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High Reliability Wire Wound Chip Inductor DMBJ PNLS4030-221M 220UH Featuring Closed Magnetic Circuit

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High Reliability Wire Wound Chip Inductor DMBJ PNLS4030-221M 220UH Featuring Closed Magnetic Circuit

Current - Saturation (Isat) : -

Description : SMD,4x4mm Fixed Inductors RoHS

Mfr. Part # : PNLS4030-221M 220UH

Model Number : PNLS4030-221M 220UH

Package : SMD,4x4mm

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PNLS Series Chip Power Inductor

The PNLS Series Chip Power Inductor is a wire-wound chip inductor designed for high-performance applications. It offers a large saturation current, excellent shock resistance and durability due to metallization on the ferrite core, and reduced leakage flux and EMI thanks to a closed magnetic circuit design. Its low DC resistance minimizes power loss, and the small, slim form factor conserves PCB space. This series is widely used in smart phones, set-top boxes, VR/AR devices, notebooks, desktop computers, servers, gaming devices, navigation systems, and multimedia devices.

Product Attributes

  • Brand: Dongguan Zhenbaojia Electronics Co., Ltd.
  • Product Series: PNLS Series
  • Product Type: Wire Wound Chip Inductor
  • Origin: Dongguan, China

Technical Specifications

TypeExternal Dimensions (LW) (mm)Nominal InductanceInductance ToleranceFig.ABC(max)D(max)E(max)
PNLS2520102.01.6R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.12.50.32.00.351.052.10.85
PNLS2520122.01.6R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.12.50.32.00.351.252.00.85
PNLS30103.03.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.13.00.33.00.351.202.50.85
PNLS30123.03.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.23.00.33.00.351.302.80.90
PNLS30153.03.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.23.00.33.00.351.502.60.90
PNLS40104.04.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.24.00.34.00.351.153.51.30
PNLS40124.04.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.24.00.34.00.351.353.51.30
PNLS40184.04.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.24.00.34.00.351.803.51.30
PNLS40204.04.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.24.00.34.00.352.103.51.30
PNLS40264.04.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.24.00.34.00.352.803.51.30
PNLS40304.04.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.24.00.34.00.353.003.51.30
PNLS50125.05.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.25.00.35.00.351.304.01.50
PNLS50205.05.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.25.00.35.00.352.004.01.50
PNLS50405.05.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.25.00.35.00.354.004.01.50
PNLS50455.05.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.25.00.35.00.354.504.01.50
PNLS60126.06.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.36.00.36.00.351.305.01.65
PNLS60206.06.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.26.00.36.00.352.005.01.65
PNLS60306.06.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.36.00.36.00.353.005.01.85
PNLS60456.06.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.36.00.36.00.354.505.01.65
PNLS60506.06.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.36.00.36.00.355.305.01.65
PNLS60606.06.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.36.00.36.00.356.305.01.65
PNLS80408.08.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.38.00.38.00.354.206.32.45

Operating and Storage Conditions

Operating Temperature Range: -40 to +85

Storage Temperature Range: -10 to +40, 70% RH

Testing and Reliability

Test Conditions: Ambient Temperature: 2015, Relative Humidity: 6520%, Air Pressure: 86 kPa to 106 kPa.

DC Resistance (RDC): Refer to Appendix A. Tested with High Accuracy Milliohmmeter HP4338B or equivalent.

Inductance (|Z|): Refer to Appendix A. Tested with High Accuracy RF Inductance/Material Analyzer Anglient E4991A+HP16192A or equivalent. Test signal: -40dBm or 100mV. Test frequency refers to Item 5.

Quality Factor (Q): Refer to Appendix A. Tested with High Accuracy RF Inductance/Material Analyzer Anglient E4991A+HP16192A or equivalent. Test signal: -40dBm or 100mV. Test frequency refers to Item 5.

Rated Current (Ir): Refer to Appendix A. Tested with HP6632B DC Power Supply and digital surface thermometer or equivalent. Inductance drop L/L100% 30%.

Solderability: 95% min. coverage of all metallized area. Solder temp: 2405, Immersion time: 31 sec. Solder: Sn-3Ag-0.5Cu.

Resistance to Solder Heat: No visible damage. Electrical and mechanical characteristics shall be satisfied. Solder Temp: 2653, Immersion time: 61 sec. Preheating: 100-150 for 1 minute. Measurement after 242 hrs at room temp. Solder: Sn-3Ag-0.5Cu.

Bend: After bending test, no deformation. Inductance within 20%, DC resistance within standard requirements. Test involves bending a test substrate with soldered chip by 2mm for 10s.

Vibration: Appearance: no mechanical damage. Inductance change within 20%. Test Condition: Sine wave, 10-55-10 Hz, Sweep time: 1min, Amplitude: 1.5mm (peak-peak), 3 axes (X,Y,Z), 2 hrs/axis (Total 6 hrs).

Temperature Shock: Appearance: no mechanical damage. Inductance change within 20%. Test Condition: -40 and +85 for 30 mins each, 5 cycles. Measurement after 24 hrs at room temp.

Humidity Resistance: Appearance: no mechanical damage. Inductance change within 20%. Test Condition: 90-95% RH, 602, Rated DC current, 1000 (+48,0) hours. Measurement after 24 hrs at room temp.

High Temperature Resistance: Appearance: no mechanical damage. Inductance change within 20%. Test Condition: +852, Rated DC current, 1000 (+48,0) hours. Measurement after 24 hrs at room temp.

Low Temperature Storage Life: Appearance: no mechanical damage. Inductance change within 20%. Test Condition: -402, 1000 (+48,0) hours. Measurement after 24 hrs at room temp.

Terminal Strength: No deformation. Inductance change within 20%. DC resistance within standard requirements. Test involves applying 10N thrust for 10 sec (2N for 0603[0201] products).

Drop: No failure after test. Dropped on concrete or steel board. Method: free fall. Height: 100cm. 3 directions, 3 times each direction (Total 9 times).

Salt Mist: Appearance: no mechanical damage. Inductance change within 20%. Test Condition: Salt solution concentration (50.1)%, PH: 6.5-7.2, Time: 482h.

Packaging and Storage

Packaging: Available in tape and reel packaging. Reel dimensions and quantities vary by product type. For detailed tape dimensions, refer to the specification table.

Storage: Store in a cool, dry place (below 40, less than 70% RH) and avoid exposure to dust or corrosive gases to maintain solderability.


2304140030_DMBJ-PNLS4030-221M-220UH_C2849479.pdf


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