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High Reliability Chip Bead Samsung Electro-Mechanics CIM21J121NE with Closed Magnetic Circuit Design

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High Reliability Chip Bead Samsung Electro-Mechanics CIM21J121NE with Closed Magnetic Circuit Design

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Description : Ferrite Beads and Chips RoHS

Mfr. Part # : CIM21J121NE

Model Number : CIM21J121NE

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Product Overview

This product line offers chip beads designed for EMI suppression, suitable for high-frequency applications in computers, printers, VCRs, TVs, and mobile phones. Key advantages include a perfect shape for automatic mounting with no directionality, excellent solderability, high heat resistance for both flow and reflow soldering, monolithic inorganic material construction for high reliability, and a closed magnetic circuit configuration that avoids crosstalk and is ideal for high-density PCBs.

Product Attributes

  • Type: Chip Bead
  • Series: CIB/CIM21 Series (2012/ EIA 0805)
  • Construction: Monolithic inorganic material
  • Magnetic Circuit: Closed magnetic circuit configuration

Technical Specifications

Part No. Thickness (mm) Impedance () 25% @ 100MHz DC Resistance () Max. Rated Current (mA) Max.
CIB21P110 0.9 0.2 11 0.01 2000
CIB21P150 0.9 0.2 15 0.01 2000
CIB21P260 0.9 0.2 26 0.01 2000
CIB21P300 0.9 0.2 30 0.05 2000
CIB21P330 0.9 0.2 33 0.05 1500
CIB21P470 0.9 0.2 47 0.05 1500
CIM21U600 0.9 0.2 60 0.08 900
CIM21U800 0.9 0.2 80 0.10 900
CIM21U101 0.9 0.2 100 0.10 800
CIM21U121 0.9 0.2 120 0.10 800
CIM21U151 0.9 0.2 150 0.15 600
CIM21U241 0.9 0.2 240 0.15 600
CIM21U301 0.9 0.2 300 0.15 500
CIM21U471 0.9 0.2 470 0.30 500
CIM21U601 0.9 0.2 600 0.30 500
CIM21U102 0.9 0.2 1000 (at 70MHz) 0.40 500
CIM21U202 0.9 0.2 2000 (at 70MHz) 0.70 300
CIB21J260 0.9 0.2 26 0.05 2000
CIB21J300 0.9 0.2 30 0.05 2000
CIB21J400 0.9 0.2 40 0.05 2000
CIM21J600 0.9 0.2 60 0.08 900
CIM21J800 0.9 0.2 80 0.08 1000
CIM21J121 0.9 0.2 120 0.15 800
CIM21J151 0.9 0.2 150 0.15 500
CIM21J221 0.9 0.2 220 0.20 500
CIM21J241 0.9 0.2 240 0.20 500
CIM21J301 0.9 0.2 300 0.20 500
CIM21J471 0.9 0.2 470 0.25 500
CIM21J601 0.9 0.2 600 0.25 500
CIM21J751 0.9 0.2 750 0.35 400
CIM21J102 0.9 0.2 1000 0.35 500
CIM21J152 0.9 0.2 1500 (at 70MHz) 0.45 500
CIM21J182 0.9 0.2 1800 (at 70MHz) 0.45 500
CIM21J202 0.9 0.2 2000 (at 70MHz) 0.50 500
CIM21J222 0.9 0.2 2200 (at 70MHz) 0.70 300
CIM21J252 0.9 0.2 2500 (at 50MHz) 0.70 300
CIM21K152 0.9 0.2 1500 0.45 300
CIM21K252 0.9 0.2 2500 0.80 250
CIM21N560 0.9 0.2 56 0.20 600
CIM21N700 0.9 0.2 70 0.20 600
CIM21N121 0.9 0.2 120 0.25 500
CIM21N241 0.9 0.2 240 0.30 400
Dimension [mm] L W t d
21 2.0 0.2 1.25 0.2 0.9 0.2 0.5 +0.2 -0.3
Recommended Land Pattern
Minimum 0.8~1.2mm
0.9~1.6mm
0.6~1.2mm
0.6~1.2mm
Product Identification Description
(1) Chip Beads
(2) M: Multi-layer type, B: Mono-layer type
(3) Dimension
(4) Material Code
(5) Nominal impedance (800:80, 121:120)
(6) Thickness option (N:Standard, A:Thinner than standard, B:Thicker than standard)
(7) Packaging (C: paper tape, E: embossed tape)
Packaging Style Quantity (pcs/reel)
Embossed Taping 4,000
Recommended Soldering Condition
Reflow Soldering
Flow Soldering

2411041556_Samsung-Electro-Mechanics-CIM21J121NE_C19758061.pdf


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