| Electrical Specifications | FL | 24.000000 | MHz | |
| f/F | -50 ~ +50 | ppm | @3.30.3V / -10~70 |
| Topr | -10 ~ +70 | | |
| Vdd | 3.0 ~ 3.6 | V | |
| CL | 15 | pF | C-MOS (Idd1, Idd2 test at No Load) |
| Idd1 | - ~ 7 | mA | @3.3V / 253 (#1 pin: open or "H") |
| Idd2 | - ~ 0.01 | mA | (#1 pin: "L" level) |
| Vol | - ~ 0.1xVdd | V | |
| Voh | 0.9xVdd ~ - | V | |
| Duty | 40 ~ 60 | % | |
| Tr & Tf | - ~ 10 | ns | |
| Aging | -3 ~ 3 | ppm/year | |
| Start-up time | - ~ 10 | ms | |
| Absolute Maximum Ratings | Vdd | -0.5 ~ 4.0 | V | |
| Vcont | -0.5 ~ Vdd+0.5 | V | |
| Vout | -0.5 ~ Vdd+0.5 | V | |
| Iout | 15 | mA | |
| Tstr | -55 ~ 125 | deg.C | |
| Mechanical Performance | Shock | Dropping from 50 cm height 3 times on 30mm hard wooden board. | | Refer to: JIS C 60068232 A |
| Vibration | Frequency 1055Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 2 hours to each axis. | | Refer to: JIS C 6006826 A |
| Leakage Test | Leak Rate 1.0x109 Pam3/sec. Max. | | Measured by Helium leak detector. |
| Solder ability | After applying ROSIN Flux, dipping in solder bath at 245deg.C +/- 5deg.C for 3+/-0.5 sec. | | Refer to: JIS C 60068220 B |
| Specifications code | A: Frequency variation shall be within +/-5ppm, B: More than 90% of lead shall be covered by new solder. | | |
| Environmental Performance | Resistance of Soldering Heat | Performing as the following reflow: A | | |
| Humidity | Temperature 60+/-2, RH 90~95%, Duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | | Refer to: JIS C 6006823 A |
| Storage in Low Temperature | 55deg.C +/-2deg.C, Duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | | Refer to: JIS C 6006821 A |
| Storage in High Temperature | +125deg.C +/-2deg.C, Duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | | Refer to: JIS C 6006822 A |
| Temperature cycles | 55deg.C+/-2deg.C (30min) +125deg.C+/-2deg.C (30min) 25 cycles. And Temperature Increasing/reducing time3mins. Back to the room temperature first, then check the component after 1~2 hours. | | Refer to: JIS C 0025 A |
| Dimensions (mm) | | 3.20.2 (Length) x 2.50.2 (Width) x 1.0 Max. (Height) | mm | |
| Pin Connections | #1 | OE (Output Enable) | | |
| #2 | Output | | |
| #3 | GND | | |
| #4 | Vdd | | |
