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Non Inductive Winding Metallized Polypropylene Film Capacitor DGCX MPP154J2EB040C030ZR for Filtering

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Non Inductive Winding Metallized Polypropylene Film Capacitor DGCX MPP154J2EB040C030ZR for Filtering

Description : Through Hole,P=7.5mm Film Capacitors RoHS

Mfr. Part # : MPP154J2EB040C030ZR

Model Number : MPP154J2EB040C030ZR

Package : Through Hole,P=7.5mm

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Product Overview

The CBB21/MPP series metallized polypropylene film capacitors are designed for electronic equipment, featuring an epoxy encapsulation and a non-inductive winding structure. These capacitors are suitable for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. They offer excellent self-healing properties, low loss, and minimal internal temperature rise, with a flame-retardant epoxy resin powder coating.

Product Attributes

Brand: Dongguan Chengxi Electronics Co., Ltd.
Product Type: Metallized Polypropylene Film Capacitor (Impregnated Type)
Series: CBB21/MPP
Construction: Non-inductive winding, metallized polypropylene film
Encapsulation: Flame-retardant epoxy resin powder coating
Lead Material: Tinned copper clad steel wire
Origin: Guangdong, China
Certifications: RoHS, REACH, Halogen-free (upon request)

Technical Specifications

Model	Capacitance (F)	Tolerance (%)	Rated Voltage (VDC)	Dissipation Factor (DF) (1KHz)	Dimensions (mm) (WHT)	Pitch (P) (mm)	Lead Length (L) (mm)	Diameter (d) (mm)
MPP154J2EB040C030ZR	0.15	5	250	0.1	9.510.05.2	7.5 1.0	3.0 0.5	0.6 0.05

General Electrical Characteristics

Parameter	Specification	Test Condition
Climate Category	40/105/21
Operating Temperature Range	-40 to +105	(+85 to +105: Rated voltage derating 1.25% / )
Rated Temperature	85
Capacitance Range	0.001F to 6.8F
Capacitance Tolerance	5% (J), 10% (K)
Rated Voltage	100, 160, 250, 400, 630, 1000, 1250, 1600, 2000 Vdc
Dissipation Factor (DF)	0.0010	1KHz, 20
Insulation Resistance	30,000 M (for C0.33F)	100VDC, 60 seconds
Insulation Resistance	10,000 M*F (for C>0.33F)	100VDC, 60 seconds
Withstand Voltage	1.6 UR(VDC)	5 seconds

Product Structure and Main Materials

No.	Main Material	Description	Remarks
1	Metallized Polypropylene Film	MPPZAH	-/-
2	Spray-welding Layer	Zinc-tin alloy wire	-/-
3	Lead Wire	Tinned copper clad steel wire	-/-
4	Outer Encapsulation Material	Epoxy resin powder	Flame-retardant UL94V-0
5	Inner Protective Material	Epoxy resin
			All raw materials and finished products comply with RoHS environmental requirements.

Packaging Information

Inner Box Dimensions: L*W*H = 34.5*23.5*24.5 cm
Outer Box Dimensions: L*W*H = 49*36*27 cm
Packaging Details: Includes manufacturer part number, number of packages, and quantity per package, Lot No.
Capacitors are packaged in transparent PVC bags for moisture and dust protection.
RoHS environmental mark is applied.
Other customer marking requirements can be accommodated.

Storage Conditions

Avoid prolonged exposure to air, which can degrade lead wire solderability.
Do not store in high temperature or high humidity environments.
Storage Conditions: Temperature: Max 35, Relative Humidity: Max 80% (when stored in original packaging).
Storage Time: Maximum 12 months (based on production date marked on the packaging bag).

Environmental Characteristics

Complies with RoHS requirements.
Complies with REACH requirements.
Complies with Halogen-free requirements (if requested).

Product Electrical Characteristics and Test Conditions

Unless otherwise specified, tests are conducted within standard atmospheric conditions: Ambient Temperature: 1535, Relative Humidity: 25%75%. For any questions regarding test results, testing is performed under the following limits: Ambient Temperature: 202, Relative Humidity: 60%70%.

