| 1 | Capacitance | Test Frequency: 120Hz10Hz, Test Voltage: 0.5Vrms +1.0V.DC, Test Temperature: 202 | See Table 2 |
| 2 | Dissipation Factor | Test Voltage: 0.5Vrms +1.0V.DC, Test Temperature: 202 | See Table 2 |
| 3 | Equivalent Series Resistance (ESR) | Test Frequency: 100KHz10Hz, Test Voltage: 0.5Vrms +1.0V.DC, Test Temperature: 202 | See Table 2 |
| 4 | Leakage Current | Test Voltage: 100 V, Charging Time: 2min, Test Temperature: 202 | I0.2CVor 300A (Which is greater) |
| 5 | Resistance to Soldering Heat | Warm up time: 1202 seconds, Solder bath temperature: 2605, Solder composition: H60A. H60S or H63A, Immersion depth: 1.5~2.0mm, Immersion duration: 101 seconds | a. No appearance defect. b. Capacitance change within 10%. c. DF smaller than specification. d. ESR smaller than specification. e. Leakage current smaller than specification. |
| 6 | Solder Ability | Solder bath temperature: 2452, Solder composition: H60A. H60S or H63A, Immersion depth: 1.5~2.0mm, Immersion duration: 20.5seconds | Solder alloy shall cover 95% or more of the dipped lead's area. |
| 7 | Damp heat | Temperature: 602, Relative humidity: 90% to 95%, Duration: 2408 hours | a. No electrical or mechanical damage. b. Capacitance change within 20%. c. DF smaller than 150% of specification. d. Leakage current smaller than specification. |
| 8 | Surge Voltage | Test Temp: 15~35 , Apply surge voltage for 30 seconds and discharge for 330 seconds, Repeat 1000 times. | a. CAP change: within 10%. b. DF: Specified value. c. Leakage current: Specified value. d. Appearance: No visible damage. |
| 9 | Vibration | Frequency range: 10 Hz to 55 Hz, Amplitude: 0.75 mm, Total duration: 3 2h (X-Y-Z directions each for 2 hours) | a. Appearance: No visible damage or leakage. b. Capacitance change: within 5% of initial value. |
| 10 | Terminal strength | (A) Tensile strength, (B) Bending strength | Various load conditions based on lead diameter. | a. Capacitor shall withstand specified force without electrical or mechanical damage. b. No mechanical damage like terminal damage. |
| 11 | Load Life | Test Temp: 105 2, Rated Voltage: 100 V, Test Time: 2000 (+72 -0) hours (after 16 hours at room temp) | a. No appearance defect. b. Capacitance change within 20%. c. DF smaller than 200% of specification. d. Leakage current smaller than specification. |
| 12 | Shelf Life | Test Temp: 105 2, Test Time: 1000 (+72 -0) hours (after 16 hours at room temp) | |
| 13 | Maximum Applicable Ripple Current | At 100KHz or 120Hz, 105 2. Peak voltage not to exceed rated D.C voltage. | |
| 14 | Low temperature test | Steps at 202 and minimum operating temperature for 722 hours. | a. CAP change: within 10%. b. DF: Specified value. c. LC: Specified value. d. ESR: Specified value. |
| 15 | Rapid change of temperature | Cycles involving minimum and maximum operating temperatures with 30min dwell times. | a. CAP change: within 20%. b. DF: Specified value. c. LC: Specified value. |
| 16 | Flow soldering test | Preheating 120 <120s, Soldering 260 10s (2 times). | a. If two reflow solders, time should be 10 seconds or less. b. Capacitance change: Within 10% of initial value. c. DF, LC, ESR: Less than or equal to the specified value. |
