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High precision LanTu Micro SDRI127-221MT Shielded SMD Power Inductors designed for automatic mounting and power conversion

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High precision LanTu Micro SDRI127-221MT Shielded SMD Power Inductors designed for automatic mounting and power conversion

Current - Saturation (Isat) : 2A

Description : 2A SMD,12.5x12.5mm Fixed Inductors RoHS

Mfr. Part # : SDRI127-221MT

Model Number : SDRI127-221MT

Package : SMD,12.5x12.5mm

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Shielded SMD Power Inductors - SDRI127 Series

Product Overview

The SDRI127 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. Featuring a closed magnetic circuit design to minimize leakage flux, these inductors offer high saturation current and low DC resistance. Their highly accurate dimensions ensure suitability for automatic mounting, and they are available in various package sizes and a wide inductance range. These inductors comply with RoHS, Halogen Free, and REACH standards, making them ideal for use in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

  • Brand: LANTU MICRO
  • Origin: SHENZHEN, CHINA
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Type: Shielded SMD Power Inductors
  • Magnetic Circuit Design: Closed magnetic circuit

Technical Specifications

Product Identification: SDRI 127 470 M T

External Dimensions (LWH): 12.5 12.5 8.0 mm

Operating Temperature: -40 to +125 (Including coil self-temperature rise)

Electrical Characteristics (Electrical specifications at 25)

Part No Inductance (H) @0A Tole Test Freq Min Test Freq DCR () Max Saturation Current (A) Max Temperature Rise Current (A) Max
SDRI127-1R0N 1.0 30% 100KHz 1MHz 0.009 26.00 10.00
SDRI127-2R2N 2.2 30% 100KHz 1MHz 0.012 21.00 8.00
SDRI127-2R7N 2.7 30% 100KHz 1MHz 0.013 19.00 8.00
SDRI127-3R3N 3.3 30% 100KHz 1MHz 0.013 16.00 8.00
SDRI127-3R9N 3.9 30% 100KHz 1MHz 0.013 14.00 7.50
SDRI1274R7N 4.7 30% 100KHz 1MHz 0.016 12.00 6.80
SDRI127-6R1N 6.1 30% 100KHz 1MHz 0.018 11.50 6.60
SDRI127-6R8N 6.8 30% 100KHz 1MHz 0.019 10.50 6.60
SDRI127-7R6N 7.6 30% 100KHz 1MHz 0.020 10.00 5.90
SDRI127-8R2N 8.2 30% 100KHz 1MHz 0.020 9.50 5.60
SDRI127-100N 10 30% 100KHz 1MHz 0.021 9.00 5.40
SDRI127-120M 12 20% 100KHz 1MHz 0.240 8.50 4.90
SDRI127-150M 15 20% 100KHz 1MHz 0.027 8.00 4.50
SDRI127-180M 18 20% 100KHz 1MHz 0.039 7.50 3.90
SDRI127-220M 22 20% 100KHz 1MHz 0.043 7.00 3.60
SDRI127-270M 27 20% 100KHz 1MHz 0.046 6.50 3.40
SDRI127-330M 33 20% 100KHz 1MHz 0.065 5.50 3.00
SDRI127-390M 39 20% 100KHz 1MHz 0.072 5.00 2.75
SDRI127-470M 47 20% 100KHz 1MHz 0.100 4.60 2.50
SDRI127-560M 56 20% 100KHz 1MHz 0.110 4.40 2.35
SDRI127-680M 68 20% 100KHz 1MHz 0.140 4.00 2.10
SDRI127-820M 82 20% 100KHz 1MHz 0.160 3.80 1.95
SDRI127-101M 100 20% 100KHz 0.796MHz 0.220 3.50 1.70
SDRI127-121M 120 20% 100KHz 0.796MHz 0.250 3.00 1.60
SDRI127-151M 150 20% 100KHz 0.796MHz 0.280 2.70 1.42
SDRI127-181M 180 20% 100KHz 0.796MHz 0.350 2.50 1.30
SDRI127-221M 220 20% 100KHz 0.796MHz 0.390 2.00 1.16
SDRI127-271M 270 20% 100KHz 0.796MHz 0.560 1.95 1.06
SDRI127-331M 330 20% 100KHz 0.796MHz 0.640 1.90 0.95
SDRI127-391M 390 20% 100KHz 0.796MHz 0.700 1.65 0.88
SDRI127-471M 470 20% 100KHz 0.796MHz 0.980 1.50 0.79
SDRI127-561M 560 20% 100KHz 0.796MHz 1.070 1.40 0.73
SDRI127-681M 680 20% 100KHz 0.796MHz 1.460 1.30 0.67
SDRI127-821M 820 20% 100KHz 0.796MHz 1.640 1.10 0.60
SDRI127-102M 1000 20% 100KHz 0.796MHz 1.820 1.00 0.55

