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LanTu Micro SMS0650 3R3MT power inductor with integral construction minimizing buzz noise and ensuring

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LanTu Micro SMS0650 3R3MT power inductor with integral construction minimizing buzz noise and ensuring

Current - Saturation (Isat) : 9A

Description : 9A SMD,7.1x6.6mm Fixed Inductors RoHS

Mfr. Part # : SMS0650-3R3MT

Model Number : SMS0650-3R3MT

Package : SMD,7.1x6.6mm

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Product Overview

The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0650 Series are ultra-high current, thin-profile SMD power inductors designed for high-density installations. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability with an integral construction for excellent vibration resistance. Their composite structure minimizes buzz noise, while the low-loss alloy powder die-casting ensures low impedance and small parasitic capacitance. These inductors achieve high efficiency with low DC resistance and low core eddy-current loss, operating at frequencies up to 3MHz with a maximum insulation voltage of 30VDC. They are RoHS, Halogen Free, and REACH compliant.

Applications include: PDA, notebook, desktop, server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Product Series: SMS0650 Series
  • Type: Molding SMD Power Inductor
  • Certifications: RoHS, Halogen Free, REACH Compliance

Technical Specifications

Electrical Characteristics

Part No. Inductance (H) @0A Tol. DCR (m) Typical DCR (m) Max Saturation Current Typical (A) Heat Rating Current Typical (A)
SMS0650-R22M 0.22 20% 1.1 1.3 40.00 30.00
SMS0650-R47M 0.47 20% 3.2 3.8 24.00 20.00
SMS0650-R56M 0.56 20% 3.4 3.9 20.00 18.00
SMS0650-R68M 0.68 20% 3.9 4.2 17.00 17.50
SMS0650-R82M 0.82 20% 4.6 4.9 17.00 17.00
SMS0650-1R0M 1.00 20% 6.5 8.5 16.50 13.00
SMS0650-1R5M 1.50 20% 7.0 10.0 12.70 12.00
SMS0650-2R2M 2.20 20% 11.2 13.6 12.50 11.00
SMS0650-3R3M 3.30 20% 20.0 22.0 9.00 8.50
SMS0650-4R7M 4.70 20% 26.0 30.0 8.00 6.70
SMS0650-5R6M 5.60 20% 31.0 36.0 7.60 5.80
SMS0650-6R8M 6.80 20% 36.5 41.0 7.30 5.50
SMS0650-100M 10.00 20% 48.0 55.0 5.50 4.70
SMS0650-150M 15.00 20% 77.0 85.0 5.00 4.00
SMS0650-220M 22.00 20% 125.0 140.0 4.00 3.20
SMS0650-330M 33.00 20% 150.0 200.0 3.30 2.80
SMS0650-470M 47.00 20% 260.0 300.0 2.80 2.20
SMS0650-680M 68.00 20% 340.0 442.0 2.20 1.80
SMS0650-101M 100.00 20% 595.0 720.0 2.00 1.50

Dimensions

Part No. L (mm) W (mm) H (mm) A (mm) B (mm) C (mm) D (mm) E (mm) F (mm) G (mm) H (mm)
SMS0650 7.100.30 6.600.20 5.00Max 3.00 Typ 1.60 Typ 3.70 8.40 3.50

Product Identification

Model Structure: SMS 0650 (Inductance Value) M (Tolerance) T (Packing Type)

  • Inductance: e.g., 100 (10 H)
  • External Dimensions (LWH): 0650 (7.16.65.0 mm)
  • Type: SMS (Molding SMD Power Inductor)
  • Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
  • Packing: B (Bulk Package), T (Tape & Reel)

Environmental Data

  • Operating Temperature: -55 to +125 (Including coils self-temperature rise)

Test Equipment

  • Inductance (L): WK3260B LCR meter or equivalent
  • Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
  • DC Resistance (DCR): Chroma 16502 or equivalent

Maximum Voltage

  • Absolute maximum voltage: 30VDC

Packaging Specifications

Tape and Reel Dimensions:

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SMS0650 16.0 12.0 7.5 16.4 100 13 330 1000 3000 12,000

Cover tape peel off condition:

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Reliability Testing

Refer to the provided document for detailed reliability test items, requirements, and test methods, including Terminal Strength, Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low temperature Storage, High temperature Storage, Damp Heat, Heat endurance of Reflow soldering, Resistance to solvent test, Overload test, and Voltage resistance test.

Recommended Reflow Soldering Curve

Users should adjust and confirm reflow conditions based on their specific environment and equipment. The provided graph serves as a reference.

Reminders for Using These Products

  • Storage: Within 12 months, under conditions of 5~40C and 35~65% RH.
  • Environment: Avoid gas corrosive environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals due to hand oils. Handle carefully to prevent damage.
  • Bending: Do not excessively bend terminals.
  • Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Keep away from magnets or magnetic objects.
  • Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Perform within specified conditions to avoid performance degradation or reduced lifespan.
  • Thermal Design: Account for self-heating when power is on.
  • Non-magnetic Shield Type: Careful coil layout is needed to prevent malfunctions due to magnetic interference.

2410121647_LanTu-Micro-SMS0650-3R3MT_C5127470.pdf


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