Detailed Electrical Characteristics & Test Methods

No.	Item	Characteristic	Test Method
1	Terminal Strength	Tensile Strength	No visible mechanical damage. Wire diameter: 0.6 & 0.8mm. Load: 10N, Duration: 10 seconds.
		Bending Strength	Wire diameter: 0.6 & 0.8mm. Force: 5N, 90 2 times.
		Solderability	Tinning rate of lead wire: 95%. Solder temperature: 2455. Immersion time: 2.50.5 seconds.
2	Solder Heat Resistance	Appearance	No visible damage. Solder temperature: 2605. Immersion time: 101 seconds. Recovery time: 1-2 hours.
		Dissipation Factor Increase	0.004 (C1.0F, 10kHz) or 0.004 (C>1.0F, 1kHz)
		Capacitance Change	C/C 3%
		Initial Measurement	Capacitance (1KHz), Dissipation Factor	CR1F: Test frequency 10kHz; CR>1F: Test frequency 1kHz.
3	Temperature Rapid Change	Appearance	No visible damage. A=-40, B=+105, 5 cycles. Duration: t=30min.
		Vibration	No visible damage. Amplitude 0.75mm or acceleration 98m/s (whichever is smaller), frequency 10-500Hz. Three directions, mutually perpendicular, 2h per direction, total 6h.
		Shock	No visible damage. 4000 times, acceleration 390m/s, pulse duration: 6ms.
		Final Measurement	Appearance, Capacitance Change (C/C 5%), Dissipation Factor Increase (0.004), Insulation Resistance (IR/IR 50%)
		Initial Measurement	Capacitance (1KHz), Dissipation Factor	CR1F: Test frequency 10kHz; CR>1F: Test frequency 1kHz.
4	Climatic Sequence	Dry Heat	+105, 16 hours.
		Cyclic Damp Heat	Test Db, first cycle.
		Cold	-40, 2 hours.
		Low Pressure	No permanent breakdown, arcing, or harmful deformation of the case. 8.5kPa, 1 hour.
		Cyclic Damp Heat	Test Db, remaining cycles. Final Measurement: Appearance, Capacitance Change (C/C 5%), Dissipation Factor Increase (0.005), Insulation Resistance (IR/IR 50%).
5	Steady State Damp Heat	Appearance	No visible damage. Relative Humidity: 90-95%RH. Temperature: 402. No load, duration: 21 days. Recovery time: 1-2 hours.
		Capacitance Change	C/C 5%
		Dissipation Factor Increase	0.002 (C1.0F, 10kHz) or 0.004 (C>1.0F, 1kHz)
Insulation Resistance	IR/IR 50%
6	Endurance	Appearance	No visible damage. T=85, 1000 hours. Applied voltage: 1.25UR.
		Capacitance Change	C/C 8%
		Dissipation Factor Increase	0.004
		Insulation Resistance	IR/IR 50%
7	Charge/Discharge	Capacitance Change	C/C 5%
		Charge/Discharge Cycles	10,000	Charging time: 0.5s, Discharging time: 0.5s, Charging voltage: Rated voltage UR, Charging resistance: 220/CR (), Discharging resistance: 10/CR or 20 (whichever is larger). CR: Rated capacitance (F).
		Dissipation Factor Increase	0.005 (10KHz, CR1.0uF) or 0.005 (1KHz, CR>1.0uF)
		Insulation Resistance	IR/IR 50%

Usage Rules

Usage Range: Do not exceed the upper limit category temperature. Avoid overload usage. Do not exceed the maximum pulse current during use.
Operation Precautions: Avoid repeated squeezing at the lead wire root. Pay attention to the tip of the lead wires.
Soldering: When soldering capacitors, solder heat is transferred through the lead terminals and encapsulation layer to the capacitor core. Therefore, be cautious of capacitor electrical characteristic degradation or damage caused by high temperatures and prolonged soldering.
Soldering Temperature Range:
- Wave Soldering: MPP Polypropylene film capacitors: TP 110 for 120 seconds; Ts 120 for 45 seconds. For MPP Polypropylene film capacitors with P 7.5mm, T 4mm, wave soldering time < 4 seconds.
- Soldering Iron: If using a soldering iron, the tip temperature should not exceed 350, and the soldering time should not exceed 3 seconds.
- Lead wire film capacitors are not suitable for reflow soldering.
Ts: Maximum temperature the capacitor body can withstand during wave soldering.
Tp: Maximum temperature the capacitor body can withstand during the preheating stage.

Maximum Effective Voltage vs. Frequency Curve

Note: The typical values in the curve diagram are tested under conditions of sinusoidal voltage, ambient temperature 85, and capacitor internal temperature rise T=10.

Product Electrical Characteristics Diagram

(Diagram not provided in source text)

2512031620_DGCX-MPP154J2EB040C030ZR_C53070551.pdf

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