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Multilayer Chip Ferrite Power Inductor FH CMP201209UD2R2MT Featuring Silver Layer and RoHS Compliance

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Multilayer Chip Ferrite Power Inductor FH CMP201209UD2R2MT Featuring Silver Layer and RoHS Compliance

Current - Saturation (Isat) : -

Description : 0805 Fixed Inductors RoHS

Mfr. Part # : CMP201209UD2R2MT

Model Number : CMP201209UD2R2MT

Package : 0805

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Product Overview

The CMP201209 Series is a Multilayer Chip Ferrite Power Inductor designed for various electronic applications. These inductors are constructed with a ferrite or ceramic body, inner electrodes made of pure silver, and terminal electrodes featuring silver and Ni/Sn plating. They offer reliable performance with precise electrical characteristics, making them suitable for integration into complex electronic circuits.

Product Attributes

  • Product Type: Multilayer Chip Ferrite Power Inductor
  • Series: CMP201209-D Series
  • Manufacturer: Inductor Company (Implied)
  • Material (Body): Ferrite (Nickel-Copper-Zinc system)
  • Material (Inner Electrode): Pure Silver (Ag)
  • Material (Terminal Electrode): Silver Layer (Ag Layer), Ni/Sn Plating
  • Plating: Ni/Sn
  • Certifications: RoHS compliant (if specified as "Unitary lead free")

Technical Specifications

Part Number Tolerance (%) Inductance (H) RDC () max Test Frequency (MHz) Test Voltage (mV) SRF (MHz) min Rated Current (mA) max Dimensions (LWT) mm
CMP201209VD47NMT 20 0.047 0.10 1 50 280 1100 2.01.20.9
CMP201209VD56NMT 20 0.056 0.10 1 50 280 1100 2.01.20.9
CMP201209VD68NMT 20 0.068 0.15 1 50 250 1100 2.01.20.9
CMP201209VD82NMT 20 0.082 0.15 1 50 250 1100 2.01.20.9
CMP201209VDR10MT 20 0.10 0.15 1 50 210 1100 2.01.20.9
CMP201209VDR12MT 20 0.12 0.15 1 50 200 1100 2.01.20.9
CMP201209VDR15MT 20 0.15 0.15 1 50 175 1100 2.01.20.9
CMP201209VDR18MT 20 0.18 0.15 1 50 160 1100 2.01.20.9
CMP201209VDR22MT 20 0.22 0.15 1 50 150 1100 2.01.20.9
CMP201209VDR27MT 20 0.27 0.15 1 50 130 1100 2.01.20.9
CMP201209VDR33MT 20 0.33 0.15 1 50 120 1100 2.01.20.9
CMP201209VDR39MT 20 0.39 0.15 1 50 110 1100 2.01.20.9
CMP201209VDR47MT 20 0.47 0.15 1 50 100 1100 2.01.20.9
CMP201209VDR56MT 20 0.56 0.36 1 50 100 800 2.01.20.9
CMP201209VDR68MT 20 0.68 0.36 1 50 95 800 2.01.20.9
CMP201209VDR82MT 20 0.82 0.36 1 50 90 800 2.01.20.9
CMP201209UD1R0MT 20 1.0 0.24 1 50 75 800 2.01.20.9
CMP201209UD1R2MT 20 1.2 0.24 1 50 65 800 2.01.20.9
CMP201209UD1R5MT 20 1.5 0.30 1 50 60 700 2.01.20.9
CMP201209UD1R8MT 20 1.8 0.36 1 50 55 600 2.01.20.9
CMP201209UD2R2MT 20 2.2 0.36 1 50 50 600 2.01.20.9
CMP201209UD2R7MT 20 2.7 0.36 1 50 45 600 2.01.20.9
CMP201209UD3R3MT 20 3.3 0.40 1 50 41 350 2.01.20.9
CMP201209UD3R9MT 20 3.9 0.40 1 50 38 350 2.01.20.9
CMP201209UD4R7MT 20 4.7 0.40 1 50 35 350 2.01.20.9
CMP201209XD5R6MT 20 5.6 0.50 1 50 32 250 2.01.20.9
CMP201209XD6R8MT 20 6.8 0.50 1 50 29 250 2.01.20.9
CMP201209XD8R2MT 20 8.2 0.56 1 50 26 250 2.01.20.9
CMP201209XD100MT 20 10 0.56 1 50 24 250 2.01.20.9
CMP201209XD120MT 20 12 0.56 1 50 22 250 2.01.20.9
CMP201209JD150MT 20 15 0.65 1 50 19 100 2.01.20.9
Dimensions (mm): L: 2.00.20, W: 1.20.20, T: 0.90.20, Terminal electrode width: 0.50.3
Operating Temperature Range: -40+85
Packaging: Tape & Reel (T), 4000 Pcs/Reel, 40000 Pcs/Box, 240000 Pcs/Case

Packaging Details

Item Specification
Reel Dimensions (mm) A: 1782.0, B: 22.02.0, C: 12.51.5, N: 572.0, G: 8, CF-8
Taping Dimensions (mm) Refer to detailed drawings in source document.
Peeling Force (Cover Tape) 0.1N0.7N (at 300mm/min speed)
Packaging Quantity (Pcs) 201209: 4000/Reel, 40000/Box, 240000/Case

Recommended Conditions & Notes

  • Recommended Soldering Conditions: Suitable for reflow soldering. Temperature difference between solder and ferrite surface should not exceed 150 during pre-heating, and 100 during cooling. Manual soldering: Iron temperature 350 (max 30W), duration < 5s.
  • Cleaning Conditions: Max temperature 60, min time 1 minute, max ultrasonic power 200W.
  • Storage Requirements: Storage period within 1 year from inspection date; check solderability if exceeded. Storage conditions: Temperature -10 to +40, Relative Humidity 30% to 70%. Avoid corrosive substances, moisture, dust, heat shock, vibration, and direct sunlight. Store in airtight packaging.
  • ODS Usage: CCl4, HCFC, etc. are not used in the production process.
  • Notes: Products are RoHS compliant if labeled "Unitary lead free". Ensure thorough evaluation when integrating into customer products. The manufacturer is not liable for failures due to deviations from intended use.

2410121310_FH-CMP201209UD2R2MT_C139241.pdf


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