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Surface Mount LanTu Micro SSD1306-220MT Unshielded SMD Power Inductors for Electronic Power Solutions

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Surface Mount LanTu Micro SSD1306-220MT Unshielded SMD Power Inductors for Electronic Power Solutions

Current - Saturation (Isat) : 7A

Description : 7A SMD,18.5x15.2mm Fixed Inductors RoHS

Mfr. Part # : SSD1306-220MT

Model Number : SSD1306-220MT

Package : SMD,18.5x15.2mm

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Product Overview

The SSD1306 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers high-power, unshielded SMD power inductors designed for surface mounting. These inductors feature high saturation and low DC resistance, making them suitable for a wide range of applications including laptop power supplies, LCD televisions, and DC/DC converters. They are available in various package sizes and inductance ranges, and comply with RoHS, Halogen Free, and REACH standards.

Product Attributes

Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
Product Series: SSD1306 Series
Type: Unshielded SMD Power Inductors
Certifications: RoHS, Halogen Free, REACH Compliance
Origin: Shenzhen, China (implied by company name and location)

Technical Specifications

Product Identification:

Model Number Structure: SSD 1306 [Inductance Value] [Tolerance] [Packing]

Type: SSD (Unshielded SMD Power Inductors)
Outer Dimensions (LWH): 18.5415.24x7.11 mm (for the 1306 package)
Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing: B (Bulk Package), T (Tape & Reel)

Electrical Characteristics (at 25):

Part No	Inductance (H) @ 0A Tole	Test Freq (KHz)	SRF Typ (MHz)	DCR Max ()	Saturation Current (A) Max	Temperature Rise Current (A) Max
SSD1306-1R0M	1.0 20%	100KHz	80	0.009	20.00	8.60
SSD1306-2R2M	2.2 20%	100KHz	80	0.014	16.00	7.10
SSD1306-3R3M	3.3 20%	100KHz	60	0.018	14.00	6.20
SSD1306-5R6M	5.6 20%	100KHz	40	0.020	12.00	5.30
SSD1306-100M	10 20%	100KHz	30	0.031	10.00	4.30
SSD1306-150M	15 20%	100KHz	22	0.036	8.00	4.00
SSD1306-220M	22 20%	100KHz	20	0.047	7.00	3.50
SSD1306-330M	33 20%	100KHz	15	0.066	5.50	3.00
SSD1306-470M	47 20%	100KHz	9	0.086	4.50	2.60
SSD1306-680M	68 20%	100KHz	8	0.130	4.00	2.30
SSD1306-101M	100 20%	100KHz	7	0.190	3.00	1.80
SSD1306-151M	150 20%	100KHz	6	0.250	2.60	1.50
SSD1306-221M	220 20%	100KHz	5	0.380	2.40	1.20
SSD1306-331M	330 20%	100KHz	4	0.560	1.90	1.00
SSD1306-471M	470 20%	100KHz	3	0.850	1.40	0.82
SSD1306-681M	680 20%	100KHz	2.5	1.100	1.20	0.72
SSD1306-102M	1000 20%	100KHz	2	1.800	1.00	0.56

Definitions:

Saturation Current: DC current at which inductance drops 10% from its value without current.
Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current: The lesser value between Isat and Irms.

Environmental Data:

Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment:

Inductance (L): HP4284A or HP4285A LCR meter or equivalent
Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
Self-Resonant Frequency (SRF): Agilent E4991A or equivalent
DC Resistance (DCR): Chroma 16502 or equivalent

Outer Dimensions (mm):

Part No	A (Max)	B (Max)	C (Max)	D	E	F	H	I (J)
SSD1306	18.54	15.24	7.11	7.11	2.54	2.54	2.79	2.92	12.45

Packaging:

Tape and Reel Specifications:

Part No	Tape Dimension W (mm)	Tape Dimension P (mm)	Tape Dimension W1 (mm)	Reel Dimensions A (mm)	Reel Dimensions B (mm)	Reel Dimensions C (mm)	Reel Dimensions D (mm)	REEL (PCS)	Inside Box (PCS)	Outside Carton (PCS)
SSD1306	32	20	14.2	32.4	100	13	330	250	500	2000

Cover Tape Peel Off Condition:

Cover tape peel force: 10 to 120g
Noodle strip peeling angle: 165 to 180

Reliability Testing:

Items	Requirements	Test Methods and Remarks
Terminal Strength (SMT)	Meet requirements without any loose terminal.	Pulling test based on sectional area of terminal. Solder paste thickness: 0.12mm. Force applied gradually and maintained for 10 sec. Speed: 1.0mm/s.
Terminal Strength (DIP)	Meet requirements without any loose terminal.	Applied force based on terminal diameter (d). Duration: 10 sec.
Resistance to Flexure	No visible mechanical damage.	Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec.
Dropping	No case deformation or change in appearance. No short and no open.	Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability	No visible mechanical damage. Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage.	Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol.
Vibration	No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.	Frequency varied between 10 and 55 Hz and return to 10 Hz in 1 minute. Applied for 2 hours in each of 3 mutually perpendicular directions.
Thermal Shock	No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.	100 cycles of temperature change between (85~125) and (-55~40). Transforming interval: Max. 20 sec.
Low temperature Storage	No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.	Temperature: -55~-402. Duration: 962 hours.
High temperature Storage	No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.	Temperature: 125~852. Duration: 962 hours.
Damp Heat (Steady States)	No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.	Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours.
Heat endurance of Reflow soldering	No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%.	Refer to reflow curve, performed twice. Peak temperature: 260+0/-5.
Resistance to solvent test	No case deformation or change in appearance or obliteration of marking.	Dip in IPA solvent for 50.5Min, dry for 5Min, then brushing 10 times.
Overload test	During test: no smoke, no peculiar smell, no fire. Characteristics normal after test.	Apply twice rated current for 5 minutes. Performed twice.
Voltage resistance test	During the test no breakdown. Characteristics normal after test.	DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils)

Recommended Reflow Soldering Curve:

The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm according to their specific environment and equipment.

Reminders for Using These Products:

Storage: Within 12 months, under conditions of 5~40C and 35-65% RH. Beyond this period, terminal solderability may deteriorate.
Environment: Avoid use or storage in gas corrosive environments (salt, acid, alkali, etc.).
Handling: Do not touch terminals directly with bare hands due to oil secretions that inhibit soldering. Handle products carefully to prevent damage from dropping or improper removal.
Bending: Do not bend terminals with excessive stress to avoid wire fracture.
Cleaning: Do not rinse coils; contact the manufacturer if cleaning is required.
Magnetic Fields: Do not expose products to magnets or magnetic fields.
Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
Thermal Design: Account for self-heating when power is on; ensure sufficient thermal design margin.
Layout: For non-magnetic shield types, careful coil placement on the PCB is necessary to prevent malfunctions due to magnetic interference.

2410121647_LanTu-Micro-SSD1306-220MT_C5127225.pdf

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