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Chip Bead Component Samsung Electro-Mechanics CIM05J600NC for EMI Suppression in Electronic Devices

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Chip Bead Component Samsung Electro-Mechanics CIM05J600NC for EMI Suppression in Electronic Devices

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Description : Ferrite Beads and Chips RoHS

Mfr. Part # : CIM05J600NC

Model Number : CIM05J600NC

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Product Overview

The CIB/CIM05 Series (1005/EIA 0402) chip beads are designed for EMI suppression in electronic devices. Featuring a monolithic inorganic material construction for high reliability and a closed magnetic circuit configuration to prevent crosstalk, these components are ideal for high-density PCBs. Their perfect shape ensures suitability for automatic mounting without directionality, and they offer excellent solderability and high heat resistance for both flow and reflow soldering. Applications include computers, printers, VCRs, TVs, and mobile phones.

Product Attributes

  • Series: CIB/CIM05
  • Type: Chip Bead
  • Construction: Monolithic inorganic material
  • Magnetic Circuit: Closed
  • Mounting: Suitable for automatic mounting, no directionality
  • Solderability: Excellent
  • Heat Resistance: High, suitable for flow or reflow soldering

Technical Specifications

Part No. Thickness (mm) Impedance () 25% @ 100MHz DC Resistance () Max. Rated Current (mA) Max. Dimension (mm) L Dimension (mm) W Dimension (mm) t Dimension (mm) d
CIB05J100 0.5 0.05 10 0.05 1200 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05U100 0.5 0.05 10 0.05 1200 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05U300 0.5 0.05 30 0.10 700 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05U600 0.5 0.05 60 0.15 600 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05U800 0.5 0.05 80 0.20 600 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05U121 0.5 0.05 120 0.25 600 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05U221 0.5 0.05 220 0.35 500 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05U241 0.5 0.05 240 0.35 400 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05U301 0.5 0.05 300 0.45 400 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05U471 0.5 0.05 470 0.55 300 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05U601 0.5 0.05 600 0.60 300 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05U102 0.5 0.05 1000 0.80 300 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05J300 0.5 0.05 30 0.20 700 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05J600 0.5 0.05 60 0.20 650 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05J800 0.5 0.05 80 0.25 600 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05J121 0.5 0.05 120 0.25 500 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05J221 0.5 0.05 220 0.35 400 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05J241 0.5 0.05 240 0.35 400 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05J301 0.5 0.05 300 0.45 400 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05J471 0.5 0.05 470 0.55 300 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05J601 0.5 0.05 600 0.60 300 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05J102 0.5 0.05 1000 0.80 250 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05J152 0.5 0.05 1500 1.00 250 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05J182 0.5 0.05 1800 1.40 200 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05N750 0.5 0.05 75 0.35 300 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05N121 0.5 0.05 120 0.55 300 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05N221 0.5 0.05 220 0.80 200 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05F050 0.5 0.05 5 0.08 500 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05F100 0.5 0.05 10 0.10 300 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05F220 0.5 0.05 22 0.20 300 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05F470 0.5 0.05 47 0.35 300 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05F750 0.5 0.05 75 0.40 300 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05F121 0.5 0.05 120 0.55 300 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05F221 0.5 0.05 220 0.80 200 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05H800 0.5 0.05 80 0.20 450 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05H121 0.5 0.05 120 0.25 400 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1
CIM05H601 0.5 0.05 600 0.80 200 1.0 0.05 0.5 0.05 0.5 0.05 0.25 0.1

Packaging

Packaging Style Quantity (pcs/reel)
Card Board Taping 10,000

Recommended Soldering Conditions

Reflow Soldering

0.40~0.50mm (Pad Width) x 0.45~0.55mm (Pad Length)

Flow Soldering

0.40~0.50mm (Pad Width) x 0.45~0.55mm (Pad Length)

Product Identification

CIM05U121NC (Example: (1) Chip Beads (2) M: Multi-layer type, B: Mono-layer type (3) Dimension (4) Material Code (5) Nominal impedance (100:10, 121:120) (6) Thickness option (N: Standard, A: Thinner than standard, B: Thicker than standard) (7) Packaging (C: paper tape, E: embossed tape)


2411041613_Samsung-Electro-Mechanics-CIM05J600NC_C19750243.pdf


Quality Chip Bead Component Samsung Electro-Mechanics CIM05J600NC for EMI Suppression in Electronic Devices for sale

Chip Bead Component Samsung Electro-Mechanics CIM05J600NC for EMI Suppression in Electronic Devices Images

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