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High Reliability Chip Bead Samsung Electro-Mechanics CIM05N750NC with Closed Magnetic Circuit Design

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High Reliability Chip Bead Samsung Electro-Mechanics CIM05N750NC with Closed Magnetic Circuit Design

Description : Ferrite Beads and Chips RoHS

Mfr. Part # : CIM05N750NC

Model Number : CIM05N750NC

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Product Overview

The CIB/CIM05 Series (1005/EIA 0402) chip beads are designed for high-frequency EMI suppression. Featuring a monolithic inorganic material construction for high reliability and a closed magnetic circuit configuration to prevent crosstalk, these components are suitable for high-density PCBs. Their perfect shape for automatic mounting offers no directionality, coupled with excellent solderability and high heat resistance for flow or reflow soldering. Ideal for EMI prevention in computers, printers, VCRs, TVs, and mobile phones.

Product Attributes

Type: Chip Bead
Series: CIB/CIM05 Series (1005/EIA 0402)
Construction: Monolithic inorganic material
Magnetic Circuit: Closed
Mounting: Suitable for automatic mounting, no directionality
Solderability: Excellent
Heat Resistance: High (for flow or reflow soldering)

Technical Specifications

Part No.	Thickness (mm)	Impedance () 25% @ 100MHz	DC Resistance () Max.	Rated Current (mA) Max.
CIB05J100	0.5 0.05	10	0.05	1200
CIM05U100	0.5 0.05	10	0.05	1200
CIM05U300	0.5 0.05	30	0.10	700
CIM05U600	0.5 0.05	60	0.15	600
CIM05U800	0.5 0.05	80	0.20	600
CIM05U121	0.5 0.05	120	0.25	600
CIM05U221	0.5 0.05	220	0.35	500
CIM05U241	0.5 0.05	240	0.35	400
CIM05U301	0.5 0.05	300	0.45	400
CIM05U471	0.5 0.05	470	0.55	300
CIM05U601	0.5 0.05	600	0.60	300
CIM05U102	0.5 0.05	1000	0.80	300
CIM05J300	0.5 0.05	30	0.20	700
CIM05J600	0.5 0.05	60	0.20	650
CIM05J800	0.5 0.05	80	0.25	600
CIM05J121	0.5 0.05	120	0.25	500
CIM05J221	0.5 0.05	220	0.35	400
CIM05J241	0.5 0.05	240	0.35	400
CIM05J301	0.5 0.05	300	0.45	400
CIM05J471	0.5 0.05	470	0.55	300
CIM05J601	0.5 0.05	600	0.60	300
CIM05J102	0.5 0.05	1000	0.80	250
CIM05J152	0.5 0.05	1500	1.00	250
CIM05J182	0.5 0.05	1800	1.40	200
CIM05N750	0.5 0.05	75	0.35	300
CIM05N121	0.5 0.05	120	0.55	300
CIM05N221	0.5 0.05	220	0.80	200
CIM05F050	0.5 0.05	5	0.08	500
CIM05F100	0.5 0.05	10	0.10	300
CIM05F220	0.5 0.05	22	0.20	300
CIM05F470	0.5 0.05	47	0.35	300
CIM05F750	0.5 0.05	75	0.40	300
CIM05F121	0.5 0.05	120	0.55	300
CIM05F221	0.5 0.05	220	0.80	200
CIM05H800	0.5 0.05	80	0.20	450
CIM05H121	0.5 0.05	120	0.25	400
CIM05H601	0.5 0.05	600	0.80	200

Packaging

Packaging Style	Quantity (pcs/reel)
Card Board Taping	10,000

Recommended Soldering Conditions

REFLOW SOLDERING

Dimensions:

Type	Dimension [mm]	L	W	t	d
Chip Bead	05	1.0 0.05	0.5 0.05	0.5 0.05	0.25 0.1

Recommended Land Pattern:

Dimension [mm]	L	W
0.40~0.50	0.40~0.50	0.45~0.55
0.45~0.55

FLOW SOLDERING

Dimensions:

Type	Dimension [mm]	L	W	t	d
Chip Bead	05	1.0 0.05	0.5 0.05	0.5 0.05	0.25 0.1

Recommended Land Pattern:

Dimension [mm]	L	W
0.40~0.50	0.40~0.50	0.45~0.55
0.45~0.55

Product Identification

Part Number Structure: CIM05U121NC

(1) Type: Chip Beads
(2) Construction: M: Multi-layer type, B: Mono-layer type
(3) Dimension: 05
(4) Material Code
(5) Nominal impedance (e.g., 100: 10, 121: 120)
(6) Thickness option: N: Standard, A: Thinner than standard, B: Thicker than standard
(7) Packaging: C: paper tape, E: embossed tape

2411041613_Samsung-Electro-Mechanics-CIM05N750NC_C19747889.pdf

High Reliability Chip Bead Samsung Electro-Mechanics CIM05N750NC with Closed Magnetic Circuit Design Images

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