| Electrical Specifications | FL | 33.000000 | MHz | |
| f/F | -50 ~ +50 | ppm | @3.30.3V/10~70 |
| Topr | -10 ~ +70 | | |
| Vdd | 3.0 ~ 3.6 | V | |
| CL | 15 | pF | C-MOS |
| Idd1 | - ~ 16 | mA | @3.3V/ 253 (#1 pin: open or "H") |
| Idd2 | - ~ 0.02 | mA | (#1 pin: "L" level) |
| Vol | - ~ 0.1xVdd | V | |
| Voh | 0.9xVdd ~ - | V | |
| Duty | 40 ~ 60 | % | |
| Tr & Tf | - ~ 10 | ns | |
| Iil | - ~ -100 | uA | |
| Iih | - ~ 100 | uA | |
| Vil | - ~ Vddx0.3 | V | |
| Vih | Vddx0.7 ~ - | V | |
| Tplz | - ~ 150 | nsec | |
| Tpzl | - ~ 10 | msec | |
| Aging | -5 ~ 5 | ppm/year | |
| Startup time | - ~ 10 | ms | |
| Jitter, Phase RMS(1) | - ~ 1 | ps | 12KHz~20MHz Frequency Band |
| Absolute Maximum Ratings | Vdd | -0.5 ~ 7.0 | V | |
| Vcont | -0.5 ~ Vdd+0.5 | V | |
| Vout | -0.5 ~ Vdd+0.5 | V | |
| Iout | 15 | mA | |
| Tstr | -55 ~ 125 | deg.C | |
| Dimensions | 7.00.2 x 5.00.2 mm |
| Height: Max. 3.7 mm |
| Land Pattern Layout: 3.68 x 3.28 mm |
| Pin Connections | 1: OE(Output Enable)
2: Vdd
3: GND
4: Output |
| Marking | Laser marking with Date Code (Year/Month) |
| Inside Structure | Base: Ceramic Al2O3
Lid: Fe-Ni-Co
Kovar: Fe-Ni-Co
Crystal Blank: SiO2 Rectangular At-Cut
Electrode: Metal
Connective Adhesive: Silver Powder Ag
Bonding Wire: Au
IC: Silicon Si, Al
Pad: W, Ni-Plating, Au-Plating |
| Reflow Condition | Preheat: 160~180 (120 sec)
Primary heat: >=220 (60~120 sec)
Peak: 260 (10 sec Max.) |
| Manual Solder iron | Bit temp.: 350 max., Time: 3sec max. |
| Storage Conditions | Temperature: +125 Maximum
Relative Humidity: 80% Maximum |
| Carrier Tape Material | Carrier tape: PS
Top tape: Polyester |
| Standard Packing Quantity | 1,000 PCS / REEL |
| Mechanical Performance | Shock | Dropping from 50 cm height 3 times on 30mm hard wooden board. | A | JIS C 60068232 |
| Vibration | Frequency 1055Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 2 hours to each axis. | A | JIS C 6006826 |
| Leakage Test | Leak Rate 1.0x109 Pam3/sec. Max. Measured by Helium leak detector. | | |
| Solder ability | After applying ROSIN Flux, dipping in solder bath at 245deg.C +/ 5deg.C for 3+/0.5 sec. | B | JIS C 60068220 |
| Environmental Performance | Resistance of Soldering Heat | Performing as the following reflow: A | | |
| Humidity | Temperature 60+/2, RH 90~95%, Duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | A | JIS C 6006823 |
| Storage in Low Temperature | 55deg.C +/2deg.C, Duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | A | JIS C 6006821 |
| Storage in High Temperature | +125deg.C +/2deg.C, Duration of 240 hours. Back to the room temperature first, then check the component after 1~2 hours. | A | JIS C 6006822 |
| Temperature cycles | 55deg.C+/2deg.C (30min) +125deg.C+/2deg.C (30min) 25 cycles. And Temperature Increasing/reducing time3mins. Back to the room temperature first, then check the component after 1~2 hours. | A | JIS C 0025 |
