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High Density Packaging Surface Mount Resistor Network CTS 752091561GTR7 with Lead Free Termination Finish

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High Density Packaging Surface Mount Resistor Network CTS 752091561GTR7 with Lead Free Termination Finish

Number of Resistors : 8

Number of Pins : 9

Tolerance : ±2%

Resistance : 560Ω

Power(Watts) : 80mW

Temperature Coefficient : ±200ppm/℃

Description : 8 ±2% 560Ω 80mW ±200ppm/℃ Resistor Networks, Arrays

Mfr. Part # : 752091561GTR7

Model Number : 752091561GTR7

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CTS 752 Series Surface Mount Resistor Network

The CTS 752 Series Resistor Networks are single packaged devices featuring an array of homogeneous resistor elements. These networks offer a smaller circuit footprint, excellent reliability, improved TCR tracking, and resistor tolerance matching, while reducing component count for cost savings in placement. Designed for high-density packaging, they are suitable for various demanding applications.

Product Attributes

Brand: CTS
Product Type: Surface Mount Resistor Network
Construction: Solid Ceramic
Termination Finish: Nickel Barrier Solder-Coated Pads (Lead-Free)
Packaging: Tape and Reel
Certifications: RoHS Compliant in Accordance with EU Directive 2011/65/EU - Lead-Free Termination Finish - Exemption 7(c)-I

Features

Low Profile Surface Mount Lead-Less Package
High Density Packaging - Single Row [SRT] & Dual Row [DRT] Terminations
No Internal Dendrite Growth
Designed for Visual Inspection & Board Cleaning

Applications

Telecom Infrastructure
Optical Networking
Wireless Networks
Storage Area Networks
Media Servers
Test & Measurement
Industrial Controls
Medical Electronics
Commercial Military & Aerospace

Technical Specifications

Specification	Details
Operating Conditions	Power Rating @ +25C: 1.2W (8 Pad SRT) to 2.0W (24 Pad DRT) Power Rating @ +70C: 0.08W (8 Pad SRT) to 1.3W (24 Pad DRT) Maximum Resistor Power (Total network power): 0.12W (SRT 8 Pad) to 2.0W (DRT 24 Pad) @ +25C; 0.08W (SRT 8 Pad) to 1.3W (DRT 24 Pad) @ +70C Resistance Range: 10 ohm to 1M ohm Resistance Tolerance: 2% Std. or 0.5 ohm (whichever is greater) Operating Temperature Range: -55C to +125C Temperature Coefficient: 200ppm/C (standard, 10 Ohms - 1M); 100ppm/C (special, 33 ohms - 1M ohms) Dielectric Strength: 100VAC Maximum Operating Voltage: 25V
Environmental Parameters	Thermal Cycle: 0.50, 5 cycles -65C to +125C Short Time Overload: 0.50, 2 times rated working voltage for 5 seconds (100V maximum) Moisture Resistance: 0.50, 106, 240 hours, 0.1 rated load, -10C to +65C, 90% RH Load Humidity: 1.00, 1,000 hours, 0.1 rated load, +70C, 85% - 92% RH High Temperature Exposure: 1.00, 240 hours @ +125C, no load Load Life: 1.00, 108, Condition F, 2,000 hours @ +70C, rated load Resistance to Solder Heat: 0.25, 30 seconds @ +218C, dwell Mechanical Shock: 0.25, 213 Condition I, 100g, 1m second, 3 shocks each plane Vibration: 0.25, 204 Condition D, 20g, 10Hz - 2,000Hz, 4 hours per plane Leaching Test: No leach > 50% EIA/IS-703-4.13.B, Immerse in +245C 5C SAC305 solder pot for 30 sec. Shear Test: NA, 2,000PSI Low Temperature Storage: 0.25, 24 hours @ -65C, no load Low Temperature Operation: 0.25, 45 minutes @ -65C, full load Flammability: N/A, 94V-0 Non-Fungus: Pass Resistance to Solvents: Pass, Isopropyl alcohol, Freon TMC Solderability: Pass, RMA Flux, +230C, 5 seconds dip, 95% coverage
Mechanical Specifications	Package Dimensions: 11.81 0.12mm (0.465 0.005 in) for 08/16 pads up to 16.89 0.12mm (0.665 0.005 in) for 12/24 pads Termination: JEDEC termination code (e3). Barrier plating is nickel [Ni] over silver [Ag] thick film pad with Matte tin [Sn] finish. Reflow Conditions: Per JEDEC-J-STD-020; +260C maximum, 20 seconds. MSL: 1
Part Weight	08/16 Pads: 180.70mg 09/18 Pads: 203.30mg 10/20 Pads: 225.90mg 12/24 Pads: 271.10mg

2410311239_CTS-752091561GTR7_C20433362.pdf

High Density Packaging Surface Mount Resistor Network CTS 752091561GTR7 with Lead Free Termination Finish Images

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