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High Frequency Chip Inductors with Ceramic Body and Silver Electrodes Including FH VHF160808H1N0ST

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High Frequency Chip Inductors with Ceramic Body and Silver Electrodes Including FH VHF160808H1N0ST

Current Rating : 500mA

Inductance : 1nH

Frequency - Self Resonant : 10GHz

Current - Saturation (Isat) : -

DC Resistance(DCR) : 50mΩ

Type : Multilayer inductor;High-frequency inductor

Ratings : -

Q @ Frequency : 8@100MHz

Description : 500mA 1nH 50mΩ 0603 Fixed Inductors RoHS

Mfr. Part # : VHF160808H1N0ST

Model Number : VHF160808H1N0ST

Package : 0603

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Product Overview

The VHF160808H Series Chip High Frequency Inductors are designed for demanding electronic applications. These multilayer chip inductors utilize a ceramic body and internal silver electrodes, with terminal electrodes plated in Ni/Sn. They are suitable for reflow soldering and are manufactured to meet stringent reliability standards. The series offers a wide range of inductance values, making them versatile for various high-frequency circuit designs.

Product Attributes

Product Type: Chip high frequency inductors
Series: VHF160808H Series
Body Material: Ceramic (Al2O3)
Internal Electrode Material: Pure Silver (Ag)
Terminal Electrode Material: Silver layer (Ag layer) with Ni/Sn plating
Packaging: Tape & Reel (T)
RoHS Compliance: Available as "Unitary lead free" products

Technical Specifications

Part No.	Inductance (nH)	Q Value (min)	DC Resistance () max	Test Frequency (MHz)	Test Voltage (mV)	SRF (MHz) min	Rated Current (mA) max	Dimensions (LWT) mm
VHF160808H1N0T	1.0	8	0.05	100	50	10000	500	1.60.80.8
VHF160808H1N2T	1.2	8	0.05	100	50	10000	500	1.60.80.8
VHF160808H1N5T	1.5	8	0.10	100	50	6000	500	1.60.80.8
VHF160808H1N8T	1.8	8	0.10	100	50	6000	500	1.60.80.8
VHF160808H2N0T	2.0	8	0.10	100	50	6000	500	1.60.80.8
VHF160808H2N2T	2.2	8	0.10	100	50	6000	500	1.60.80.8
VHF160808H2N4T	2.4	8	0.12	100	50	6000	500	1.60.80.8
VHF160808H2N7T	2.7	10	0.12	100	50	6000	500	1.60.80.8
VHF160808H3N3T	3.3	10	0.15	100	50	6000	500	1.60.80.8
VHF160808H3N6T	3.6	10	0.16	100	50	6000	500	1.60.80.8
VHF160808H3N9T	3.9	10	0.16	100	50	6000	500	1.60.80.8
VHF160808H4N3T	4.3	10	0.18	100	50	6000	500	1.60.80.8
VHF160808H4N7T	4.7	1	0.20	100	50	6000	500	1.60.80.8
VHF160808H5N1T	5.1	10	0.25	100	50	5500	500	1.60.80.8
VHF160808H5N6T	5.6	10	0.25	100	50	5000	500	1.60.80.8
VHF160808H6N8T	6.8	10	0.30	100	50	5000	500	1.60.80.8
VHF160808H7N5T	7.5	10	0.35	100	50	4500	500	1.60.80.8
VHF160808H8N2T	8.2	10	0.35	100	50	4500	500	1.60.80.8
VHF160808H9N1T	9.1	10	0.40	100	50	3500	500	1.60.80.8
VHF160808H10NT	10	12	0.40	100	50	3500	300	1.60.80.8
VHF160808H12NT	12	12	0.45	100	50	3000	300	1.60.80.8
VHF160808H15NT	15	12	0.50	100	50	2300	300	1.60.80.8
VHF160808H18NT	18	12	0.55	100	50	2200	300	1.60.80.8
VHF160808H22NT	22	12	0.60	100	50	2000	300	1.60.80.8
VHF160808H24NT	24	12	0.60	100	50	2000	300	1.60.80.8
VHF160808H27NT	27	12	0.65	100	50	1700	300	1.60.80.8
VHF160808H33NT	33	12	0.70	100	50	1500	300	1.60.80.8
VHF160808H36NT	36	12	0.70	100	50	1400	300	1.60.80.8
VHF160808H39NT	39	12	0.70	100	50	1400	300	1.60.80.8
VHF160808H47NT	47	12	0.70	100	50	1200	300	1.60.80.8
VHF160808H56NT	56	12	0.75	100	50	1100	300	1.60.80.8
VHF160808H68NT	68	12	0.85	100	50	900	300	1.60.80.8
VHF160808H82NT	82	8	1.00	100	50	800	300	1.60.80.8
VHF160808HR10T	100	8	1.20	100	50	700	300	1.60.80.8
VHF160808HR12T	120	8	1.40	50	50	600	200	1.60.80.8
VHF160808HR15T	150	8	1.60	50	50	500	200	1.60.80.8
VHF160808HR18T	180	8	1.90	50	50	400	200	1.60.80.8
VHF160808HR22T	220	8	2.40	50	50	350	200	1.60.80.8
VHF160808HR27T	270	8	2.60	50	50	350	150	1.60.80.8
VHF160808HR33T	330	8	2.80	50	50	350	150	1.60.80.8
VHF160808HR39T	390	8	3.20	50	50	300	150	1.60.80.8
VHF160808HR43T	430	8	3.40	50	50	280	150	1.60.80.8
VHF160808HR47T	470	8	3.60	50	50	250	150	1.60.80.8

