Product Overview
The CBB21/MPP series metallized polypropylene film capacitors are designed for electronic equipment applications, featuring an epoxy-encapsulated, non-inductive winding structure. These capacitors are suitable for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. They offer excellent self-healing properties, low loss, and low internal temperature rise, with a flame-retardant epoxy resin powder coating.
Product Attributes
- Brand: Chengxi Electronics ()
- Model Series: CBB21/MPP
- Construction: Non-inductive winding, metallized polypropylene film, epoxy encapsulated
- Lead Material: Tinned copper wire or tinned copper-clad steel wire
- Encapsulation: Flame-retardant epoxy resin powder coating (UL94V-0)
- Environmental Compliance: RoHS, REACH, Halogen-free (optional)
Technical Specifications
| Part Number | Capacitance (uF) | Tolerance (%) | Rated Voltage (VDC) | Dissipation Factor (DF) @ 1kHz, 20C (%) | Dimensions (mm) L x W x T (1.0) | Pitch (P 1.0) | Lead Diameter (d 0.05) |
| MPP104J2JC050C3T0ZR | 0.1 | 5% | 630 | 0.1 | 11.7 x 9.4 x 5.1 | 10.0 | 3.2 | 0.6 |
General Electrical Characteristics
| Parameter | Specification | Test Conditions |
| Climate Category | 40/105/21 | - |
| Operating Temperature Range | -40C to +105C | (Voltage derating factor 1.25%/C for +85C to +105C) |
| Rated Temperature | 85C | - |
| Capacitance Range | 0.001F to 6.8F | - |
| Capacitance Tolerance | 5% (J), 10% (K) | - |
| Rated Voltage (VDC) | 100, 160, 250, 400, 630, 1000, 1250, 1600, 2000 | - |
| Dissipation Factor (DF) | 0.0010 | 1kHz, 20C |
| Insulation Resistance | 30,000 M for C 0.33F
10000 M*F for C > 0.33F | 100VDC, 60 seconds |
| Withstand Voltage | 1.6 UR(VDC) | 5 seconds |
Maximum Pulse Rise Rate (dV/dt)
If actual working voltage (U) is lower than rated voltage (UR), the capacitor can operate at a higher dV/dt. The allowed dV/dt value should be multiplied by UR/U.
| dV/dt (V/s) | UR (VDC) | P=7.5mm | P=10.0mm | P=15.0mm | P=22.5mm | P=27.5mm |
| 100/160 | 130 | 110 | 100 | 70 | 50 |
| 250 | 240 | 220 | 200 | 120 | 100 |
| 400 | 450 | 350 | 300 | 180 | 150 |
| 630 | 550 | 420 | 400 | 250 | 180 |
| 1000/1250 | 2300 | 1950 | 975 | 600 | 300 |
| 1600 | / | 6000 | 4500 | 2400 | / |
| 2000 | / | / | 8000 | 4500 | / |
Product Structure and Main Materials
| No. | Main Material | Description | Remarks |
| 1 | Metallized Polypropylene Film | MPPZAH | -/- |
| 2 | Sprayed Tin Layer | Zinc-tin alloy wire | -/- |
| 3 | Leads | Tinned copper-clad steel wire | -/- |
| 4 | Outer Encapsulation Material | Epoxy resin powder | Flame retardant UL94V-0 |
| 5 | Inner Protective Coating Material | Epoxy resin | - |
Note: All raw materials and finished products comply with RoHS environmental requirements.
Packaging Specifications
| Item | Dimensions (L*W*H) |
| Inner Box | 34.5*23.5*24.5 cm |
| Outer Box | 49*36*27 cm |
Packaging Details:
- Carton packaging includes: Manufacturer Part Number, number of packages and quantity per package, Lot No.
- Capacitors are packed in transparent PVC bags for moisture and dust protection.
- RoHS environmental mark.
- Other customer marking requirements.
Storage Conditions
- Prolonged exposure to air may degrade lead solderability.
- Avoid high temperature and high humidity environments.
- Storage Conditions: Temperature: Max 35C, Relative Humidity: Max 80% (in original packaging).
- Storage Time: Maximum 12 months (based on production date marked on the packaging bag).
Environmental Characteristics
- Compliant with RoHS requirements.
- Compliant with REACH requirements.
- Compliant with Halogen-free requirements (if specified).
