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Multilayer Chip Ferrite Power Inductor FH CMP321609UD2R2MT Featuring Silver Layer Terminal Electrodes

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Multilayer Chip Ferrite Power Inductor FH CMP321609UD2R2MT Featuring Silver Layer Terminal Electrodes

Current - Saturation (Isat) : -

Description : 1206 Fixed Inductors RoHS

Mfr. Part # : CMP321609UD2R2MT

Model Number : CMP321609UD2R2MT

Package : 1206

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Product Overview

The CMP321609-D Series is a Multilayer Chip Ferrite Power Inductor designed for various electronic applications. These inductors are constructed with a ferrite or ceramic body, inner electrodes made of pure silver, and terminal electrodes with a silver layer and Ni/Sn plating. They offer reliable performance with defined electrical characteristics, including inductance, DC resistance, and rated current, suitable for integration into electronic circuits requiring power inductance components.

Product Attributes

  • Product Type: Multilayer Chip Ferrite Power Inductor
  • Series: CMP321609-D Series
  • Body Material: Ferrite (Ni-Cu-Zn system) or Ceramic
  • Inner Electrode Material: Pure Silver (Ag)
  • Terminal Electrode Material: Silver Layer (Ag) with Ni/Sn Plating
  • Packaging: Tape & Reel (T)
  • Certifications: RoHS compliant (if indicated as "Unitary lead free")

Technical Specifications

Part Number Dimensions (LWT) (mm) Tolerance (%) Inductance (H) RDC () max Test Frequency (MHz) Test Voltage (mV) SRF (MHz) min Rated Current (mA) max
CMP321609UD1R0MT 3.21.60.9 20 1.0 0.15 1 50 60 1200
CMP321609UD1R2MT 3.21.60.9 20 1.2 0.15 1 50 65 1200
CMP321609UD1R5MT 3.21.60.9 20 1.5 0.17 1 50 60 1000
CMP321609UD1R8MT 3.21.60.9 20 1.8 0.24 1 50 55 900
CMP321609UD2R2MT 3.21.60.9 20 2.2 0.24 1 50 50 900
CMP321609UD2R7MT 3.21.60.9 20 2.7 0.30 1 50 45 800
CMP321609UD3R3MT 3.21.60.9 20 3.3 0.30 1 50 41 800
CMP321609UD3R9MT 3.21.60.9 20 3.9 0.38 1 50 38 700
CMP321609UD4R7MT 3.21.60.9 20 4.7 0.38 1 50 35 700
CMP321609UD5R6MT 3.21.60.9 20 5.6 0.45 1 50 32 500
CMP321609XD6R8MT 3.21.60.9 20 6.8 0.45 1 50 29 500
CMP321609XD8R2MT 3.21.60.9 20 8.2 0.55 1 50 26 300
CMP321609XD100MT 3.21.60.9 20 10 0.55 1 50 24 300
CMP321609XD120MT 3.21.60.9 20 12 0.55 1 50 22 300
CMP321609JD150MT 3.21.60.9 20 15 0.65 1 50 19 100
CMP321609JD180MT 3.21.60.9 20 18 0.65 1 50 18 100
Item Requirements Test Methods and Remarks
Operating Temperature Range -40+85
Solder ability At least 95% of terminal electrode should be covered with solder Preheating temperature:120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth:10mm, Duration: 51s
Resistance to Soldering At least 95% of terminal electrode should be covered with solder. No mechanical damage. Inductance change: UD: 20%, XD: 25%, JD: 30% Preheating temperature: 120 to 150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth:10mm, Duration: 101s
Adhesion of electrode The termination and body should be no damage. Applied force: 10N for 3216 series. Keep time: 101S
Low temperature resistance No mechanical damage. Inductance change: within 10% Temperature: -402, Testing time: 1000 24h
Bending strength No mechanical damage. Testing board: glass epoxy-resin substrate, For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s
Vibration No mechanical damage. Inductance change: within 10% Amplitude modulation: 1.5mm, Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min.
High temperature resistance No mechanical damage. Inductance change: within 10% Testing time: 1000 24h, Temperature: 852
Static Humidity No mechanical damage. Inductance change: within 10% Humidity: 90% to 95% RH, Temperature: 602, Testing time: 1000 24h
High temperature load No mechanical damage. Inductance change: within 10% Impose current: at rated current, Testing time: 1000 24h, Temperature: 852
Temperature Shock No mechanical damage. Inductance change: within 10% Temperature: -40 for 303min +85 for 303min, Number of cycles: 32
Size Reel Quantity (Pcs) Box Quantity (Pcs) Case Quantity (Pcs)
321609 4000 40000 240000
Soldering Conditions Details
Reflow Soldering Pre-heating temperature difference between solder and ferrite surface: max 150. Cooling temperature difference after soldering: max 100. Products should be soldered within the allowable range indicated by the profile curve.
Iron Soldering Soldering Iron Temperature: 350 (Max), Power: 30W (Max), Soldering Time: < 5S. Avoid applying the tip of the soldering iron to the terminal electrodes.
Cleaning Conditions Details
Temperature 60 (max)
Time 1 minute (min)
Ultrasonic Power 200W (max)
Storage Requirements Details
Storage Period Within 1 year from the factory inspection date. If exceeding 1 year, solderability must be checked before use.
Storage Conditions Temperature: -10 to +40, Relative Humidity: 30 to 70%. Store in a warehouse away from corrosive substances, humidity, dust, heat shock, vibration, and direct sunlight. Products should be under airtight packaged condition.
ODS (Ozone Depleting Substances) Usage Details
Usage The company does not use ODS such as CCl4 (Carbon Tetrachloride), HCFC in its production process.
Notes Details
Lead Free If the product is labeled "Unitary lead free", it complies with RoHS directive requirements.
Product Integration This specification guarantees the quality of the product as a single unit. Ensure your product has been evaluated and confirmed against your specifications when this product is mounted.
Usage Deviation The company cannot warrant against failure caused by any use of the product that deviates from the intended use described in this specification.

2410121310_FH-CMP321609UD2R2MT_C139249.pdf


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