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LanTu Micro SSD0804-331MT Unshielded SMD Power Inductor Designed for Power Conversion and Electronics

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LanTu Micro SSD0804-331MT Unshielded SMD Power Inductor Designed for Power Conversion and Electronics

Current - Saturation (Isat) : 600mA

Description : 600mA SMD,13x9.4mm Fixed Inductors RoHS

Mfr. Part # : SSD0804-331MT

Model Number : SSD0804-331MT

Package : SMD,13x9.4mm

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Unshielded SMD Power Inductors - SSD0804 Series

Product Overview

The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SSD0804 Series Unshielded SMD Power Inductors are designed for high power applications, featuring high saturation and low DC resistance. These unshielded inductors are suitable for surface mounting equipment and are available in various package sizes and inductance ranges. They comply with RoHS, Halogen Free, and REACH standards, making them ideal for use in power supplies for VTRs, LCD televisions, DC/DC converters, and other consumer electronics.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SSD0804
  • Type: Unshielded SMD Power Inductors
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Origin: Shenzhen, China

Technical Specifications

General Specifications

Specification Details
Operating Temperature -40 to +125 (Including coils self-temperature rise)
Test Frequency for L 100KHz
Inductance Tolerance J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing Options Bulk Package (B), Tape & Reel (T)

Dimensions

Part No. External Dimensions (LWH) (mm) A (Max) B (Max) C (Max) D E F H I J
SSD0804 12.959.45.21 12.95 9.4 5.21 7.62 2.54 2.54 2.79 2.92 7.37

Electrical Characteristics

Part No. Inductance (H) Tolerance Test Freq (MHz) SRF (@0A) Typ () DCR Max () Saturation Current (A) Max Temperature Rise Current (A) Max
SSD0804-1R0M 1.0 20% 100KHz 100 0.009 9.00 6.80
SSD0804-1R5M 1.5 20% 100KHz 90 0.010 8.00 6.40
SSD0804-2R2M 2.2 20% 100KHz 80 0.012 7.00 6.10
SSD0804-3R3M 3.3 20% 100KHz 65 0.015 6.40 5.40
SSD0804-4R7M 4.7 20% 100KHz 45 0.018 5.40 4.80
SSD0804-6R8M 6.8 20% 100KHz 38 0.027 4.60 4.40
SSD0804-100M 10 20% 100KHz 30 0.038 3.80 3.90
SSD0804-150M 15 20% 100KHz 27 0.046 3.50 3.10
SSD0804-220M 22 20% 100KHz 19 0.085 3.00 2.70
SSD0804-330M 33 20% 100KHz 15 0.100 2.60 2.10
SSD0804-470M 47 20% 100KHz 12 0.140 2.00 1.60
SSD0804-680M 68 20% 100KHz 10 0.200 1.60 1.40
SSD0804-101M 100 20% 100KHz 9 0.280 1.40 1.20
SSD0804-151K 150 10% 100KHz 6 0.400 1.20 1.00
SSD0804-221K 220 10% 100KHz 5 0.610 1.00 0.80
SSD0804-331K 330 10% 100KHz 4.5 1.020 0.60 0.60
SSD0804-471K 470 10% 100KHz 3.5 1.270 0.50 0.50
SSD0804-681K 680 10% 100KHz 2.5 2.020 0.40 0.40
SSD0804-102K 1000 10% 100KHz 2.0 3.000 0.30 0.30

Definitions

  • Saturation Current: DC current at which inductance drops 10% from its value without current.
  • Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
  • Rated DC Current: The lesser value of Isat or Irms.

Test Equipment Used

  • Inductance (L): HP4284A, HP4285A LCR meter or equivalent
  • Current (Isat & Irms): HP4284+42841A or equivalent
  • Self-Resonant Frequency (SRF): Agilent E4991A or equivalent
  • DC Resistance (DCR): Chroma 16502 or equivalent

Packaging Quantities

Part No. Tape Dimension W (mm) P (mm) W1 (mm) Reel Dimensions A (mm) B (mm) C (mm) D (mm) REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SSD0804 24 16 11.5 24.4 100 13 330 1000 2000 8000

Reliability Testing Summary

Item Requirements Test Methods and Remarks
Terminal Strength Meet requirements without any loose terminal Pulling test (SMT/DIP), Solder paste thickness: 0.12mm, Force applied gradually, Keep time: 101s, Speed: 1.0mm/s.
Resistance to Flexure No visible mechanical damage. Solder to test jig, apply force in shown direction, Flexure: 2mm, Speed: 0.5mm/sec, Keep time: 30 sec.
Dropping No case deformation or change in appearance. No short and no open. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol.
Vibration No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Subject to simple harmonic motion, 10-55 Hz, 2 hours in each 3 mutually perpendicular directions.
Thermal Shock No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. 100 cycles of temperature shock (-55~40 to 85~125). Transforming interval: Max. 20 sec.
Low temperature Storage No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: -55~-402, Duration: 962 hours.
High temperature Storage No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: 85~1252, Duration: 962 hours.
Damp Heat (Steady States) No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours.
Heat endurance of Reflow soldering No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. Refer to reflow curve, twice. Peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip in IPA solvent for 50.5Min, dry for 5Min, brushing 10 times.
Overload test During test no smoke, no peculiar smell, no fire. Characteristics normal after test. Apply twice rated current for 5 minutes.
Voltage resistance test During test no breakdown. Characteristics normal after test. DC1000V, Current: 1mA, Time: 1Min.

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to our soldering equipment. Please adjust and confirm according to users environment/equipment.

Reminders for Using These Products

  • Storage: Within 12 months, at 5~40C and 35~65% RH. Soldering of terminal electrodes may deteriorate if storage period elapses.
  • Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with electrodes due to oil secretions. Handle carefully to prevent damage from dropping or inappropriate removal.
  • Bending: Do not bend terminals with excessive stress to avoid wire fracture.
  • Cleaning: Do not rinse coils. Contact SXN if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Should be within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan shortening.
  • Thermal Design: Allow for sufficient margin in thermal design due to self-heating when power is ON.
  • Layout: For non-magnetic shield types, carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.

2410121647_LanTu-Micro-SSD0804-331MT_C5127608.pdf


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