Product Electrical Characteristics and Test Conditions
General Test Conditions: Ambient temperature: 15C35C, Relative humidity: 25%75%. For dispute resolution: Ambient temperature: 202C, Relative humidity: 60%70%.
| No. | Item | Characteristic | Test Method |
| 1 | Terminal Strength | Tensile Strength | No visible mechanical damage. Lead diameter: 0.6 & 0.8mm. Load: 10N, Time: 10 seconds. |
| | Bending Strength | Lead diameter: 0.6 & 0.8mm. Force: 5N, 90 x 2 times. |
| 2 | Solderability | Tinning rate of leads 95% | Flux temperature: 2455C. Immersion time: 2.50.5 seconds. |
| 3 | Soldering Heat Resistance | Appearance | No visible damage. Soldering temperature: 2605C. Immersion time: 101 seconds. Recovery time: 1-2 hours. |
| | Increase in DF | 0.004 (C 1.0F, 10kHz) or 0.004 (C > 1.0F, 1kHz) |
| | Capacitance Change | C/C 3% |
| 4 | Temperature Rapid Change | Appearance | No visible damage. Cycles: 5 times between -40C and +105C, 30 min each. |
| Vibration | Appearance | Amplitude 0.75mm or acceleration 98m/s (whichever is smaller), frequency 10-500Hz, 3 directions for 2h each (total 6h). |
| Impact | Appearance | 4000 times, acceleration 390m/s, pulse duration 6ms. |
| Final Measurement | Appearance | No visible damage. |
| | Capacitance Change | C/C 5% |
| | Increase in DF | 0.004 |
| Insulation Resistance | IR/IR 50% | - |
| 5 | Climatic Sequence | Appearance | No visible damage. Includes: Dry Heat (+105C, 16h), Cyclic Damp Heat (Test Db, 1st cycle), Cold (-40C, 2h), Low Pressure (8.5kPa, 1h), Cyclic Damp Heat (Test Db, remaining cycles). |
| Final Measurement | Appearance | No visible damage. |
| | Capacitance Change | C/C 5% |
| | Increase in DF | 0.005 |
| Insulation Resistance | IR/IR 50% | - |
| 6 | Damp Heat (Steady State) | Appearance | No visible damage. Relative Humidity: 90-95%RH, Temperature: 402C, Duration: 21 days. Recovery time: 1-2 hours. |
| | Capacitance Change | C/C 5% |
| | Increase in DF | 0.002 (C 1.0F, 10kHz) or 0.004 (C > 1.0F, 1kHz) |
| Insulation Resistance | IR/IR 50% | - |
| 7 | Endurance | Appearance | No visible damage. Test: 1000 hours at 85C with 1.25UR applied voltage. |
| | Capacitance Change | C/C 8% |
| | Increase in DF | 0.004 |
| Insulation Resistance | IR/IR 50% | - |
| 8 | Charge/Discharge | Capacitance Change | C/C 5%. Cycles: 10,000. Charging time: 0.5s. Discharging time: 0.5s. Charging voltage: UR. Charging resistance: 220/CR (). Discharging resistance: 10/CR or 20 (whichever is larger). CR: Rated capacitance (uF). |
| | Increase in DF | 0.005 (10KHz, CR 1.0uF) or 0.005 (1KHz, CR > 1.0uF) |
| Insulation Resistance | IR/IR 50% | - |
Usage Rules
- Operating Range: Do not exceed the upper limit category temperature. Avoid overload. Do not exceed maximum pulse current.
- Handling Precautions: Avoid repeatedly squeezing the base of the leads. Be cautious of the lead tips.
- Soldering: Solder heat transmitted through leads can affect the capacitor core. Avoid high temperatures and prolonged soldering times.
- Soldering Temperature Guidelines:
- Wave Soldering (MPP Polypropylene Film Capacitors): TP 110C for 120 seconds; Ts 120C for 45 seconds. For P 7.5mm, T 4mm: Wave soldering time < 4 seconds.
- Soldering Iron: Tip temperature not exceeding 350C, time not exceeding 3 seconds.
- Lead-type film capacitors are not suitable for reflow soldering.
- Definitions: Ts: Maximum temperature the capacitor body can withstand during preheating. Tp: Maximum temperature the capacitor body can withstand during the preheating stage.
Maximum Effective Voltage vs. Frequency Curve
Note: Curve values are typical, tested under sinusoidal voltage, ambient temperature 85C, and internal temperature rise T = 10C.
Product Electrical Characteristic Diagrams
(Diagrams not provided in the text.)
2512031620_DGCX-MPP104J2JC050C3T0ZR_C53070543.pdf
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Epoxy encapsulated capacitor DGCX MPP104J2JC050C3T0ZR for coupling decoupling and bypassing circuits Images
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