| Temperature Coefficient | JIS C 5201 4.8 / IEC60115-1-4.8 | TCR= (R-R0)/(t-t0)R0 106 (ppm) R0: resistance at room temperature, R: resistance at 125 or -55, t0: room temperature, t: test temperature (125 or -55) | As SPEC |
| Short-time overload | JIS C 5201 4.13 / IEC60115-1-4.13 | Applied 2.5 times of rated voltage for 5 seconds. Measure the variation of resistance. | 0.5%, 1%: (1.0%+0.05)
5%: (2.0%+0.05) |
| Solderability | JIS C 5201 4.17 / IEC60115-1-4.17 | Dip the terminal in a flux and then dip into a soldering bath at 2455 for 30.5 sec. | >95% coverage |
| Resist to soldering heat | JIS C 5201 4.18 / IEC 60115-1-4.18 | Dip the terminal in a flux and then dip into a soldering bath at 2605 for 10 0.5 sec. Measure the variation of resistance. | (1.00%0.05) |
| Insulation resistance | JIS C 5201 4.6 / IEC60115-1-4.6 | Applied the dielectric withstanding voltage on the center of body for 605 seconds. Then measure insulation resistance. | >10G |
| Dielectric withstanding voltage | JIS C 5201 4.7 / IEC60115-1-4.7 | Applied the dielectric withstanding voltage on the center of body for 605 seconds. | No evidence of flashover, arcing or insulation breakdown |
| Terminal bending | JIS C 5201 4.33 / IEC60115-1-4.33 | Specimen shall be mounted on test board, then bend the board and maintained for 201s. Bending distance: 5+0.2/0 mm (size 1206) or 2+0.2/0 mm (size > 1206). Measure the variation of resistance. | (1.00%0.05) |
| Rapid temperature changes | JIS C 5201 4.19 / IEC60115-1-4.19 | Put specimen in a chamber: T1: -553; T2: 1553 / 1253, 30 min per cycle, repeated 300 cycles. Measure the variation of resistance. | 0.5%, 1%: (1.0%+0.05)
5%: (2.0%+0.05) |
| Humidity | JIS C 5201 4.24 / IEC60115-1-4.24 | Constant temperature and humidity chamber: 402, 90~95 %RH; apply rated voltage for 1.5 hours, then power off for 0.5 hours; repeat for 1000 +48/-0 hours. Measure the variation of resistance. | As SPEC |
