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Large Current Low ESL Multilayer Ceramic Capacitor 3 Terminals muRata NFM18PC474R0J3D for Noise Suppression

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Large Current Low ESL Multilayer Ceramic Capacitor 3 Terminals muRata NFM18PC474R0J3D for Noise Suppression

Operating Temperature : -55℃~+125℃

Nominal Capacitance : 470nF

Voltage Rating : 6.3V

Tolerance : ±20%

DC Resistance(DCR) : 30mΩ

Current Rating : 2A

Description : 470nF ±20% 30mΩ SMD-3P,1.6x0.8mm Feed Through Capacitors RoHS

Mfr. Part # : NFM18PC474R0J3D

Model Number : NFM18PC474R0J3D

Package : SMD-3P,1.6x0.8mm

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Product Overview

NFM18PC474R0J3_ is a Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitor (EMIFIL) designed for general electronic equipment. It offers low ESL and is suitable for applications requiring filtering and noise suppression.

Product Attributes

  • Brand: MURATA
  • Packaging: 8mm-wide paper tape, 4000 pcs./Reel

Technical Specifications

ItemSpecificationTest Method
Nominal Capacitance0.47 uFFrequency : 1.00.1kHz (Cap.) Voltage : 10.2V(rms)
Capacitance Tolerance20 %
DC Rated VoltageDC 6.3 V
Rated Current2A(DC)
DC Resistance30mmax.Measured with 100mA max.
Insulation Resistance1000Mmin.Voltage : Rated Voltage Time : 2 minutes max.
Operating Temp. Range-55 to 125 CIncludes self-heating
Storage Temp. Range-55 to 125 C
Dimensions (L x W x T)1.60.1 x 0.80.1 x 0.60.1 mmUsing calipers.
Packaging CodeD
AppearanceNo defects or abnormalities.Visual inspection.
SolderabilityElectrodes shall be at least 90% covered with new solder coating.Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 15010C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240 3C Immersion Time : 31 s
Resistance to soldering heatNo failure after tested.Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 15010C, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270 5C Immersion Time : 10 1 s
Bending StrengthDeflection : 2 mm Keeping Time : 30 sSoldered on glass-epoxy substrate (100401.0mm).
DropHeight : 1m Method : Free fall Attitude : 3 directionsDropped on concrete or steel board.
Bonding StrengthApplying Force (F) : 9.8 N Applying Time : 10 sSoldered on glass-epoxy substrate.
VibrationOscillation Frequency : 10 to 2000 to 10Hz for 20 minute. Total amplitude 1.5 mm or Acceleration amplitude 196m/s2 whichever is smaller. Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours)Soldered on glass-epoxy substrate. Preconditioning : Heat treatment (150+0 / -10 C,1hour)
Temperature Cycling10 cycles-55+0 / -3C (30+3 / -0 min) -> Room Temp. (within 3 min) -> Max Operating Temp. +3 / -0C (30 +3 / -0 min) -> Room Temp. (within 3 min)
Humidity500+24 / -0 hoursTemperature : 402C Humidity : 90 to 95%(RH)
Heat Life1000+48 / -0 hoursTemperature : Maximum Operating Temperature 2 C Test Voltage : Rated Voltage x 200% Charge Current : 50 mA max.

2410121715_muRata-NFM18PC474R0J3D_C478452.pdf


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