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Metal Current Sensing Chip Resistors Featuring RVR HIXD25NR003F Suitable for High Power Applications

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Metal Current Sensing Chip Resistors Featuring RVR HIXD25NR003F Suitable for High Power Applications

Resistance : 3mΩ

Power(Watts) : 3W

Type : Alloy Resistor

Tolerance : ±1%

Description : 3mΩ 3W Alloy Resistor ±1% 2512 Chip Resistor - Surface Mount RoHS

Mfr. Part # : HIXD25NR003F

Model Number : HIXD25NR003F

Package : 2512

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Product Overview

This document outlines the Approval Specification for Metal Current Sensing Chip Resistors, Type HI XD 25 N R001 F. These resistors are designed for high-power applications, offering superior mechanical and frequency characteristics. They are suitable for reflow and wave soldering, feature halogen-free epoxy and lead-free plating, and comply with RoHS standards. Key advantages include high power handling up to 3W, low TCR as 50ppm/, and excellent performance in demanding environments.

Product Attributes

  • Brand: Changzhou Pengke Electronics
  • Origin: China
  • Certifications: RoHS compliant
  • Material: Metal Alloy Resistance

Technical Specifications

CategorySeriesDimensions (L x W x T)Rated PowerResistance RangeTCROperating Temperature RangeResistance ToleranceMax. Operating Voltage
2512DD/XD6.40.20 x 3.20.20 x 0.80.20 mm2W/3W0mR 1m: 350ppm/
1m<R 2m: 100ppm/
2m<R 500m: 50 ppm/
-55 ~ +170F: 1%
G: 2%
J: 5%
(P*R)
1206RC3.20.20 x 1.60.20 x 0.70.20 mm (0m R<10m)
3.20.20 x 1.60.20 x 0.450.20 mm (10m<R 200m)
1W0mR 2m: 350ppm/
2m<R 200m: 50 ppm/
-55 ~ +170F: 1%
G: 2%
J: 5%
(P*R)
0805RE2.00.10 x 1.250.10 x 0.50.20 mm0.5W5mR 15m: 50ppm/-55 ~ +170F: 1%
G: 2%
J: 5%
(P*R)

Reliability Tests

ProjectTest MethodSpecifications and Requirements
Temperature coefficient (TCR)Measured at 25(T1, R1) and 125(T2, R2)Refer to TCR specifications for physical features
Short Time Overload5 times rated power, maintain 5sR 1%+0.05m
Insulation resistanceApply 100V15V DC voltage between electrode and substrate, hold for 60 seconds> 100 M
Withstand voltageApply AC voltage of maximum overload voltage between electrode and substrate at approx. 100V/S, maintain 605sNo breakdown or arc
Solderability2455 tin tank, hold 2s0.5sAt least 95% of surface area of electrode shall be covered with new solder
Resistance to Soldering Heat2605 tin tank, hold for 10s1sR (0.5%+0.05m ), no visible damage
Bending testBending distance 2mm, hold time 60s5sR0.5%+0.05m , no mechanical damage
Solvent resistanceIsopropanol (IPA) at 235 for 10 hoursNo obvious damage to appearance
High Temperature Exposure1702, 1000HR (1.0%+0.05m )
Low Temperature Exposure-552, 1000HR (0.5%+0.05m )
Rapid change of Temperature-55 30 minutes ~ normal temperature 5 minutes ~155 30 minutes, 1000 cycles R (0.5%+0.05m )
Load Life702, 1000 hours, rated power, 1.5 hours on / 0.5 hours offR (1.0%+0.05m )
Moisture with Load852, 85%3%RH, 1000 hours, rated power, 1.5 hours on / 0.5 hours offR (1.0%+0.05m)

Packaging and Handling

Tape Packaging Dimensions:

TypeABCDET1T2
08051782.0601.0131.02.00.5>229.01/
12061782.0601.0131.02.00.5>229.00.311.4 1.0
25121782.0601.0131.02.00.5>2213.0 0.315.4 1.0

Reel Dimensions: (Refer to diagram in source document)

Label Information: Size, Quantity, LOT.NO., Manufacturers name.

Packaging Quantity: 0805/1206: 5000pcs/Reel; 2512: 4000pcs/Reel.

Storage Conditions: Temperature 535, Relative Humidity 4575% RH. Avoid direct sunlight, moisture, dust, and harmful gases.

Storage Life: 1 year.

Handling Precautions: Avoid exceeding rated power. Handle with care to prevent damage. Do not touch with soldering tip during manual installation.


2509261615_RVR-HIXD25NR003F_C52015900.pdf


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