Product Overview
The STC201612 series T-core molding structure power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installation and offer excellent anti-electromagnetic interference due to their magnetic shielding. These thin-profile inductors feature low DC resistance and ultra-high current capabilities, making them ideal for high switching frequencies. Their T-core molding structure ensures high reliability and superior vibration resistance. Applications include DC/DC converters for notebook CPUs, mobile phones, tablets, HDDs, DVCs, PDAs, 5G modules, servers, base stations, and various DC-DC power modules.
Product Attributes
- Brand: LANTU MICRO
- Origin: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Certifications: RoHS, Halogen Free, REACH Compliance
- Type: T-core molding Structure Power Inductors
- Construction: Magnetic shielding type
Technical Specifications
| Part No. | Inductance (H) @ 1MHz, 1.0V | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Saturation Current (A) Max | Heat Rating Current (A) Typical | Heat Rating Current (A) Max | Dimensions (LWH) (mm) |
| STC201612-R47M | 0.47 | 20% | 6.7 | 6.0 | 6.7 | 6.0 | | | 2.01.61.2 |
| STC201612-1R0M | 1.0 | 20% | 5.0 | 4.5 | 5.0 | 4.5 | | | 2.01.61.2 |
| STC201612-1R5M | 1.5 | 20% | 4.0 | 3.5 | 4.0 | 3.5 | | | 2.01.61.2 |
| STC201612-2R2M | 2.2 | 20% | 3.1 | 2.7 | 3.3 | 2.9 | | | 2.01.61.2 |
Environmental Data:
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Product Identification Example: STC 201612 1R0 M T
- Type: STC (T-core molding Structure Power Inductors)
- Inductance: 1.0 uH
- External Dimensions (LWH) (mm): 201612 (2.01.61.2)
- Inductance Tolerance: M (20%)
- Packing: T (Tape & Reel)
Recommended Land Pattern Dimensions (mm):
| Part No. | A | B | C | D | E | F | H |
| STC201612 | 2.00.2 | 1.60.2 | 1.2Max | 0.70.2 | 2.1Typ | 0.5Typ | 1.7Typ |
Packaging:
- Tape & Reel Specifications:
- Tape Dimension (mm): W=8, P=4, W1=3.5
- Reel Dimensions (mm): A=8.4, B=60, C=13, D=178
- Packing Quantity: Reel: 3000 PCS, Inside Box: 30,000 PCS, Outside Carton: 120,000 PCS
Reliability Testing:
- Terminal Strength: Meets specified force and duration requirements for SMT and DIP terminals.
- Resistance to Flexure: No visible mechanical damage, meets flexure and speed requirements.
- Dropping Test: No case deformation or appearance change, no short/open circuits after specified drops.
- Solderability: Meets wetting and solder coverage requirements.
- Vibration Test: No visible mechanical damage, inductance and Q factor changes within specified limits.
- Thermal Shock: No visible mechanical damage, inductance and Q factor changes within specified limits after 100 cycles.
- Low Temperature Storage: No visible mechanical damage, inductance and Q factor changes within specified limits after 962 hours.
- High Temperature Storage: No visible mechanical damage, inductance and Q factor changes within specified limits after 962 hours.
- Damp Heat (Steady States): No visible mechanical damage, inductance and Q factor changes within specified limits after 962 hours.
- Heat endurance of Reflow soldering: No significant defects, inductance, Q factor, and DCR changes within specified limits.
- Resistance to solvent test: No case deformation or appearance change.
- Overload test: No smoke, peculiar smell, or fire; characteristics normal after test.
- Voltage resistance test: No breakdown during test; characteristics normal after test.
Recommended Reflow Soldering Curve:
Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific equipment and process conditions.
Reminders for Using These Products:
- Storage: Within 12 months, under 5~40C and 35~65% RH.
- Environment: Avoid gas corrosive environments (salt, acid, alkali).
- Handling: Avoid direct contact with terminals due to hand oils. Handle carefully to prevent damage.
- Terminal Bending: Do not bend terminals excessively.
- Cleaning: Do not rinse coils; contact manufacturer if cleaning is required.
- Magnetic Fields: Keep away from magnets or magnetic objects.
- Preheating: Preheat components before soldering; temperature difference should not exceed 150C.
- Soldering Corrections: Perform within specified conditions; overheating may cause issues.
- Thermal Design: Account for self-heating when power is on.
- Non-Magnetic Shield Type: Careful layout is required to prevent malfunction due to magnetic interference.
2410121442_LanTu-Micro-STC201612-R47MT_C22468835.pdf
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T core molding structure power inductors LanTu Micro STC201612-R47MT suitable for HDDs DVCs and 5G modules Images
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