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Automatic Mounting Compatible Chip Bead Samsung Electro-Mechanics CIM05J121NC for Electronic Devices

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Automatic Mounting Compatible Chip Bead Samsung Electro-Mechanics CIM05J121NC for Electronic Devices

Description : Ferrite Beads and Chips RoHS

Mfr. Part # : CIM05J121NC

Model Number : CIM05J121NC

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Product Overview

The CIB/CIM05 Series (1005/EIA 0402) chip beads are designed for EMI suppression in high-frequency applications. These monolithic inorganic material construction components offer high reliability and excellent solderability for both flow and reflow soldering. Their closed magnetic circuit configuration prevents crosstalk, making them suitable for high-density PCBs. The perfect shape for automatic mounting ensures no directionality. Applications include computers, printers, VCRs, TVs, and mobile phones.

Product Attributes

Series: CIB/CIM05
Type: Chip Bead
Construction: Monolithic inorganic material
Magnetic Circuit: Closed
Mounting: Suitable for automatic mounting
Solderability: Excellent
Heat Resistance: High

Technical Specifications

Part No.	Thickness (mm)	Impedance () 25% @ 100MHz	DC Resistance () Max.	Rated Current (mA) Max.
CIB05J100	0.5 0.05	10	0.05	1200
CIM05U100	0.5 0.05	10	0.05	1200
CIM05U300	0.5 0.05	30	0.10	700
CIM05U600	0.5 0.05	60	0.15	600
CIM05U800	0.5 0.05	80	0.20	600
CIM05U121	0.5 0.05	120	0.25	600
CIM05U221	0.5 0.05	220	0.35	500
CIM05U241	0.5 0.05	240	0.35	400
CIM05U301	0.5 0.05	300	0.45	400
CIM05U471	0.5 0.05	470	0.55	300
CIM05U601	0.5 0.05	600	0.60	300
CIM05U102	0.5 0.05	1000	0.80	300
CIM05J300	0.5 0.05	30	0.20	700
CIM05J600	0.5 0.05	60	0.20	650
CIM05J800	0.5 0.05	80	0.25	600
CIM05J121	0.5 0.05	120	0.25	500
CIM05J221	0.5 0.05	220	0.35	400
CIM05J241	0.5 0.05	240	0.35	400
CIM05J301	0.5 0.05	300	0.45	400
CIM05J471	0.5 0.05	470	0.55	300
CIM05J601	0.5 0.05	600	0.60	300
CIM05J102	0.5 0.05	1000	0.80	250
CIM05J152	0.5 0.05	1500	1.00	250
CIM05J182	0.5 0.05	1800	1.40	200
CIM05N750	0.5 0.05	75	0.35	300
CIM05N121	0.5 0.05	120	0.55	300
CIM05N221	0.5 0.05	220	0.80	200
CIM05F050	0.5 0.05	5	0.08	500
CIM05F100	0.5 0.05	10	0.10	300
CIM05F220	0.5 0.05	22	0.20	300
CIM05F470	0.5 0.05	47	0.35	300
CIM05F750	0.5 0.05	75	0.40	300
CIM05F121	0.5 0.05	120	0.55	300
CIM05F221	0.5 0.05	220	0.80	200
CIM05H800	0.5 0.05	80	0.20	450
CIM05H121	0.5 0.05	120	0.25	400
CIM05H601	0.5 0.05	600	0.80	200

Packaging

Packaging Style	Quantity (pcs/reel)
Card Board Taping	10,000

Recommended Soldering Conditions

Reflow Soldering

Dimension [mm]	L	W	t	d
05	1.0 0.05	0.5 0.05	0.5 0.05	0.25 0.1

Recommended Land Pattern:

	0.40~0.50mm	0.40~0.50mm	0.45~0.55mm	0.45~0.55mm

Flow Soldering

Dimension [mm]	L	W	t	d
05	1.0 0.05	0.5 0.05	0.5 0.05	0.25 0.1

Recommended Land Pattern:

	0.40~0.50mm	0.40~0.50mm	0.45~0.55mm	0.45~0.55mm

2411011116_Samsung-Electro-Mechanics-CIM05J121NC_C20521934.pdf

Automatic Mounting Compatible Chip Bead Samsung Electro-Mechanics CIM05J121NC for Electronic Devices Images

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