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Automatic Mounting Compatible Chip Beads Samsung Electro-Mechanics CIM10F600NC for High Frequency EMI

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Automatic Mounting Compatible Chip Beads Samsung Electro-Mechanics CIM10F600NC for High Frequency EMI

Description : Ferrite Beads and Chips RoHS

Mfr. Part # : CIM10F600NC

Model Number : CIM10F600NC

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Product Overview

The CIB/CIM10 Series (1608/EIA 0603) are monolithic inorganic material chip beads designed for high-frequency EMI prevention. These components offer perfect shape for automatic mounting with no directionality, excellent solderability, and high heat resistance suitable for flow or reflow soldering. Their closed magnetic circuit configuration effectively avoids crosstalk, making them ideal for high-density PCBs. Applications include computers, printers, VCRs, TVs, and mobile phones.

Product Attributes

Series: CIB/CIM10 Series
Type: Chip Beads (EMI Suppression)
Construction: Monolithic inorganic material, Closed magnetic circuit
Mounting: Suitable for automatic mounting, no directionality
Soldering: Excellent solderability and high heat resistance for flow or reflow soldering
PCB Density: Suitable for high density PCBs

Technical Specifications

Dimensions:

Type	Dimension [mm] (L x W x t x d)
10	1.60.15 x 0.80.15 x 0.80.15 x 0.30.2

Recommended Land Pattern: 0.6~0.8mm

Characteristic Data:

Part no.	Thickness (mm)	Impedance ()25%@100MHz	DC Resistance () Max.	Rated Current (mA) Max.
CIB10P100	0.80.15	10	0.05	1000
CIB10P220	0.80.15	22	0.05	1500
CIB10P260	0.80.15	26	0.08	1000
CIB10P300	0.80.15	30	0.08	1000
CIB10P330	0.80.15	33	0.08	1000
CIM10U600	0.80.15	60	0.15	600
CIM10U800	0.80.15	80	0.10	600
CIM10U121	0.80.15	120	0.15	500
CIM10U221	0.80.15	220	0.25	400
CIM10U241	0.80.15	240	0.25	400
CIM10U301	0.80.15	300	0.30	400
CIM10U471	0.80.15	470	0.35	300
CIM10U601	0.80.15	600	0.38	500
CIM10U102	0.80.15	1000	0.50	400
CIM10U202	0.80.15	2000 (at 70MHz)	1.20	200
CIB10J300	0.80.15	30	0.10	1000
CIM10J400	0.80.15	40	0.12	600
CIM10J470	0.80.15	47	0.12	600
CIM10J600	0.80.15	60	0.12	600
CIM10J750	0.80.15	75	0.15	550
CIM10J800	0.80.15	80	0.15	550
CIM10J121	0.80.15	120	0.20	500
CIM10J151	0.80.15	150	0.20	400
CIM10J221	0.80.15	220	0.30	400
CIM10J241	0.80.15	240	0.30	400
CIM10J301	0.80.15	300	0.35	400
CIM10J331	0.80.15	330	0.35	400
CIM10J471	0.80.15	470	0.35	300
CIM10J601	0.80.15	600	0.45	300
CIM10J751	0.80.15	750	0.50	300
CIM10J102	0.80.15	1000	0.60	250
CIM10J152	0.80.15	1500	0.70	250
CIM10J252	0.80.15	2500	1.50	200
CIM10K152	0.80.15	1500	0.80	250
CIM10K202	0.80.15	2000	1.00	200
CIM10K252	0.80.15	2500	1.20	200
CIM10N700	0.80.15	70	0.30	500
CIM10N121	0.80.15	120	0.45	400
CIM10N241	0.80.15	240	0.60	300
CIM10F470	0.80.15	47	0.25	550
CIM10F600	0.80.15	60	0.25	550
CIM10F121	0.80.15	120	0.30	500
CIM10F331	0.80.15	330	0.58	400
CIM10F471	0.80.15	470	0.85	300

Product Identification Breakdown:

CIM 10 U 121 N C

(1) Chip Beads
(2) M: Multi-layer type, B: Mono-layer type
(3) Dimension
(4) Material Code
(5) Nominal impedance (e.g., 121:120, 202:2000)
(6) Thickness option (N: Standard, A: Thinner than standard, B: Thicker than standard)
(7) Packaging (C: paper tape (7"), D: Paper tape (13"), E: embossed tape)

Packaging:

Packaging Style	Quantity (pcs/reel)
Card Board Taping (7'')	4,000
Card Board Taping (13'')	16,000

Recommended Soldering Condition:

(Details for Reflow Soldering and Flow Soldering are not provided in the source text.)

2410311334_Samsung-Electro-Mechanics-CIM10F600NC_C19731910.pdf

Automatic Mounting Compatible Chip Beads Samsung Electro-Mechanics CIM10F600NC for High Frequency EMI Images

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