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Epoxy Encapsulated Non Inductive Capacitor DGCX MPP564J2GD080B200ZR Metalized Polypropylene Film Type

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Epoxy Encapsulated Non Inductive Capacitor DGCX MPP564J2GD080B200ZR Metalized Polypropylene Film Type

Description : Through Hole,P=15mm Film Capacitors RoHS

Mfr. Part # : MPP564J2GD080B200ZR

Model Number : MPP564J2GD080B200ZR

Package : Through Hole,P=15mm

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Product Overview

The CBB22/MPP series metalized polypropylene film capacitor is an epoxy-encapsulated, non-inductive wound type, designed for various electronic applications. Featuring a self-healing capability due to its metalized polypropylene film construction, it offers low loss and minimal internal temperature rise. The capacitor is encapsulated with flame-retardant epoxy resin powder, making it suitable for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. It adheres to RoHS and REACH environmental standards.

Product Attributes

Brand: DGCX (Company Trademark)
Product Type: CBB22/MPP Metalized Polypropylene Film Capacitor (Impregnated Type)
Construction: Non-inductive winding, epoxy encapsulation
Lead Material: Tinned copper-clad steel wire
Encapsulation Material: Flame-retardant epoxy resin powder (UL94V-0)
Environmental Compliance: RoHS, REACH, Halogen-free (if required)
Origin: Dongguan, Guangdong, China

Technical Specifications

Product Code	Capacitance (uF)	Tolerance (%)	Rated Voltage (V.dc)	Dissipation Factor (DF) (1KHz) (%)	Dimensions (mm) (WHT)	Pitch (P) (mm)	Lead Diameter (d) (mm)
MPP564J2GD080B200ZR	0.56	5%	400	0.1	17.012.57.5	15.0	0.8

General Electrical Characteristics

Parameter	Specification	Test Method/Condition
Climate Category	40/105/21
Operating Temperature Range	-40 to +105	(Voltage derating factor 1.25%/ for +85 to +105)
Rated Temperature	85
Capacitance Range	0.001F to 6.8F
Capacitance Tolerance	5% (K), 10% (K)
Rated Voltage	100Vdc, 160Vdc, 250Vdc, 400Vdc, 630Vdc, 1000Vdc, 1250Vdc, 1600Vdc, 2000Vdc
Dissipation Factor (DF)	0.0010	(1kHz, 20)
Insulation Resistance	30,000 M for C 0.33uF	(100VDC, 60 seconds)
Insulation Resistance	10,000 M*uF for C > 0.33uF	(100VDC, 60 seconds)
Withstand Voltage	1.6 UR (VDC)	5 seconds

Product Structure and Main Materials

No.	Main Material	Description	Remarks
1	Metalized Polypropylene Film	MPPZAH	-/-
2	Sprayed Tin Layer	Zinc-tin alloy wire	-/-
3	Leads	Tinned copper-clad steel wire	-/-
4	Outer Encapsulation Material	Epoxy resin powder	Flame-retardant UL94V-0
5	Inner Protective Material	Epoxy resin

Note: All raw materials and finished products comply with RoHS environmental requirements.

Marking Description (Example)

DGCX (Company Trademark), MPP (Product Model or Code), 105J (Rated Capacitance and Tolerance), 250V (Rated Voltage V.dc)

Packaging Specifications

Inner Box Dimensions: L*W*H = 34.5*23.5*24.5 cm
Outer Box Dimensions: L*W*H = 49*36*27 cm
Packaging details include: Manufacturer's part number, number of packs and quantity per pack, Lot No.
Capacitors are packaged in transparent PVC bags for moisture and dust protection.
RoHS environmental mark included.
Other customer-specific marking requirements can be accommodated.

Storage Conditions

Prolonged exposure to air may degrade lead solderability.
Avoid high temperature and high humidity environments.
Storage Conditions (in original packaging): Temperature: Max 35, Relative Humidity: Max 80%.
Storage Time: Maximum 12 months (based on production date marked on the packaging bag).

Environmental Characteristics

Compliant with RoHS requirements.
Compliant with REACH requirements.
Compliant with Halogen-free requirements (if specified).

Product Electrical Characteristics and Test Conditions

Tests are conducted under standard atmospheric conditions unless otherwise specified: Ambient Temperature: 1535, Relative Humidity: 25%75%. For disputed test results: Ambient Temperature: 202, Relative Humidity: 60%70%.

