High Current Handling LanTu Micro SMS252010-3R3MT Common Mode Choke with RoHS Halogen Free Compliance

Common Mode Choke - SMS252010 Series

Product Overview

The SMS252010 Series is an ultra-high current SMD power inductor designed with a thin profile, low DC resistance, and exceptional current handling capabilities. Featuring magnetic shielding for strong anti-electromagnetic interference, it is ideal for high-density installations. Its integral construction ensures high reliability and superior vibration resistance. With extremely low DCR and ultra-low AC losses, these inductors are suitable for high switching frequencies. They are compliant with RoHS, Halogen Free, and REACH standards.

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Product Type: Common Mode Choke / Molding SMD Power Inductor
• Series: SMS252010
• Certifications: RoHS, Halogen Free, REACH Compliance
• Origin: Shenzhen, China

Applications

• DC/DC converters for CPUs in Notebook PCs
• Mobile phones, tablets, HDDs, DVCs, PDAs, 5G modules
• Servers, base stations
• Various DC-DC conversion power modules

Technical Specifications

Product Identification

SMS 252010 R47 M T

• Inductance: e.g., 0.47 uH
• External Dimensions (LWH): 252010 (2.52.01.0 mm)
• Type: SMS (Molding SMD Power Inductor)
• Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
• Packing: B (Bulk Package), T (Tape & Reel)

Shape and Dimensions

Electrical Characteristics

Definitions:
- Saturation Current (Isat): DC current at which inductance drops 30% from its value without current.
- Heat Rating Current (Irms): The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat or Irms.
- Note: Part temperature is influenced by circuit design, component placement, PCB trace size and thickness, airflow, and other cooling provisions. Verify part temperature in the end application.

Environmental Data

• Operating Temperature: -40 to +125 (Including coil self-temperature rise)

Packaging

Tape and Reel Specifications:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180

Recommended Reflow Soldering Curve

Refer to the provided graph for recommended reflow conditions. Adjust and confirm based on user's environment and equipment.

Reminders for Using These Products

• Storage: Within 12 months, under conditions of 5~40C and 35~65% RH.
• Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
• Handling: Avoid direct contact with terminals due to hand oils affecting solderability. Handle with care to prevent damage.
• Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
• Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
• Magnetic Fields: Keep away from magnets or magnetic objects.
• Preheating: Preheat before soldering; temperature difference between solder and chip should not exceed 150C.
• Soldering Corrections: Perform within specified conditions; overheating can cause issues.
• Thermal Design: Allow sufficient margin for self-heating when power is on.
• Layout: For non-magnetic shield types, careful coil placement is needed to avoid malfunction due to magnetic interference.

High Current Handling LanTu Micro SMS252010-3R3MT Common Mode Choke with RoHS Halogen Free Compliance Images