Product Overview
The STC303020 series T-core molding structure power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installation with a thin profile, offering low DC resistance and ultra-high current capabilities. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors provide high reliability and excellent vibration resistance due to their T-core molding structure. They are ideal for applications requiring extremely low DCR and ultra-low AC losses at high switching frequencies, such as DC/DC converters for notebook CPUs, mobile phones, tablets, servers, and base stations.
Product Attributes
- Brand: LANTU
- Origin: SHENZHEN, CHINA
- Certifications: RoHS, Halogen Free, REACH Compliance
- Structure Type: T-core molding structure
- Shielding: Magnetic shielding type
Technical Specifications
| Model Number | Inductance (H) | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Saturation Current (A) Max | Heat Rating Current (A) Typical | Heat Rating Current (A) Max | Dimensions (LWH mm) | Operating Temperature (C) |
| STC303020-1R0M | 1.0 | 20% | 14 | 20 | 8.0 | 7.3 | 6.5 | 6.0 | 3.03.02.0 | -40 to +125 |
| STC303020-1R5M | 1.5 | 20% | 19 | 25 | 7.0 | 6.5 | 6.3 | 5.8 | 3.03.02.0 | -40 to +125 |
| STC201612-2R2M | 2.2 | 20% | 37 | 45 | 6.0 | 5.5 | 4.7 | 4.3 | 2.01.61.2 | -40 to +125 |
| STC201612-3R3M | 3.3 | 20% | 52 | 63 | 5.9 | 5.4 | 4.5 | 4.0 | 2.01.61.2 | -40 to +125 |
| STC201612-4R7M | 4.7 | 20% | 60 | 73 | 4.8 | 4.0 | 4.2 | 3.8 | 2.01.61.2 | -40 to +125 |
| STC201612-6R8M | 6.8 | 20% | 107 | 135 | 4.5 | 3.8 | 3.2 | 3.0 | 2.01.61.2 | -40 to +125 |
| STC201612-100M | 10 | 20% | 135 | 160 | 3.8 | 3.3 | 2.5 | 2.2 | 2.01.61.2 | -40 to +125 |
Product Identification
Model Format: STC 303020 1R0 M T
- Type: STC (T-CORE Structure molding Patch Power Inductor)
- Inductance: e.g., 1R0 = 1.0 H
- External Dimensions (LWH mm): e.g., 303020 = 3.03.02.0
- Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing: B (Bulk Package), T (Tape & Reel)
Environmental Data
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Test Equipment
- Inductance (L): WK3260B LCR meter or equivalent
- Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Reliability Testing
The product undergoes various reliability tests including Terminal Strength (SMT & DIP), Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low Temperature Storage, High Temperature Storage, Damp Heat (Steady States), Heat endurance of Reflow soldering, Resistance to solvent test, Overload test, and Voltage resistance test, with specified requirements and test methods detailed in the original documentation.
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Users should adjust and confirm these conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, at 5~40C and 35~65% RH.
- Environment: Avoid gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils. Handle carefully to prevent damage. Do not bend terminals excessively.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose to magnets or magnetic fields.
- Soldering: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C. Soldering corrections after mounting must be within specifications.
- Thermal Design: Account for self-heating when power is on.
- Non-magnetic Shield Type: Careful layout is needed to avoid malfunction due to magnetic interference.
2410121647_LanTu-Micro-STC303020-100MT_C22468845.pdf
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Power Inductors Featuring LanTu Micro STC303020-100MT T Core Molding Structure for Low DC Resistance Images
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