No.	Item	Characteristic	Test Method
1	Terminal Strength	Tensile Strength	No visible mechanical damage. Lead wire diameter: 0.6 & 0.8mm. Load: 10N, Time: 10 seconds.
		Bending Strength	Lead wire diameter: 0.6 & 0.8mm. Force: 5N, 90 2 times.
2	Solderability	Lead tinning rate	95%. Flux temperature: 2455. Immersion time: 2.50.5 seconds.
3	Soldering Heat Resistance	Appearance	No visible damage. Solder temperature: 2605. Immersion time: 101 seconds. Recovery time: 1-2 hours.
		Tangent delta increase	0.004 (C1.0F, 10kHz); 0.004 (C>1.0F, 1kHz)
		Capacitance change	C/C 3%
4	Temperature Rapid Change	Appearance	No visible damage. Cycles: A=-40, B=+105, 5 cycles. Duration: t=30min.
		Vibration	No visible damage. Amplitude 0.75mm or acceleration 98m/s (whichever is less), Frequency 10-500Hz. Three directions, mutually perpendicular, 2h per direction, total 6h.
		Shock	No visible damage. 4000 times, acceleration 390m/s, pulse duration: 6ms.
	Final Measurement	Appearance	No visible damage.
		Capacitance change	C/C 5%
		Tangent delta increase	0.004
		Insulation Resistance	IR/IR 50%
5	Climatic Sequence	Appearance	No visible damage. Dry heat +105, 16 hours. Cyclic damp heat Test Db, first cycle. Cold -40, 2 hours. Low pressure 8.5kPa, 1 hour. Cyclic damp heat Test Db, remaining cycles.
		Low Pressure	No permanent breakdown, arcing or harmful deformation of the case.
	Final Measurement	Appearance	No visible damage.
		Capacitance change	C/C 5%
		Tangent delta increase	0.005
		Insulation Resistance	IR/IR 50%
6	Damp Heat (Steady State)	Appearance	No visible damage. Relative Humidity 90-95%RH, Temperature: 402, No load, Duration: 21 days. Recovery time: 1-2 hours.
		Capacitance change	C/C 5%
		Tangent delta increase	0.002 (C1.0F, 10kHz); 0.004 (C>1.0F, 1kHz)
		Insulation Resistance	IR/IR 50%
7	Endurance	Appearance	No visible damage. T=85, 1000 hours. Applied voltage: 1.25UR.
		Capacitance change	C/C 8%
		Tangent delta increase	0.004
		Insulation Resistance	IR/IR 50%
8	Characteristics Dependent on Temperature	Capacitance measurement at points b, d, f.	Static method, capacitor held sequentially at each temperature: a.(202), b.(-403), d.(20 2), f.(1052), g.(202).
		At lower category temperature -40	0 (Cb-Cd)/Cd +3%
		At upper category temperature 105	-4.0% (Cf-Cd)/Cd 0
9	Charge/Discharge	Capacitance change	C/C 5%
		Charge/Discharge Cycles	10,000. Charging time: 0.5s. Discharging time: 0.5s. Charging voltage: Rated voltage UR. Charging resistance: 220/CR (). Discharging resistance: 10/CR or 20 (whichever is greater). CR: Rated capacitance (uF).
		Tangent delta increase	0.005 (10KHz, CR1.0uF); 0.005 (1KHz, CR>1.0uF)
		Insulation Resistance	IR/IR 50%

Usage Rules

Usage Range: Do not exceed the upper category temperature. Avoid overload. Do not exceed maximum pulse current.
Operation Precautions: Avoid repeated squeezing at the lead root. Pay attention to the lead tip.
Soldering: Solder heat can transfer to the capacitor core through lead terminals and encapsulation layers. Be cautious of capacitor electrical characteristic decay or damage caused by high temperature and prolonged soldering.
Soldering Temperature Range:
- Wave Soldering (MPP Polypropylene Film Capacitors): TP 110 for 120 seconds; Ts 120 for 45 seconds. For P 7.5mm, T 4mm, wave soldering time < 4 seconds.
- Soldering Iron: Iron tip temperature not exceeding 350, soldering time not exceeding 3 seconds.
- Lead-film capacitors are not suitable for reflow soldering.
Ts: Maximum temperature the capacitor body can withstand during wave soldering.
Tp: Maximum temperature the capacitor body can withstand during the preheating stage.

Maximum Effective Voltage vs. Frequency Curve

Note: The curve represents typical values tested under sinusoidal voltage, ambient temperature 85, and capacitor internal temperature rise T=10.

Product Electrical Characteristic Diagrams

(Diagrams not provided in source text)

2512241555_DGCX-MPP564J2GD080B200ZR_C53224149.pdf

Epoxy Encapsulated Non Inductive Capacitor DGCX MPP564J2GD080B200ZR Metalized Polypropylene Film Type Images

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