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Polypropylene film capacitor model DGCX MPP824J2GD080C080ZR designed for DC blocking and pulse circuit applications

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Polypropylene film capacitor model DGCX MPP824J2GD080C080ZR designed for DC blocking and pulse circuit applications

Description : Through Hole,P=50mm Film Capacitors RoHS

Mfr. Part # : MPP824J2GD080C080ZR

Model Number : MPP824J2GD080C080ZR

Package : Through Hole,P=50mm

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Product Overview

The CBB21/MPP series metallized polypropylene film capacitors are designed for electronic equipment applications. These capacitors feature a non-inductive winding structure with a tin-plated copper wire or tin-plated copper-clad steel wire lead. Encapsulated with flame-retardant epoxy resin powder, they offer excellent self-healing properties, low loss, and low internal temperature rise. They are widely used for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits.

Product Attributes

Brand: DGCX
Product Type: CBB21/MPP Metallized Polypropylene Film Capacitor (Impregnated Type)
Origin: Heyuan Factory, Guangdong Province, China
Encapsulation Material: Flame-retardant epoxy resin powder (UL94V-0)
Environmental Compliance: RoHS, REACH, Halogen-free (if required)

Technical Specifications

Model/Part Number	Capacitance (uF)	Tolerance (%)	Rated Voltage (V.dc)	Dissipation Factor (DF) (1KHz)	Dimensions (mm) (L x H x T)	Pitch (P)	Lead Diameter (d)
MPP824J2GD080C080ZR	0.82	5%	400	0.1%	17 x 12.0 x 8.0	15.0	0.8

General Electrical Characteristics

Parameter	Specification	Test Condition
Climate Category	40/105/21
Operating Temperature Range	-40 to +105	(Voltage derating of 1.25%/ for +85 to +105)
Rated Temperature	85
Capacitance Range	0.001F to 6.8F
Capacitance Tolerance	5% (J), 10% (K)
Rated Voltage (Vdc)	100, 160, 250, 400, 630, 1000, 1250, 1600, 2000 Vdc
Dissipation Factor (DF)	0.0010	1kHz, 20
Insulation Resistance	30,000 M (for C 0.33uF)	100VDC, 60 sec
Insulation Resistance	10,000 M*uF (for C > 0.33uF)	100VDC, 60 sec
Dielectric Strength	1.6 UR(VDC)	5 sec

Product Structure and Main Materials

No.	Main Material	Description	Remark
1	Metallized Polypropylene Film	MPPZAH	-/ -
2	Sprayed Tin Layer	Zinc-tin alloy wire	-/ -
3	Lead Wire	Tin-plated copper-clad steel wire	-/ -
4	Outer Encapsulation Material	Epoxy resin powder	Flame-retardant UL94V-0
5	Inner Protective Material	Epoxy resin

Packaging Specifications

Item	Dimensions (LWH)
Inner Carton	34.523.524.5 cm
Outer Carton	493627 cm

Storage Conditions

Temperature: Max 35
Relative Humidity: Max 80%
Storage Time: Maximum 12 months (from production date on packaging bag)

Usage Rules

Do not exceed the upper category temperature.
Avoid overload operation.
Do not exceed the maximum pulse current.
Avoid repeated squeezing at the lead wire root.
Be cautious of the lead wire tips.
Soldering:
Wave Soldering: TP 110 for 120 sec; Ts 120 for 45 sec. For P7.5mm, T4mm, soldering time < 4 seconds.
Soldering Iron: Tip temperature not exceeding 350, time not exceeding 3 seconds.
Not suitable for reflow soldering.

2512031620_DGCX-MPP824J2GD080C080ZR_C53070631.pdf

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