| Frequency (FL) | | MHz | | | 32.000000 | |
| Mode of oscillation | | | Fundamental | | | |
| Frequency tolerance | | ppm | at 253 | -10 | | +10 |
| Equivalent resistance (RR) | | | SERIES | | 50 | |
| Storage temperature range | | | Note: Storage Temperature is only for the product itself. | -40 | | +125 |
| Operable temperature range | | | | -30 | | +85 |
| Temperature stability | | ppm | -30 ~ +85 | -10 | | +10 |
| Loading capacitance (CL) | | pF | | | 16.0 | |
| Drive level (DL) | | W | | 10 | 100 | |
| Shunt Capacitance (C0) | | pF | | | 2.0 | |
| Insulation resistance | | M | at DC 100V | 500 | | |
| Aging | | ppm/Year | | -3 | | +3 |
| Circuit | | | Measured in HP/E5100A,S&A 250B | | | |
| Dimensions | | mm | Tolerance: 0.1 | | | |
| Dimension L | | mm | | | 3.2 | |
| Dimension W | | mm | | | 2.5 | |
| Dimension H | | mm | | | 0.7 | |
| Pin Connections | | | #1 Crystal, #2,#4 GND/Lid, #3 Crystal | | | |
| Carrier Tape Width | | mm | | | 8.0 | |
| Carrier Tape Pitch | | mm | | | 4.0 | |
| Reel Quantity | | pcs | Standard Packing Quantity | | 3,000 | |
| Shock Test | Dropping from 120 cm height 3 times on 30 mm Concrete floor. | | Refer to: JIS C 60068-2-32 | | A | |
| Vibration Test | Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, 2 cycles and duration of 2 hours to each direction. | | Refer to: JIS C 60068-2-6/ MIL-HDBK-781A 6.5.2 | | A | |
| Leakage Test | Leak Rate | Pa-m3/sec. Max. | Measured by Helium leak detector. Refer to: JIS C 60068-2-17 | | 1.0x10-9 | |
| Solder ability | Dipping in solder bath at 245deg.C 5deg.C for 3 0.5 sec. | | Refer to: JIS C 60068-2-20/ JIS C 60068-2-58 | | B | |
| Bending Strength | Apply Pressure to the center of board until it is bent to 3 mm and hold for 5 1 sec. | mm | Refer to: EIAJ ET-7403/ JIS C 60068-2-21 | | A | |
| Adhesion | Apply pressure vertically to the side of specimen attached to the circuit board with the pressure jig. Pressure: 5N for 101 sec. | | Refer to: EIAJ ET-7403 JIS C 60068-2-21 | | A | |
| Body strength | Apply pressure to the center of body with the R0.5 pressure jig. pressure :10N for 101sec | | Refer to: EIAJ ET-7403 JIS C 60068-2-21 | | A | |
| Resistance of Soldering Heat | Performing as the following reflow | | Refer to: JIS C 60068-2-58 | | A | |
| Humidity Test | Temperature 602, RH 90~95%, duration of 240 hours. | | Refer to: JIS C 60068-2-3 | | A | |
| Storage in Low Temperature | -40deg.C 2deg.C, duration of 240 hours. | | Refer to: JIS C 60068-2-1 | | A | |
| Storage in High Temperature | +85deg.C 2deg.C, duration of 240 hours. | | Refer to: JIS C 60068-2-2 | | A | |
| Thermal shock | -55deg.C 2deg.C (30min) +125deg.C 2deg.C (30min) 25 cycles. | | Refer to: JIS C 0025 | | A | |
