 6015% RH.
- Avoid adverse environments: sea breeze, corrosive gases (Cl2, H2S, NH3, SO2, NO2), direct sunlight, condensation.
- Handle boxes with correct orientation, avoid dropping or squeezing to prevent damage to electrodes or body.
Labeling
Outer boxes for export to mainland China will be labeled with the Electronic Information Product Pollution Control Mark and Packaging Recycling Mark.
Attachment
- Document Revision Record Table (QA-QR-027)
Legal Disclaimer
RALEC and its distributors/agents disclaim liability for any errors, inaccuracies, or incompleteness in product information. RALEC reserves the right to change product information without notice. RALEC makes no commitment regarding the suitability of products for specific purposes or their continued production. RALEC is not liable for any damages, losses, or liabilities arising from the application or use of its products. RALEC defines this product for general electronic use and it is not intended for automotive electronics, medical life-support/life-sustaining equipment, or any application where failure could cause injury or death. Technical advice provided by RALEC is free of charge, and the buyer assumes all risks associated with its use. The buyer assumes all risks and liabilities for combining RALEC products with other materials or implementing them in their processes. RALEC reserves the right to modify this content without notice; product changes will be announced via ECN.
2411221110_RALEC-RTA03-4D122JTP_C304956.pdf
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Thick Film Array Chip Resistors RALEC RTA03-4D122JTP RoHS Compliant Electronic Components Images
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