T-core Molding Structure Power Inductors
Product Overview
LANTU's STC201610 series T-core molding structure power inductors are designed for high-density installations requiring low DC resistance, ultra-high current, and strong anti-electromagnetic interference. Featuring a thin profile and excellent vibration resistance due to their T-core molding structure, these inductors are ideal for high switching frequency applications. They offer extremely low DCR and ultra-low AC losses, making them suitable for demanding DC/DC converter applications in notebooks, mobile phones, tablets, servers, and base stations.
Product Attributes
- Brand: LANTU (SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.)
- Origin: China
- Certifications: RoHS, Halogen Free, REACH Compliance
- Type: T-core molding Structure Power Inductors
Technical Specifications
Series: STC201610
Dimensions: 2.0 x 1.6 x 1.0 mm (L x W x H)
| Part No. | Inductance (H) | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Saturation Current (A) Max | Heat Rating Current (A) Typical | Heat Rating Current (A) Max |
| STC201610-R22M | 0.22 | 20% | 8.2 | 11 | 7.5 | 8.2 | 6.9 | 6.3 |
| STC201610-R47M | 0.47 | 20% | 6.3 | 22 | 5.5 | 6.3 | 5.5 | 5.0 |
| STC201610-1R0M | 1.0 | 20% | 4.6 | 35 | 4.2 | 4.6 | 4.5 | 4.1 |
| STC201610-1R5M | 1.5 | 20% | 3.2 | 80 | 2.9 | 3.2 | 2.6 | 2.3 |
| STC201610-2R2M | 2.2 | 20% | 3.0 | 120 | 2.8 | 3.0 | 2.5 | 2.1 |
| STC201610-3R3M | 3.3 | 20% | 2.3 | 140 | 2.0 | 2.3 | 1.7 | 1.5 |
| STC201610-4R7M | 4.7 | 20% | 2.0 | 190 | 1.8 | 2.0 | 1.6 | 1.4 |
| STC201610-100M | 10 | 20% | 1.4 | 483 | 1.1 | 1.4 | 1.0 | 0.7 |
Notes on Specifications:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat or Irms.
- Part temperature should be verified in the end application.
Dimensions (mm)
| Part No. | A | B | C | D | E | F | H |
| STC201610 | 2.00.2 | 1.60.2 | 1.0Max | 0.70.2 | 2.1Typ | 0.5Typ | 1.7Typ |
Environmental Data
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Product Identification
Format: STC 201610 1R0 M T
- Type: STC (T-core molding Structure Power Inductors)
- Inductance: e.g., 1.0 uH
- External Dimensions (LWH) (mm): 201610 (2.01.61.0)
- Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing: B (Bulk Package), T (Tape & Reel)
Packaging Information
Tape & Reel Specifications:
- Tape Dimension (mm): W=8, P=4, W1=3.5
- Reel Dimensions (mm): A=8.4, B=60, C=13, D=178
- Packing Quantity: Reel (3000 PCS), Inside Box (30,000 PCS), Outside Carton (120,000 PCS)
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Applications
- DC/DC converter for CPU in Notebook PC
- Phones, tablets, HDDs, DVCs, PDAs, 5G modules
- Server, base station, etc.
- Various DC-DC conversion power modules
Reliability Testing
Includes, but is not limited to: Terminal Strength, Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low temperature Storage, High temperature Storage, Damp Heat (Steady States), Heat endurance of Reflow soldering, Resistance to solvent test, Overload test, Voltage resistance test.
Recommended Reflow Soldering Curve
Refer to the provided curve for recommended reflow conditions. Adjustments may be necessary based on specific equipment and process conditions.
Reminders for Using These Products
- Storage: Within 12 months, under conditions (5~40C, 35~65% RH).
- Avoid use and storage in corrosive environments (salt, acid, alkali).
- Handle with care to avoid damage; do not touch electrodes directly with bare hands.
- Do not bend terminals excessively.
- Do not rinse coils; contact manufacturer if cleaning is required.
- Keep away from magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid overheating.
- Account for self-heating when designing for thermal management.
- For non-magnetic shield types, careful layout is needed to prevent malfunction due to magnetic interference.
2410121647_LanTu-Micro-STC201610-100MT_C22468834.pdf
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LanTu Micro STC201610 100MT Power Inductors Designed for High Density Installations and Low AC Losses Images
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