Shielded SMD Power Inductors - SDRI74 Series
Product Overview
The SDRI74 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power applications. These inductors feature a closed magnetic circuit design to minimize leakage flux, high saturation current, and low DC resistance. Their highly accurate dimensions ensure suitability for automatic mounting processes. Available in a variety of package sizes and a wide inductance range, these inductors are RoHS, Halogen Free, and REACH compliant, making them ideal for DC/DC converters, power supplies for VTRs, LCD televisions, notebook PCs, and portable communication equipment.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Series: SDRI74
- Origin: SHENZHEN, CHINA
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
General Specifications
| Feature | Description |
| High Saturation Current | Yes |
| Low DCR | Yes |
| Closed Magnetic Circuit Design | Reduces leakage |
| Automatic Mounting Compatibility | High accuracy dimensions |
| Package Size Variety | Yes |
| Wide Inductance Range | Yes |
| Operating Temperature | -55 to +125 (including coil self-temperature rise) |
Product Identification
| Component | Description |
| SDRI | Shielded SMD Power Inductors (Closed magnetic circuit) |
| 74 | External Dimensions (LWH): 7.57.54.5 mm |
| Inductance Value | e.g., 470 (47 H) |
| Inductance Tolerance | J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% |
| Packing | T: Tape & Reel, B: Bulk Package |
External Dimensions (mm)
| Part No. | A (Max) | B (Max) | C (Max) | D | E | F | G | H |
| SDRI74 | 7.5 | 7.5 | 4.5 | 1.8 | 5.0 | 1.6 | 4.8 | 2.2 |
Electrical Characteristics (Electrical specifications at 25)
| Part No. | Inductance L(H) @0A | Tole | Test Freq Min | Test Freq | DCR () Max | Saturation Current Isat (A) Max | Temperature Rise Current Irms (A) Max |
| SDRI74-2R2N | 2.2 | 30% | 100KHz | 1MHz | 0.0147 | 5.20 | 5.00 |
| SDRI74-3R3N | 3.3 | 30% | 100KHz | 1MHz | 0.0214 | 4.60 | 4.00 |
| SDRI74-4R7N | 4.7 | 30% | 100KHz | 1MHz | 0.0310 | 3.80 | 3.40 |
| SDRI74-6R8N | 6.8 | 30% | 100KHz | 1MHz | 0.035 | 3.20 | 2.30 |
| SDRI74-8R2N | 8.2 | 30% | 100KHz | 1MHz | 0.042 | 3.00 | 2.10 |
| SDRI74-100N | 10 | 30% | 100KHz | 1MHz | 0.049 | 2.95 | 1.84 |
| SDRI74-120M | 12 | 20% | 100KHz | 1MHz | 0.058 | 2.85 | 1.71 |
| SDRI74-150M | 15 | 20% | 100KHz | 1MHz | 0.081 | 2.80 | 1.47 |
| SDRI74-180M | 18 | 20% | 100KHz | 1MHz | 0.091 | 2.50 | 1.31 |
| SDRI74-220M | 22 | 20% | 100KHz | 1MHz | 0.110 | 2.10 | 1.23 |
| SDRI74-270M | 27 | 20% | 100KHz | 1MHz | 0.150 | 1.90 | 1.12 |
| SDRI74-330M | 33 | 20% | 100KHz | 1MHz | 0.170 | 1.80 | 0.96 |
| SDRI74-390M | 39 | 20% | 100KHz | 1MHz | 0.230 | 1.70 | 0.91 |
| SDRI74-470M | 47 | 20% | 100KHz | 1MHz | 0.260 | 1.50 | 0.88 |
| SDRI74-560M | 56 | 20% | 100KHz | 1MHz | 0.350 | 1.32 | 0.75 |
| SDRI74-680M | 68 | 20% | 100KHz | 1MHz | 0.380 | 1.08 | 0.69 |
| SDRI74-820M | 82 | 20% | 100KHz | 1MHz | 0.430 | 1.05 | 0.61 |
| SDRI74-101M | 100 | 20% | 100KHz | 0.796MHz | 0.610 | 1.02 | 0.60 |
| SDRI74-121M | 120 | 20% | 100KHz | 0.796MHz | 0.660 | 0.98 | 0.52 |
| SDRI74-151M | 150 | 20% | 100KHz | 0.796MHz | 0.880 | 0.95 | 0.46 |
| SDRI74-181M | 180 | 20% | 100KHz | 0.796MHz | 0.980 | 0.74 | 0.42 |
| SDRI74-221M | 220 | 20% | 100KHz | 0.796MHz | 1.170 | 0.70 | 0.36 |
