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High volumetric capacitance MLCC array FH 6124B104K500NT with space saving and cost reducing features

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High volumetric capacitance MLCC array FH 6124B104K500NT with space saving and cost reducing features

Capacitance : 100nF

Circuit Type : Independent

Temperature Coefficient : X7R

Tolerance : ±10%

Voltage Rating : 50V

Number of Capacitors : 4

Description : 100nF Independent X7R ±10% 50V 0612 Capacitor Networks, Arrays RoHS

Mfr. Part # : 6124B104K500NT

Model Number : 6124B104K500NT

Package : 0612

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MLCC_Arrays ()

MLCC_Arrays, also known as C-ARRAY SERIES, are multi-layer ceramic capacitors designed to save PCB space and improve assembly efficiency. They offer higher capacitance per volumetric area, reduce manufacturing costs by minimizing pick-and-place operations, and are compatible with SMT processes for easy high-speed mounting. These capacitors enhance printed board working efficiency by reducing printed circuits and increasing operational speed. They are manufactured according to GH/T 21041-2007 and GH/T 21042-2007 standards.

Key Features:

  • Space Saving: Can save up to 50% of PCB space, increasing assembly density.
  • High Volumetric Capacitance: One chip equals four 0603 type capacitors, reducing mounting steps and improving efficiency.
  • Cost Saving: Reduces pick-and-place operations, manufacturing time, equipment management costs, and PCB expenses.
  • Easy Mounting: Available in SMT tape packaging for high-speed placement.
  • Improved Efficiency: Reduces printed circuits and increases the working speed of printed circuit boards.

Applications:

  • Suitable for PCBs with strict component space requirements, such as notebook computers, PDAs, and cordless phones.
  • Particularly effective for input and output interface circuits.

Product Attributes:

  • Manufacturer: (Not specified in detail, but implied)
  • Certifications: GH/T 21041-2007, GH/T 21042-2007

Technical Specifications:

Part Number Prefix Product Size (inch) Elements Inside Dielectric Style Capacitance Tolerance Rated Voltage (V) Termination Material Package Style
6124 0.06 x 0.12 4 COG, X7R, X5R, Z5U, Y5V A, B, C, D, F, G, J, K, M, S, Z 16, 25, 50, 100 S, C, N B, T
5084 0.05 x 0.08 4 COG, X7R, Y5V A, B, C, D, F, G, J, K, M, S, Z 16, 25, 50 S, C, N B, T
5082 0.05 x 0.08 2 COG, X7R, Y5V A, B, C, D, F, G, J, K, M, S, Z 16, 25, 50 S, C, N B, T

Temperature Coefficient / Characteristics:

Dielectric Style Reference Temperature Point Nominal Temperature Coefficient Operation Temperature Range
COG 20C 030 ppm/ -55125
X7R 20C 15% -55125
X5R 20C 15% -5585
Z5U 20C -56%+22% 1085
Y5V 20C -80%+30% -2585

Outline Dimensions (mm):

Specification Model L W T P E
5082 1.250.20 2.000.20 0.800.10 1.000.10 1.000.10
5084 1.250.20 2.000.20 0.800.10 1.000.10 0.500.05
6124 1.600.20 3.200.20 0.800.10 1.000.10 0.800.20

Capacitance Range:

Please refer to the detailed tables in the original document for specific capacitance values available for each material, working voltage, and model.

Reliability Test:

Item Technical Specification Test Method and Remarks
Capacitance Class : Should be within the specified tolerance. Class : Should be within the specified tolerance. Measuring Frequency: 1000pF: 1MHz10%; 1000pF: 1KHz10%. Measuring Voltage: 1.00.2Vrms. Test Temperature: 253.
Dissipation Factor (DF, tan) Class : See detailed values. Class : X7R: 2.5% (50V) to 7.5% (6.3V). Y5V: 7.0% (<1.0F) to 15% (6.3V). Test Frequency: 1KHz10% (C10F) or 12024 Hz (C10F). Test Voltage: 1.00.2Vrms or 0.50.1Vrms.
Insulation Resistance (IR) Class : C10 nF, Ri50000M; C10 nF, Ri CR500S. Class : X7R: C25 nF, Ri10000M; C25 nF, Ri CR100S. Y5V: C25 nF, Ri4000M; C25 nF, Ri CR100S. Test Voltage: Rated Voltage. Duration: 605s. Test Humidity: 75%. Test Temperature: 253.
Dielectric Withstanding Voltage (DWV) No breakdown or damage. Measuring Voltage: Class: 300% Rated voltage; Class: 250% Rated voltage. Duration: 15s.
Solderability At least 95% of the terminal electrode is covered by new solder. Visual Appearance: No visible damage. Preheating: 80~120, 10~30s. Lead solder: 2355, 20.5s. Lead-free solder: 2455, 20.5s.
Resistance to Soldering Heat C/C: COG 0.5%, X7R -5~+10%, Y5V -10~+20%. DF & IR: Same to initial value. Appearance: No visible damage. Solderability: 95%. Preheating: 100~200, 102min. Solder Temperature: 2655, Duration: 101s. Recovery Time: 242h.
Resistance to Flexure of Substrate (Bending Strength) C/C 10%. Appearance: No visible damage. Test Board: Al2O3 or PCB. Warp: 1mm. Speed: 1mm/sec. Measurement in bent position.
Termination Adhesion No visible damage. Applied Force: 5N. Duration: 101S.
Temperature Cycle C/C: Class: 1% or 1pF. Class: B: 10%, F: 20%. 5 cycles. Temperature range: -55 to +125 (COG/X7R/X5R) or -25 to +85 (Y5V/Z5U). Step duration: 30 min. Recovery time: 242h.
Humidity Load C/C: Class: 7.5% or 0.75pF. Class: B: 12.5%, F: 30%. DF 2x initial value. IR: See detailed values. Appearance: No damage. Temperature: 402. Humidity: 90~95%RH. Voltage: Rated Voltage. Duration: 500 hours. Recovery Time: 24h (Class 1) or 48h (Class 2).
Life Test C/C: Class: 2% or 1pF. Class: B: 20%, F: 30%. DF 2x initial value. IR: See detailed values. Applied Voltage: 2 Rated Voltage. Duration: 1000h. Temperature: 125 (COG/X7R) or 85 (Y5V). Recovery Time: 24h (Class 1) or 48h (Class 2).

2410121231_FH-6124B104K500NT_C62857.pdf


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