| Nominal Frequency | | 48.000000 | MHz | |
| Frequency Stability | f/F | -50 to +50 | ppm | @3.30.3V / -40~85 |
| Operating Temperature Range | Topr | -40 to +85 | | |
| Supply Voltage | Vdd | 3.0 to 3.6 | V | |
| Output Load | CL | 15 | pF | C-MOS |
| Current Consumption 1 (#1 pin: open or "H") | Idd1 | - to 13 | mA | @3.3V / 253 |
| Current Consumption 2 (#1 pin: "L" level) | Idd2 | - to 0.01 | mA | |
| Low Level Output Voltage | Vol | - to 0.1xVdd | V | |
| High Level Output Voltage | Voh | 0.9xVdd to - | V | |
| Symmetry Duty | | 40 to 60 | % | |
| Rise & Fall Time | Tr & Tf | - to 10 | ns | |
| Low Level Input Current | Iil | - to 10 | uA | |
| High Level Input Current | Iih | - to 10 | uA | |
| Low Level Input Voltage | Vil | - to Vddx0.3 | V | |
| High Level Input Voltage | Vih | Vddx0.7 to - | V | |
| Output Disable Time | Tplz | - to 150 | nsec | |
| Output Enable Time | Tpzl | - to 10 | msec | |
| Aging | | -3 to 3 | ppm/year | |
| Start-up Time | | - to 10 | ms | |
| Jitter, Phase RMS(1-) | | - to 1 | ps | 12KHz~20MHz Frequency Band |
| Vdd Terminal Voltage (Absolute Max) | Vdd | -0.5 to 4.0 | V | |
| Input Terminal Voltage (Absolute Max) | Vcont | -0.5 to Vdd+0.5 | V | |
| Output Terminal Voltage (Absolute Max) | Vout | -0.5 to Vdd+0.5 | V | |
| Output Terminal Current (Absolute Max) | Iout | 15 | mA | |
| Storage Temperature Range (Absolute Max) | Tstr | -55 to 125 | deg.C | |
| Dimensions (L x W x H) | | 3.2 x 2.5 x 1.0 (Max) | mm | |
| Land Pattern Layout Tolerance | | 0.1 | mm | |
| Carrier Tape Material | | PS Conductive | | |
| Top Tape Material | | PET | | |
| Standard Packing Quantity | | 3,000 | PCS / REEL | |
| Release Strength of Cover Tape | | 0.1 to 0.7 | N | Pulling direction: 165 to 180, Speed: 300mm/min |
| Shock Test | | A | | Dropping from 50 cm height 3 times on 30mm hard wooden board (JIS C 60068-2-32) |
| Vibration Test | | A | | Frequency 10-55Hz, 0.8mm amplitude, 2 hours per axis (JIS C 60068-2-6) |
| Leakage Test | | - | Pa-m/sec | Max. 1.0x10 (Helium leak detector) |
| Solder Ability Test | | B | | Dipping in solder bath at 2455 for 30.5 sec (JIS C 60068-2-20) |
| Resistance of Soldering Heat Test | | A | | Refer to reflow conditions |
| Humidity Test | | A | | 602, 90~95% RH, 240 hours (JIS C 60068-2-3) |
| Storage in Low Temperature Test | | A | | -552, 240 hours (JIS C 60068-2-1) |
| Storage in High Temperature Test | | A | | +1252, 240 hours (JIS C 60068-2-2) |
| Temperature Cycles Test | | A | | -55 to +125, 25 cycles (JIS C 0025) |