| SDRI74-271M | 270 | 20% | 100KHz | 0.796MHz | 1.640 | 0.57 | 0.34 |
| SDRI74-331M | 330 | 20% | 100KHz | 0.796MHz | 1.860 | 0.56 | 0.32 |
| SDRI74-391M | 390 | 20% | 100KHz | 0.796MHz | 2.850 | 0.45 | 0.29 |
| SDRI74-471M | 470 | 20% | 100KHz | 0.796MHz | 3.010 | 0.45 | 0.26 |
| SDRI74-561M | 560 | 20% | 100KHz | 0.796MHz | 3.620 | 0.43 | 0.23 |
| SDRI74-681M | 680 | 20% | 100KHz | 0.796MHz | 4.630 | 0.37 | 0.22 |
| SDRI74-821M | 820 | 20% | 100KHz | 0.796MHz | 5.200 | 0.35 | 0.20 |
| SDRI74-102M | 1000 | 20% | 100KHz | 0.796MHz | 6.000 | 0.33 | 0.18 |
Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Note: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Packaging Information
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension H (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
| SDRI74 | 16 | 12 | 11.5 | 16.5 | 100 | 13 | 330 | 1000 | 3000 | 12,000 |
Reliability Testing Summary
| Test Item | Requirements | Test Method Reference |
| Terminal Strength | Meet specified force and duration requirements without loose terminals. | GB/T 2423.60-2008 (SMT/DIP) |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997 |
| Dropping | No case deformation, appearance change, short or open circuit. | GB/T 2423.7-2018 |
| Solderability | Exceed 75% wetting coverage, 95% minimum solder coverage on terminals. | GB/T 2423.28-2005 |
| Vibration | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | GB/T 2423.10-2019 |
| Thermal Shock | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | GB/T 2423.22-2012 Method Na |
| Low Temperature Storage | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | GB/T 2423.1-2008 Method Ab |
| High Temperature Storage | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | GB/T 2423.2-2008 Method Bb |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | GB/T 2423.3-2016 |
| Heat endurance of Reflow soldering | No significant defects; L/L 10%; Q/Q 30%; DCR/DCR 10%. | GJB 360B-2009 |
| Resistance to solvent test | No case deformation, appearance change, or obliteration of marking. | IEC 68-2-45:1993 |
| Overload test | No smoke, odor, or fire during test; characteristics normal after test. | JIS C5311-6.13 |
| Voltage resistance test | No breakdown during test; characteristics normal after test. | MIL-STD-202G Method 301 |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, under 5~40C and 35~65% RH. Soldering of terminal electrodes may deteriorate if storage period elapses.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle products carefully to prevent damage from dropping or inappropriate removal.
- Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip temperature should not exceed 150C.
- Soldering Corrections: Corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
- Thermal Design: Allow sufficient margin for thermal design due to self-heating when power is ON.
- Layout (Non-shielded): Carefully lay out coils for non-magnetic shield types to prevent malfunctions due to magnetic interference.
2410121442_LanTu-Micro-SDRI74-101MT_C5127590.pdf
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High Saturation Current Shielded SMD Power Inductors LanTu Micro SDRI74-101MT for VTR Power Supplies Images
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