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LanTu Micro SMS252010 220MT SMD power inductor designed for high frequency switching and low AC losses

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LanTu Micro SMS252010 220MT SMD power inductor designed for high frequency switching and low AC losses

Current - Saturation (Isat) : 1.1A

Description : 1.1A 1008 Fixed Inductors RoHS

Mfr. Part # : SMS252010-220MT

Model Number : SMS252010-220MT

Package : 1008

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Product Overview

The SMS252010 Series Ultra-high current SMD power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installation with a thin profile, low DC resistance, and ultra-high current capabilities. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability and excellent vibration resistance due to their T-core molding structure. They are ideal for applications requiring extremely low DCR and ultra-low AC losses at high switching frequencies, including DC/DC converters for notebook CPUs, mobile phones, tablets, servers, base stations, and various power modules. These components comply with RoHS, Halogen Free, and REACH standards.

Product Attributes

Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
Product Type: Common Mode Choke / Molding SMD Power Inductor
Series: SMS252010
Certifications: RoHS, Halogen Free, REACH Compliance
Origin: Shenzhen, China (implied by company name and location)

Technical Specifications

Environmental Data:

Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment:

Inductance (L): WK3260B LCR meter or equivalent
Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification:

Component	Description
SMS	Molding SMD Power Inductor
252010	External Dimensions (LWH) in mm: 2.52.01.0
R47	Inductance Value: 0.47 uH
M	Inductance Tolerance: 20%
T	Packing: Tape & Reel
B	Packing: Bulk Package

Electrical Characteristics (SMS252010 Series at 25):

Part No.	Inductance (L) H	Tol.	DCR (m) Typical	DCR (m) Max	Saturation Current (Isat) Typical (A)	Heat Rating Current (Irms) Typical (A)
SMS252010-R22M	0.22	20%	12.0	17.0	8.60	6.80
SMS252010-R24M	0.24	20%	12.0	17.5	8.50	6.70
SMS252010-R33M	0.33	20%	13.0	19.0	7.60	6.50
SMS252010-R47M	0.47	20%	15.0	22.0	6.90	6.10
SMS252010-R68M	0.68	20%	23.0	27.0	5.90	5.60
SMS252010-1R0M	1.0	20%	25.0	30.0	5.40	4.70
SMS252010-1R5M	1.5	20%	45.0	55.0	4.30	3.40
SMS252010-2R2M	2.2	20%	62.0	70.0	3.30	2.40
SMS252010-3R3M	3.3	20%	86.0	100.0	2.80	2.50
SMS252010-4R7M	4.7	20%	160.0	180.0	2.60	2.00
SMS252010-6R8M	6.8	20%	270.0	320.0	2.40	1.60
SMS252010-100M	10	20%	500.0	560.0	1.55	1.05
SMS252010-220M	22	20%	1100.0	1300.0	1.10	0.85

Definitions:

Saturation Current: DC current at which inductance drops 30% from its value without current.
Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current: The lesser value of Isat or Irms.

Shape and Dimensions (mm):

Part No.	A (L)	B (W)	C (H)	D	E	F	H
SMS252010	2.500.20	2.000.20	1.00 Max	0.90 Typ	2.80 Typ	1.00 Typ	2.10 Typ

Packaging Specifications:

Part No.	Tape Dimension W (mm)	Tape Dimension P (mm)	Tape Dimension W1 (mm)	REEL (PCS)	Inside Box (PCS)	Outside Carton (PCS)
SMS252010	8.0	4.0	3.5	3000	30,000	120,000

Cover Tape Peel Off Condition:

Cover tape peel force: 10 to 120g
Noodle strip peeling angle: 165 to 180

Reliability Testing:

Item	Requirements	Test Methods and Remarks
Terminal Strength (SMT)	Meet requirements without any loose terminal.	Pulling test: Defined by terminal cross-sectional area (A). Force varies from 5N to 20N. Solder paste thickness: 0.12mm. Keep time: 101s. Speed: 1.0mm/s.
Terminal Strength (DIP)	Meet requirements without any loose terminal.	Pull Force: Applied gradually to the terminal and maintained for 10 seconds. Force varies by terminal diameter (d) from 5N to 40N.
Resistance to Flexure	No visible mechanical damage.	Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec.
Dropping	No case deformation or change in appearance. No short and no open.	Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability	Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage.	Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol.
Vibration	No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.	Total amplitude of 1.5mm, frequency varied between 10 and 55 Hz. Traversed in 1 minute. Applied for 2 hours in each of 3 mutually perpendicular directions (total 6 hours).
Thermal Shock	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	100 cycles of temperature transition from (85~125) to (-55~40). Transforming interval: Max. 20 sec. Stabilized at normal condition for 1~2 hours before measuring.
Low temperature Storage	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	Temperature: M(-55~-402). Duration: 962 hours. Stabilized at normal condition for 1~2 hours before measuring.
High temperature Storage	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	Temperature: N(125~852). Duration: 962 hours. Stabilized at normal condition for 1~2 hours before measuring.
Damp Heat (Steady States)	No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%.	Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilized at normal condition for 1~2 hours before measuring.
Heat endurance of Reflow soldering	No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%.	Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5.
Resistance to solvent test	No case deformation or change in appearance or obliteration of marking.	Dip parts into IPA solvent for 50.5Min, then drying at room temp for 5Min, brushing 10 times.
Overload test	During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test.	Apply twice the rated current for 5 minutes.
Voltage resistance test	During the test no breakdown. The characteristic is normal after test.	DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils).

Recommended Reflow Soldering Curve:

The recommended reflow conditions are set according to the soldering equipment. Users should adjust and confirm according to their specific environment/equipment.

Reminders for Using These Products:

Storage: Within 12 months. Conditions: Temperature 5~40C, Humidity 35~65% RH or less. Soldering of terminal electrodes may deteriorate if storage period elapses.
Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
Handling: Avoid direct contact with terminals with bare hands due to oil secretions. Handle products carefully to prevent damage from dropping or inappropriate removal. Do not bend terminals with excessive stress.
Cleaning: Do not rinse coils. Contact SXN if cleaning is necessary.
Magnetic Fields: Do not expose products to magnets or magnetic fields.
Preheating: Preheat components before soldering. Temperature difference between solder and chip temperature should not exceed 150C.
Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
Thermal Design: Allow sufficient margin for self-heating (temperature increase) when power is ON.
Non-Magnetic Shield Type: Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.

2410121647_LanTu-Micro-SMS252010-220MT_C22461671.pdf

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