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Durable DMBJ PNLS4010-2R2M 2.2UH power inductor designed for smart devices computing and multimedia

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Durable DMBJ PNLS4010-2R2M 2.2UH power inductor designed for smart devices computing and multimedia

Current - Saturation (Isat) : 1.6A

Description : 1.6A SMD,4x4mm Fixed Inductors RoHS

Mfr. Part # : PNLS4010-2R2M 2.2UH

Model Number : PNLS4010-2R2M 2.2UH

Package : SMD,4x4mm

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Product Overview

The PNLS series chip power inductors from Dongguan Zhenbaojia Electronics Co., Ltd. are designed for high-performance applications. They feature a closed magnetic circuit for reduced EMI, metallization on the ferrite core for enhanced durability, and low DCR for minimal power loss. These compact inductors are widely used in smart devices, computing, and multimedia equipment.

Product Attributes

  • Brand: PNLS Series
  • Manufacturer: Dongguan Zhenbaojia Electronics Co., Ltd.
  • Origin: China

Technical Specifications

TypeExternal Dimensions (LW) (mm)Nominal InductanceInductance ToleranceFig.ABC(max)D(max)E(max)
PNLS2520102.01.6R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.12.50.32.00.351.052.10.85
PNLS2520122.01.6R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.12.50.32.00.351.252.00.85
PNLS30103.03.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.13.00.33.00.351.202.50.85
PNLS30123.03.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.23.00.33.00.351.302.80.90
PNLS30153.03.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.23.00.33.00.351.502.60.90
PNLS40104.04.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.24.00.34.00.351.153.51.30
PNLS40124.04.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.24.00.34.00.351.353.51.30
PNLS40184.04.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.24.00.34.00.351.803.51.30
PNLS40204.04.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.24.00.34.00.352.103.51.30
PNLS40264.04.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.24.00.34.00.352.803.51.30
PNLS40304.04.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.24.00.34.00.353.003.51.30
PNLS50125.05.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.25.00.35.00.351.304.01.50
PNLS50205.05.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.25.00.35.00.352.004.01.50
PNLS50405.05.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.25.00.35.00.354.004.01.50
PNLS50455.05.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.25.00.35.00.354.504.01.50
PNLS60126.06.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.36.00.36.00.351.305.01.65
PNLS60206.06.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.26.00.36.00.352.005.01.65
PNLS60306.06.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.36.00.36.00.353.005.01.85
PNLS60456.06.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.36.00.36.00.354.505.01.65
PNLS60506.06.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.36.00.36.00.355.305.01.65
PNLS60606.06.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.36.00.36.00.356.305.01.65
PNLS80408.08.0R10 (0.1H) to 100 (10H)K (10%), M (20%), N (30%)Fig.38.00.38.00.354.206.32.45

Applications

Widely applied in smart phones, set-top boxes, VR, AR, notebooks, desktop computers, servers, portable gaming devices, personal navigation systems, and personal multimedia devices.

Features

  • Large saturation current.
  • Metallization on ferrite core results in excellent shock resistance and damage-free durability.
  • Closed magnetic circuit design reduces leakage flux and Electro Magnetic Interference (EMI).
  • Low DCR decreases power loss, small and slim size takes up less PCB real estate.

Operating and Storage Conditions

  • Operating Temperature Range: -40 to +85
  • Storage Temperature Range: -10 to +40, 70% RH

Testing and Reliability

Test Conditions: Ambient Temperature: 2015, Relative Humidity: 6520%, Air Pressure: 86 kPa to 106 kPa. For re-testing: Ambient Temperature: 202, Relative Humidity: 655%, Air Pressure: 86kPa to 106 kPa.

  • DC Resistance (RDC): Refer to Appendix A.
  • Inductance: Refer to Appendix A.
  • Quality Factor (Q): Refer to Appendix A.
  • Rated Current (Ir): Refer to Appendix A. Inductance drop L/L100% 30%.
  • Solderability: 95% min. coverage of all metallized area. Solder temp: 2405, Immersion time: 31 sec.
  • Resistance to Solder Heat: No visible damage. Electrical and mechanical characteristics shall be satisfied. Solder Temp: 2653, Immersion time: 61 sec.
  • Bend: Without deformation. Inductance within 20%, DC resistance within standard requirements.
  • Vibration: Appearance: no mechanical damage. Inductance change within 20%. Waveform: Sine wave, Frequency: 10~55~10 Hz, Sweep time: 1min, Amplitude: 1.5mm (peak-peak). Direction: X, Y, Z (3 axes). Duration: 2 hrs./axis, total 6 hrs.
  • Temperature Shock: Appearance: no mechanical damage. Inductance change within 20%. Temperature: -40, +85 (30 min each). Cycle: 5 times.
  • Humidity Resistance: Appearance: no mechanical damage. Inductance change within 20%. Humidity: 90 to 95% RH, Temperature: 602, Applied current: Rated current, Testing time: 1000 (+48,0) hours.
  • High Temperature Resistance: Appearance: no mechanical damage. Inductance change within 20%. Temperature: +852, Applied current: Rated current, Testing time: 1000 (+48,0) hours.
  • Low Temperature Storage: Appearance: no mechanical damage. Inductance change within 20%. Temperature: -402, Testing time: 1000 (+48,0) hours.
  • Terminal Strength: No deformation. Inductance change within 20%. DC resistance within standard requirements.
  • Drop: No failure after test. Free fall from 100cm onto concrete or steel board. 3 directions, 3 times each direction (total 9 times).
  • Salt Mist: Appearance: no mechanical damage. Inductance change within 20%. Concentration of salt solution: (50.1)%. PH: 6.5-7.2. Time: 482h.

Packaging and Storage

  • Packaging: Available in tape and reel format. Reel dimensions vary by product type.
  • Storage: Store in a cool, dry place (below 40, less than 70% RH) away from dust and corrosive gases to maintain solderability.

2204211700_DMBJ-PNLS4010-2R2M-2-2UH_C2997586.pdf


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