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Automotive EMI Filter Very Large Current Low ESL Multilayer Ceramic Capacitor muRata NFM31HK104R1H3L 3 Terminals

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Automotive EMI Filter Very Large Current Low ESL Multilayer Ceramic Capacitor muRata NFM31HK104R1H3L 3 Terminals

Operating Temperature : -55℃~+125℃

Nominal Capacitance : 100nF

Voltage Rating : 50V

Tolerance : ±20%

DC Resistance(DCR) : 3mΩ

Current Rating : 6A

Description : 100nF ±20% 3mΩ SMD-3P,1.6x3.2mm Feed Through Capacitors RoHS

Mfr. Part # : NFM31HK104R1H3L

Model Number : NFM31HK104R1H3L

Package : SMD-3P,1.6x3.2mm

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Product Overview

The MURATA NFM31HK104R1H3 is a Very Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitor designed for EMI filtering in automotive electronic equipment. It offers low ESL and high current handling capabilities, making it suitable for demanding applications.

Product Attributes

Brand: MURATA
Series: NFM31HK
Product Type: Very Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitors (EMI Filter)
Application: Automotive Electronic equipment

Technical Specifications

Part Number	Capacitance	Capacitance Tolerance	Rated Voltage	Rated Current	DC Resistance (max.)	Operating Temperature Range	Storage Temperature Range	Package Size Code	Packaging	Standard Packing Quantity
NFM31HK104R1H3	0.1F	+/-20%	DC 50V	DC 6A	3m	-55 to 125	-55 to 125	3216M(1206)	180mm Reel Plastic Tape (W8P4)	3000 pcs./Reel

Test Item	Specification	Test Method (Ref. Standard: AEC-Q200)
Resistance to Soldering Heat	Appearance: No defects or abnormalities. Capacitance Change: Within +/-7.5% DC Resistance: 50m below	Solder bath method: Sn-3.0Ag-0.5Cu (Lead Free Solder), 270+/-5, 10+/-1s
Vibration	Appearance: No defects or abnormalities. Capacitance: Within the specified initial value. DC Resistance: 50m below	Simple harmonic motion 10Hz to 2000Hz to 10Hz, Total amplitude 1.5 mm or Acceleration amplitude 196m/s2 whichever is smaller, 20min per direction, 3 directions
Mechanical Shock	Appearance: No defects or abnormalities. Capacitance: Within the specified initial value. DC Resistance: 50m below	Half-sine waveform, Peak value 1500g, Holding Time 0.5ms, Velocity change 4.7m/s, 3 shocks per direction, 3 directions
Operational Life	Appearance: No defects or abnormalities. Capacitance Change: Within +/-12.5% DC Resistance: 50m below I.R. (Room Temp.): More than 50M	Mounting method: Solder on test substrate. Test Temperature: Maximum Operating Temperature +/-3. Test Time: 1000+/-12h. Test Voltage: 100% of the rated voltage.
Biased Humidity	Appearance: No defects or abnormalities. Capacitance Change: Within +/-12.5% DC Resistance: 50m below I.R. (Room Temp.): More than 50M	Mounting method: Solder on test substrate. Test Temperature: 85+/-3. Test Humidity: 80%RH to 85%RH. Test Time: 1000+/-12h. Test Voltage: Rated voltage and 1.3+0.2/-0Vdc (add 6.8k resister).
Temperature Cycling	Appearance: No defects or abnormalities. Capacitance Change: Within +/-7.5% DC Resistance: 50m below I.R. (Room Temp.): Within the specified initial value.	Mounting method: Solder on test substrate. Cycles: 1000 cycles.
High Temperature Exposure (Storage)	Appearance: No defects or abnormalities. Capacitance Change: Within +/-12.5% DC Resistance: 50m below I.R. (Room Temp.): More than 50M	Mounting method: Solder on test substrate. Test Temperature: Maximum Operating Temperature +/-3. Test Time: 1000+/-12h.
Terminal Strength	Appearance: No defects or abnormalities.	Applied Force: 9.8N, Holding Time: 30s
Board Flex	Appearance: No defects or abnormalities. Capacitance Change: Within +/-7.5% DC Resistance: 50m below	Mounting method: Reflow solder on test substrate. Flexure: 1mm, Holding Time: 30s
Voltage proof	Appearance: No defects or abnormalities. DC Resistance: Shown in Rated value.	Test Voltage: 300% of the rated voltage, Applied Time: 1s to 5s
Insulation Resistance(I.R.) (Room Temperature)	More than 1000M	Measurement Voltage: Rated Voltage, Charging Time: 2min
Solderability	95% of the terminations is to be soldered evenly and continuously.	Pre-treatment: Heat treatment at 155C for 4 hours. Flux: Rosin ethanol 25(mass)%. Solder: Sn-3.0Ag-0.5Cu (Lead Free Solder) at 245+/-5 .
Beam Load Test	Destruction value: More than 14.7N	Speed supplied the Stress Load: 0.5mm/s

2412091017_muRata-NFM31HK104R1H3L_C437584.pdf

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