Inductance Tolerance Options:

Ls < 6.8nH: S (0.3nH), D (0.5nH)
Ls 6.8nH: J (5%), K (10%)

Note:

VHF160808H series products have no compensation value, meaning the product test center value is equal to the nominal value.

Reliability Testing Items

Item	Requirements	Test Methods and Remarks
Operating Temperature Range	-40+85
Solder ability	At least 95% of terminal electrode should be covered with solder.	Preheating temp: 120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temp: 2455, Immersion depth: 10mm, Duration: 51s. Dip to flux: 3~5s.
Resistance to Soldering Heat	At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: 10% (for H material), Q value change: 20% (ceramic).	Preheating temp: 120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temp: 2605, Immersion depth: 10mm, Duration: 101s. Dip to flux: 3~5s.
Adhesion of electrode	The termination and body should be no damage.	Applied force: 7N for 1608 series. Keep time: 101S.
Low temperature resistance	No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%.	Temperature: -402. Testing time: 1000+240/-0 h.
Bending strength	No mechanical damage.	Testing board: glass epoxy-resin substrate. Compression speed: 0.5mm/s, Curvature: 2mm, Hold time: 20s 1s.
Vibration	No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%.	Amplitude: 1.5mm. Test time: 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz (1 minute cycle).
High temperature resistance	No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%.	Testing time: 1000+240/-0 h. Temperature: 852.
Static Humidity	No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%.	Humidity: 90%~95% RH. Temperature: 602. Testing time: 1000+240/-0 h.
High temperature load	No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%.	Imposed current: rated current. Testing time: 1000+240/-0 h. Temperature: 852.
Temperature Shock	No mechanical damage. Inductance change: within 10%. Q value change (ceramic): within 20%.	Temperature: -55 (303 min) +125 (303 min). Number of cycles: 100.

Note: When testing electrical performance, measurements shall be made after 242hrs of recovery under standard conditions.

Product Packaging

Size	Pieces per Reel	Pieces per Box	Pieces per Case
160808	4000	40000	240000

Recommended Soldering Conditions

Reflow Soldering:

Temperature difference between solder and ferrite surface during pre-heating: max 150.
Temperature difference between product surface and solvent during cooling: max 100.
Soldering should be performed within the allowable range of the reflow soldering profile curve.

Iron Soldering:

Soldering Iron Temperature: 350 (Max)
Power: 30W (Max)
Soldering Time: < 5S (Avoid contact with terminal electrodes)

Cleaning

Cleaning Temperature: 60 (Max)
Cleaning Time: 1 minute (Min)
Ultrasonic Power: 200W (Max)

Storage Requirements

Storage Period:

Within 1 year from the ex-factory inspection date. If exceeding 1 year, solderability must be checked before use.

Storage Conditions:

Warehouse Conditions: Temperature: -10+40, Relative Humidity: 3070%.
Avoid storage in corrosive substances (e.g., sulfur, chlorine gas, acid) to prevent electrode oxidation.
Store on shelves to prevent influence from moisture and dust.
Avoid heat shock, vibration, and direct sunlight.
Products should be stored in sealed packaging.

Usage Of ODS (Ozone Depleting Substances)

The company does not use ODS such as CCl4 and HCFC in its production process.

Notes

If the product is marked as "Unitary lead free", it complies with RoHS directive requirements.
This product specification guarantees the quality of the product as a single unit. Please ensure your product has been evaluated and confirmed against your specifications when our product is mounted.
The company does not warrant against failure caused by any use of our product that deviates from the intended use described in this product specification.

2410121258_FH-VHF160808H1N0ST_C1027.pdf

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