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High Frequency EMI Suppression Chip Bead Samsung Electro-Mechanics CIM05J182NC 1005 EIA 0402 for PCB

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High Frequency EMI Suppression Chip Bead Samsung Electro-Mechanics CIM05J182NC 1005 EIA 0402 for PCB

Description : Ferrite Beads and Chips RoHS

Mfr. Part # : CIM05J182NC

Model Number : CIM05J182NC

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Product Overview

The CIB/CIM05 Series (1005/EIA 0402) chip beads are designed for high-frequency EMI suppression. Featuring a monolithic inorganic material construction for high reliability and a closed magnetic circuit configuration to prevent crosstalk, these components are ideal for high-density PCBs. Their perfect shape ensures automatic mounting without directionality, and they offer excellent solderability and high heat resistance suitable for both flow and reflow soldering. Applications include EMI prevention in computers, printers, VCRs, TVs, and mobile phones.

Product Attributes

Type: Chip Bead
Series: CIB/CIM05
Standard Size: 1005/EIA 0402
Construction: Monolithic inorganic material
Magnetic Circuit: Closed

Technical Specifications

Part No.	Thickness (mm)	Impedance () 25% @ 100MHz	DC Resistance () Max.	Rated Current (mA) Max.
CIB05J100	0.5 0.05	10	0.05	1200
CIM05U100	0.5 0.05	10	0.05	1200
CIM05U300	0.5 0.05	30	0.10	700
CIM05U600	0.5 0.05	60	0.15	600
CIM05U800	0.5 0.05	80	0.20	600
CIM05U121	0.5 0.05	120	0.25	600
CIM05U221	0.5 0.05	220	0.35	500
CIM05U241	0.5 0.05	240	0.35	400
CIM05U301	0.5 0.05	300	0.45	400
CIM05U471	0.5 0.05	470	0.55	300
CIM05U601	0.5 0.05	600	0.60	300
CIM05U102	0.5 0.05	1000	0.80	300
CIM05J300	0.5 0.05	30	0.20	700
CIM05J600	0.5 0.05	60	0.20	650
CIM05J800	0.5 0.05	80	0.25	600
CIM05J121	0.5 0.05	120	0.25	500
CIM05J221	0.5 0.05	220	0.35	400
CIM05J241	0.5 0.05	240	0.35	400
CIM05J301	0.5 0.05	300	0.45	400
CIM05J471	0.5 0.05	470	0.55	300
CIM05J601	0.5 0.05	600	0.60	300
CIM05J102	0.5 0.05	1000	0.80	250
CIM05J152	0.5 0.05	1500	1.00	250
CIM05J182	0.5 0.05	1800	1.40	200
CIM05N750	0.5 0.05	75	0.35	300
CIM05N121	0.5 0.05	120	0.55	300
CIM05N221	0.5 0.05	220	0.80	200
CIM05F050	0.5 0.05	5	0.08	500
CIM05F100	0.5 0.05	10	0.10	300
CIM05F220	0.5 0.05	22	0.20	300
CIM05F470	0.5 0.05	47	0.35	300
CIM05F750	0.5 0.05	75	0.40	300
CIM05F121	0.5 0.05	120	0.55	300
CIM05F221	0.5 0.05	220	0.80	200
CIM05H800	0.5 0.05	80	0.20	450
CIM05H121	0.5 0.05	120	0.25	400
CIM05H601	0.5 0.05	600	0.80	200

DIMENSION (mm)
Type	L	W	t
Chip Bead	1.0 0.05	0.5 0.05	0.5 0.05

RECOMMENDED LAND PATTERN (mm)
	0.40~0.50	0.45~0.55
	0.40~0.50	0.45~0.55

PRODUCT IDENTIFICATION	(1)	(2)	(3)	(4)	(5)	(6)	(7)
CIM05U121N C	Chip Beads	M: Multi-layer type B: Mono-layer type	Dimension	Material Code	Nominal impedance (100:10, 121:120)	Thickness option (N:Standard, A:Thinner than standard, B:Thicker than standard)	Packaging (C:paper tape, E:embossed tape)

PACKAGING	Packaging Style	Quantity (pcs/reel)
Card Board Taping		10,000

RECOMMENDED SOLDERING CONDITION	REFLOW SOLDERING	FLOW SOLDERING

2411051545_Samsung-Electro-Mechanics-CIM05J182NC_C20546003.pdf

High Frequency EMI Suppression Chip Bead Samsung Electro-Mechanics CIM05J182NC 1005 EIA 0402 for PCB Images

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