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Power inductor DEYAN D0630HP-2R2MT designed for electronic applications requiring stable inductance

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Power inductor DEYAN D0630HP-2R2MT designed for electronic applications requiring stable inductance

Current - Saturation (Isat) : 12A

Description : 12A SMD,7x6mm Fixed Inductors RoHS

Mfr. Part # : D0630HP-2R2MT

Model Number : D0630HP-2R2MT

Package : SMD,7x6mm

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Product Overview

This product is an integrated power inductor manufactured by Shenzhen Deyan Electronics Co., Ltd. It is designed for various electronic applications requiring stable inductance and current handling capabilities.

Product Attributes

Brand: Shenzhen Deyan Electronics Co., Ltd.
Origin: Shenzhen (implied by company name)
Material: Core (Alloy powder), Wire (Copper Wire), Electrode (Cu), Marking Ink
Color: Black (marking ink)

Technical Specifications

Model	Inductance (H)	Saturation Current Max. (A)	Temperature rise current (T40) (A)	D.C.R. (m)	Dimensions (mm) (A x B x C x D x E)	Recommended Land Pattern (mm) (F x G x H)
D0630HP-2R2MT	2.220%	20	14	8.5 (Typ) / 7.0 (Max)	6.60.3 x 7.1 0.3 x 3.0 MAX x 3.0 0.3 x 1.6 0.5	8.4 (Ref) x 3.5 (Ref) x 3.7 (Ref)

General Characteristics

Item	Conditions	Specification
Operation Temperature		-40 + 125 (Including Coil Temperature Rise)
Storage Temperature		-40 + 125
Temperature Coefficient		0 2000 ppm/
Fixing Strength	Sample pushed in three directions of X, Y and Z with force of 5.0N for 105 seconds. After soldering between copper plate and electrodes.	No electrode detachment.
Resistance to Soldering Heat Test	Refer to the spec STD-001NP.	No mechanical breakage. Deviation relative to initial value: L: Within 10%
Solderability Test	Immerse the electrode in flux for 5 seconds. Then dip the electrode into a soldering bath of 2455 for 20.5 seconds.	Over 95% of the surface being immersed shall be covered with new solder uniformly.
Vibration Test	Amplitude: 1.5mm P-P Frequency: 105510Hz (1 minute per cycle) Duration: 1 hour in each of X, Y, Z axis.	Deviation relative to initial value: L: Within 10%
Humidity Test	Temperature: 402 Humidity: 90%95%RH Duration: 964 hours.	Deviation relative to initial value: L: Within 10%
Thermal Shock Test	20 cycles of +105 for 30 minutes, -40 for 30 minutes. Characteristics are measured after the ambient air exposure of 1 hour.	Deviation relative to initial value: L: Within 10%
High Temperature Storage Test	Temperature: 1252 Duration: 964 hours.
Low Temperature Storage Test	Temperature: -403 Duration: 964 hours.

SMT Reflow Profile

Profile Feature	Specification
Lead(Pb) Free solder Preheat and soak temperature Min.(Tsmin)	150
Lead(Pb) Free solder Preheat and soak temperature Max.(Tsmax)	200
Lead(Pb) Free solder Preheat and soak time(Tsmin to Tsmax)(ts)	60-120 Seconds
Average ramp up rate Tsmax to Tp /Second	3
Liquidous temperature (TL)	217 C
Time (TL) maintained above TL	60-150 seconds
Peak package body temperature (Tp)	Table2
Time (tp)* within 5 C of the specified classification temperature (Tc)	30* seconds
Average Ramp-down rate (Tp to TL)	6 C/second max
Time 25 C to peak temperature	8 minutes max.

Pb-Free Process - Classification Temperatures (Tc)	Volume mm <350	Volume mm 350~2000	Volume mm >2000
Package Thickness <1.6 mm	260	260	260
Package Thickness 1.6mm- 2.5mm	260	250	245
Package Thickness >2.5 mm	250	245	245

Packing

Refer to standard packing drawing. 1000PCS/REEL, 8000PCS/BOX.

Notes

Soldering Tin Period of Validity: Six Months. Storage Temperature: 255. Comparatively Humidity: 35%--70%.

2411220031_DEYAN-D0630HP-2R2MT_C41410619.pdf

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