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High density installation power inductors LanTu Micro STC201610-1R5MT with thin profile and low DC resistance

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High density installation power inductors LanTu Micro STC201610-1R5MT with thin profile and low DC resistance

Current - Saturation (Isat) : 2.9A

Description : 2.9A 0806 Fixed Inductors RoHS

Mfr. Part # : STC201610-1R5MT

Model Number : STC201610-1R5MT

Package : 0806

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Product Overview

The STC201610 series T-core molding structure power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installation applications. They feature a thin profile with low DC resistance and ultra-high current capabilities, making them ideal for high switching frequencies. The magnetic shielding provides strong anti-electromagnetic interference. These inductors offer high reliability and excellent vibration resistance due to their T-core molding structure. They are compliant with RoHS, Halogen Free, and REACH standards.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Product Type: T-core molding Structure Power Inductors
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Origin: Shenzhen, China (implied by company location)

Technical Specifications

General Specifications

Attribute Value
Operating Temperature -40 to +125 (including coil self-temperature rise)
Test Equipment (Inductance) WK3260B LCR meter or equivalent
Test Equipment (Current) WK3260B+WK3265B or equivalent
Test Equipment (DCR) Chroma 16502 or equivalent

Product Identification

Example: STC 201610 1R0 M T

Component Description
Type STC: T-CORE molding Structure Power Inductors
Inductance e.g., 1.0 uH
External Dimensions (LWH) 201610: 2.01.61.0 mm
Inductance Tolerance J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing B: Bulk Package, T: Tape & Reel

Dimensions (mm)

Part No. A B C (Max) D E (Typ) F (Typ) H (Typ)
STC201610 2.00.2 1.60.2 1.0 0.70.2 2.1 0.5 1.7

Electrical Characteristics (STC201610 Series)

Part No. Inductance (H) @ 1MHz, 1.0V Tol. DCR (m) Typ. DCR (m) Max. Saturation Current (A) Typ. Saturation Current (A) Max. Heat Rating Current (A) Typ. Heat Rating Current (A) Max.
STC201610-R22M 0.22 20% 8.2 11 7.5 6.9 6.3 5.5
STC201610-R47M 0.47 20% 6.3 22 5.5 5.0 5.0 4.5
STC201610-1R0M 1.0 20% 4.6 35 4.2 4.1 4.1 3.8
STC201610-1R5M 1.5 20% 3.2 80 2.9 2.6 2.6 2.4
STC201610-2R2M 2.2 20% 3.0 120 2.8 2.5 2.5 2.3
STC201610-3R3M 3.3 20% 2.3 140 2.0 1.7 1.7 1.5
STC201610-4R7M 4.7 20% 2.0 190 1.8 1.6 1.6 1.4
STC201610-100M 10 20% 1.4 483 1.1 1.0 1.0 0.7

Note:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: the actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
- Part temperature should be verified in the end application due to factors like circuit design, PCB trace size, airflow, etc.

Applications

  • DC/DC converter for CPU in Notebook PC
  • Phones, tablets, HDDs, DVCs, PDAs, 5G modules
  • Server, base station, etc.
  • Various DC-DC conversion power modules

Packaging Information

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
STC201610 8 4 3.5 8.4 60 13 178 3000 30,000 120,000

Reliability Testing Summary

Item Requirements Test Methods and Remarks
Terminal Strength Meet requirements without loose terminal Pulling test (SMT/DIP), Solder paste thickness, Force application based on terminal area/diameter
Resistance to Flexure No visible mechanical damage, Meet requirements Flexure: 2mm, Speed: 0.5mm/sec, Keep time: 30 sec
Dropping No case deformation, No short/open Drop from 1m high (1 angle, 3 ridges, 6 surfaces, twice each direction)
Solderability Wetting >75% coverage, Terminals 95% minimum solder coverage Solder temp: 2402, Duration: 3 sec, Solder: Sn/3.0Ag/0.5Cu, Flux: 25% Resin/75% ethanol
Vibration No visible mechanical damage, Inductance change: 10%, Q factor change: 20% Frequency 10-55 Hz, Amplitude 1.5mm, 2 hours in 3 perpendicular directions
Thermal Shock No visible mechanical damage, Inductance change: 10% (Mn-Zn: 30%), Q factor change: 20% 100 cycles of temperature extremes (-55~40 to 85~125), Max. 20 sec transforming interval
Low temperature Storage No visible mechanical damage, Inductance change: 10% (Mn-Zn: 30%), Q factor change: 20% -402 for 962 hours
High temperature Storage No visible mechanical damage, Inductance change: 10% (Mn-Zn: 30%), Q factor change: 20% 852 for 962 hours
Damp Heat (Steady States) No visible mechanical damage, Inductance change: 10% (Mn-Zn: 30%), Q factor change: 20% 602, 90%-95% RH for 962 hours
Heat endurance of Reflow soldering No significant defects, L/L10% (Mn-Zn: 30%), Q/Q30%, DCR/DCR10% Twice reflow, Peak temp: 260+0/-5
Resistance to solvent test No case deformation or change in appearance Dip in IPA solvent for 50.5Min, dry 5Min, brush 10 times
Overload test No smoke, peculiar smell, fire; characteristics normal after test Apply twice rated current for 5 minutes (twice)
Voltage resistance test No breakdown; characteristics normal after test DC1000V, Current: 1mA, Time: 1Min (for parts with two coils)

Recommended Reflow Soldering Curve

Users should adjust and confirm reflow conditions based on their specific equipment and process.

Reminders for Using These Products

  • Storage: Within 12 months, Temperature: 5~40C, Humidity: 35~65% RH. Solderability may deteriorate if storage period elapses.
  • Environment: Do not use or store in corrosive gas environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals due to hand oils. Handle carefully to prevent damage from dropping. Do not bend terminals excessively.
  • Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Thermal Design: Allow sufficient margin for self-heating when power is on.
  • Layout (Non-magnetic shield type): Careful coil placement is needed to avoid malfunctions due to magnetic interference.

2410121647_LanTu-Micro-STC201610-1R5MT_C22468830.pdf


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