Definitions:

  • Saturation Current: DC current at which inductance drops 30% from its value without current.
  • Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
  • Rated DC Current: The lesser of Isat or Irms.

Shape and Dimensions (dimensions are in mm)

Part No A (Max) B (Max) C (Max) D E F G H
SDRI127 12.5 12.5 8.0 5.0 7.6 2.9 7.0 5.4

Packaging Information

Tape and Reel Specifications:

Part No. Tape Dimension W Tape Dimension P Tape Dimension H Reel Dimensions A Reel Dimensions B Reel Dimensions C Reel Dimensions D REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SDRI127 24 16 11.5 24.4 100 13 330 500 1000 4000

Cover tape peel off condition:

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Reliability Testing

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal. Pulling test: Defined forces based on terminal sectional area (8mm, 8-20mm, >20mm). Solder paste thickness: 0.12mm. Force applied gradually and maintained for 101s at 1.0mm/s speed.
Terminal Strength (DIP) Meet requirements without any loose terminal. Applied force based on terminal diameter (0.35-0.50mm, 0.50-0.80mm, 0.80-1.25mm, >1.25mm). Duration: 10sec.
Resistance to Flexure No visible mechanical damage. Solder to test jig, apply flexure (2mm) at 0.5mm/sec speed, keep for 30 sec.
Dropping No case deformation or change in appearance. No short and no open. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol.
Vibration No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Solder to testing jig. Subject to simple harmonic motion (1.5mm amplitude, 10-55 Hz) for 2 hours in each of 3 mutually perpendicular directions.
Thermal Shock No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. 100 cycles of temperature shock between (85~125) and (-55~40). Transforming interval: Max. 20 sec. Stabilize at normal condition for 1-2 hours after test.
Low temperature Storage No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. Temperature: -55~-402. Duration: 962 hours. Stabilize at normal condition for 1-2 hours before measuring.
High temperature Storage No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. Temperature: 125~852. Duration: 962 hours. Stabilize at normal condition for 1-2 hours before measuring.
Damp Heat (Steady States) No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1-2 hours before measuring.
Heat endurance of Reflow soldering No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. Refer to reflow curve, undergo reflow twice. Peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times.
Overload test During test no smoke, no peculiar smell, no fire. Characteristics normal after test. Apply twice rated current for 5 minutes.
Voltage resistance test During test no breakdown. Characteristics normal after test. For parts with two coils: DC1000V, Current: 1mA, Time: 1Min.

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to LANTU's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.

Reminders for Using These Products

  • Storage: Within 12 months, under conditions (temperature: 5~40C, humidity: 35~65% RH or less). Soldering of terminal electrodes may deteriorate if storage period elapses.
  • Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands due to oil secretions that may inhibit soldering. Handle products carefully to prevent damage from dropping or improper removal.
  • Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
  • Cleaning: Do not rinse coils; contact LANTU if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Thermal Design: Allow sufficient margin for thermal design due to self-heating when power is ON.
  • Non-Magnetic Shield Type: Carefully lay out the coil on the circuit board to prevent malfunctions due to magnetic interference.

2410121647_LanTu-Micro-SDRI127-221MT_C5127291.pdf


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