T-core Molding Structure Power Inductors
Product Overview
The STC201612 series of T-core molding structure power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installation and offer superior anti-vibration performance. These inductors feature a thin profile with low DC resistance and ultra-high current capabilities, making them ideal for applications requiring efficient power conversion. Their magnetic shielding provides strong electromagnetic interference (EMI) resistance, and they are RoHS, Halogen Free, and REACH compliant. Suitable for high switching frequencies, these inductors are a reliable choice for modern electronic devices.
Product Attributes
- Brand: LANTU MICRO
- Origin: SHENZHEN, CHINA
- Type: T-core molding Structure Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
Product Identification: STC 201612 1R0 M T
- Type: STC (T-CORE Structure Molding Chip Power Inductor)
- Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing: B (Bulk Package), T (Tape & Reel)
Dimensions
External Dimensions (LWH): 201612 (2.01.61.2 mm)
| Part No | ITEM | Unit:mm | A | B | C | D | E | F | H |
| STC201612 | Dimensions | mm | 2.00.2 | 1.60.2 | 1.2Max | 0.70.2 | 2.1Typ | 0.5Typ | 1.7Typ |
Electrical Characteristics
| Part No | Inductance (H) @ 1MHz, 1.0V | Tol | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Saturation Current (A) Max | Heat Rating Current (A) Typical | Heat Rating Current (A) Max |
| STC201612-R47M | 0.47 | 20% | 6.7 | 7.3 | 6.0 | 5.4 | 6.7 | 6.0 |
| STC201612-1R0M | 1.0 | 20% | 30 | 36 | 5.0 | 4.5 | 5.0 | 4.5 |
| STC201612-1R5M | 1.5 | 20% | 40 | 50 | 4.0 | 3.5 | 4.0 | 3.5 |
| STC201612-2R2M | 2.2 | 20% | 77 | 90 | 3.1 | 2.7 | 3.3 | 2.9 |
Note: Saturation Current: DC current at which inductance drops 30% from its value without current. Heat Rating Current: the actual value of DC current when the temperature rise is T 40(Ta=25). Rated DC Current: The less value which is Isat or Irms.
Environmental Data
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Applications
- DC/DC converter for CPU in Notebook PC
- Phones, tablets, HDDs, DVCs, PDAs, 5G modules
- Server, base station, etc.
- Various DC-DC conversion power modules
Reliability Testing
The following reliability tests are conducted according to specified standards, with requirements for Inductance change within 10% (Mn-Zn: Within 30%) and Q factor change within 20% unless otherwise noted:
- Terminal Strength (SMT & DIP)
- Resistance to Flexure
- Dropping Test
- Solderability
- Vibration Test
- Thermal Shock
- Low Temperature Storage
- High Temperature Storage
- Damp Heat (Steady States)
- Heat endurance of Reflow soldering
- Resistance to solvent test
- Overload test
- Voltage resistance test
Recommended Reflow Soldering Curve
The recommended reflow conditions are provided, but users should adjust and confirm according to their specific environment and equipment.
Usage Reminders
- Storage period: within 12 months under conditions (5~40C, 35~65% RH).
- Avoid use and storage in gas corrosive environments.
- Do not touch electrodes directly with bare hands.
- Handle products carefully to prevent damage.
- Do not bend terminals with excessive stress.
- Do not rinse coils; contact LANTU MICRO if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specifications; overheating may cause issues.
- Ensure sufficient thermal design margin for self-heating.
- For non-magnetic shield types, careful layout is needed to avoid malfunction due to magnetic interference.
2410121442_LanTu-Micro-STC201612-1R5MT_C22468837.pdf
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Power Inductors Featuring LanTu Micro STC201612-1R5MT T-core Molding Structure for Power Conversion Images
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