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Effective EMI Suppression Chip Ferrite Bead INPAQ MCB1005B152DBP for Electronic Circuit Applications

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Effective EMI Suppression Chip Ferrite Bead INPAQ MCB1005B152DBP for Electronic Circuit Applications

Current Rating : 150mA

Number of Circuits : 1

DC Resistance(DCR) : 1.5Ω

Tolerance : ±25%

Impedance @ Frequency : 1.5kΩ@100MHz

Description : 1.5kΩ@100MHz 1 Line Ferrite Bead 0402 150mA 1.5Ω

Mfr. Part # : MCB1005B152DBP

Model Number : MCB1005B152DBP

Package : 0402

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Product Overview

The INPAQ Global RF/Component Solutions MCB B Series is a Chip Ferrite Bead designed for RF and component applications. These components are manufactured to precise specifications, offering reliable performance in various electronic circuits. The MCB 1005 B Series is particularly suited for applications requiring effective EMI suppression and impedance matching, with a focus on lead-free soldering processes and standard packaging for automated assembly.

Product Attributes

  • Brand: INPAQ Global RF/Component Solutions
  • Series: MCB B Series
  • Product Type: Chip Ferrite Bead
  • Size Code: EIAJ 1005 (EIA 0402)
  • Soldering: Lead-Free (A - Soldering Lead-Free, B - Lead-Free for whole chip)
  • Packaging: Embossed paper tape, 7" reel
  • Operating Temperature Range: -55 to +125
  • Storage Condition: Less than 40 and 70% RH
  • Storage Time: 6 months Max.
  • Soldering Method: Reflow or Wave Soldering

Technical Specifications

Part Number Impedance () 25% Test Frequency (MHz) DCR () Max. Rated Current (mA) Size (mm) L x W x T End Electrode (mm) E
MCB1005B601FB_ 600 100 0.60 300 1.00 0.10 x 0.50 0.10 x 0.50 0.10 0.25 0.10
MCB1005B102EB_ 1000 100 1.00 200
MCB1005B152DB_ 1500 100 1.50 150
Note: For special part numbers not listed, refer to appendix.

Packaging & Reel Specifications

Part Size (EIA Size) Reel Diameter Quantity per Reel (pcs) Quantity per Inner Box
1005 (0402) 7 10,000 5 reels / inner box

Taping Dimensions (Unit: mm)

Size W P E F D Po P2 Ao Bo Ko(T)
1005 8.000.10 2.000.05 1.750.05 3.500.05 1.550.05 4.000.10 2.000.05 0.620.03 1.120.03 0.600.03

Solder Land Information (Unit: mm)

Size A B C
1005 0.4 0.6 1.6 2.6 0.4 0.7

Reliability and Test Conditions

Test Item Test Condition Criteria
Temperature Cycle a. Temp: -40 ~ +85
b. Cycle: 100 cycles
c. Dwell: 30 min
d. Measurement: 24 hrs ambient
a. No mechanical damage
b. Impedance within 20% of initial value
Operational Life a. Temp: 125 5
b. Time: 1000 hrs
c. Current: Full rated current
d. Measurement: 24 hrs ambient
a. No mechanical damage
b. Impedance within 20% of initial value
Biased Humidity a. Temp: 40 2
b. Humidity: 90 ~ 95 % RH
c. Time: 1000 hrs
d. Current: Full rated current
e. Measurement: 24 hrs ambient
a. No mechanical damage
b. Impedance within 20% of initial value
Resistance to Solder Heat a. Solder Temp: 260 5
b. Flux: Rosin
c. DIP time: 10 1 sec
a. >95% terminal electrode covered with new solder
b. No mechanical damage
c. Impedance within 20% of initial value
Adhesive Test a. Reflow Temp: 245
b. Force: 5 N
c. Time: 10 sec
a. No mechanical damage
b. Soldering on PCB after pulling test force > 5 N
Steam Aging Test a. Temp: 93
b. Time: 4 hrs
c. Solder Temp: 235 5
d. Flux: Rosin
e. DIP time: 5 1 sec
>95% terminal electrode covered with new solder
Rated Current Test a. Apply current: Full rated current / 5min Temperature rise < 25

Test Instruments

  • HP4291B RF IMPEDANCE / MATERIAL ANALYZER
  • HP4338A/B MILLIOHMMETER
  • Agilent 8720ES S-PARAMETER NETWORK ANALYZER
  • HP6632B SYSTEM DC POWER SUPPLY

2410121630_INPAQ-MCB1005B152DBP_C964132.pdf


Quality Effective EMI Suppression Chip Ferrite Bead INPAQ MCB1005B152DBP for Electronic Circuit Applications for sale

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