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High current 0603 chip multilayer ceramic capacitor muRata NFM18PS105R0J3D with low DC resistance and insulation resistance

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High current 0603 chip multilayer ceramic capacitor muRata NFM18PS105R0J3D with low DC resistance and insulation resistance

Nominal Capacitance : 1uF

Operating Temperature : -55℃~+105℃

Voltage Rating : 6.3V

Tolerance : ±20%

DC Resistance(DCR) : 30mΩ

Current Rating : 2A

Description : 1uF ±20% 30mΩ SMD-4P,1.6x0.8mm Feed Through Capacitors RoHS

Mfr. Part # : NFM18PS105R0J3D

Model Number : NFM18PS105R0J3D

Package : SMD-4P,1.6x0.8mm

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Product Overview

The NFM18PS105R0J3 is a 0603 chip multilayer ceramic capacitor from Murata, designed for general electronic equipment. It features large current handling, high insertion loss, 3 terminals, and low ESL, making it suitable for applications requiring efficient filtering and noise suppression. This capacitor operates within a wide temperature range and offers stable performance with its robust construction.

Product Attributes

Brand: MURATA
Product Type: Chip Multilayer Ceramic Capacitors (EMIFIL)
Series: NFM18PS
Packaging: 0603

Technical Specifications

Item	Specification	Test Method
Nominal Capacitance	1 uF	JEMCPS-02212C
Capacitance Tolerance	±20 %	JEMCPS-02212C
DC Rated Voltage	DC 6.3 V	JEMCPS-02212C
Rated Current	2A(DC)	JEMCPS-02212C
DC Resistance	30mΩmax.	JEMCPS-02212C
Insulation Resistance	500MΩmin.	JEMCPS-02212C
Operating Temp. Range	-55 to 105 °C	JEMCPS-02212C
Storage Temp. Range	-55 to 125 °C	JEMCPS-02212C
Dimensions (L x W x T)	1.6±0.1 x 0.8±0.1 x 0.6±0.1 mm	JEMCPP-02231A
Packaging Code	(7)	JEMCPP-02231A
Packaging Unit	4000 pcs./Reel	JEMCPP-02231A
Reel Diameter	180mm	JEMCPP-02231A
Taping	PAPER W8P4	JEMCPP-02231A
Appearance	No defects or abnormalities.	Visual inspection
Solderability	Electrodes shall be at least 90% covered with new solder coating.	Ethanol solution of rosin, 25(wt)%; Pre-heat: 150±10°C, 60 to 90s; Solder: Sn-3.0Ag-0.5Cu; Solder Temp: 240 ± 3°C; Immersion Time: 3±1 s
Resistance to soldering heat	Products shall be no failure after tested.	Ethanol solution of rosin, 25(wt)%; Pre-heat: 150±10°C, 60 to 90s; Solder: Sn-3.0Ag-0.5Cu; Solder Temp: 270 ± 5°C; Immersion Time: 10 ±1 s
Bending Strength	Meet Table 2. Deflection: 1 mm	Soldered on glass-epoxy substrate (100x40x0.8mm)
Drop	It shall be dropped on concrete or steel board. Height: 1m	Free fall, 10 times
Bonding Strength	It shall be soldered on the glass-epoxy substrate.	Applying Force (F): 5 N, Applying Time: 10 s
Vibration	Meet Table 3. Oscillation Frequency: 10 to 2000 to 10Hz	Soldered on glass-epoxy substrate
Temperature Cycling	Meet Table 1. 10 cycles	Soldered on glass-epoxy substrate
Humidity	Meet Table 4. Temperature: 40±2°C, Humidity: 90 to 95%(RH), Time: 500+24 / -0 hours	Soldered on glass-epoxy substrate
Heat Life	1000+48 / -0 hours	Soldered on glass-epoxy substrate

2410121725_muRata-NFM18PS105R0J3D_C98105.pdf

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