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Low ESL Multilayer Ceramic Capacitor muRata NFM21PC224R1C3D Designed for General Electronic Equipment

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Low ESL Multilayer Ceramic Capacitor muRata NFM21PC224R1C3D Designed for General Electronic Equipment

Operating Temperature : -55℃~+125℃

Nominal Capacitance : 220nF

Voltage Rating : 16V

Tolerance : ±20%

DC Resistance(DCR) : 30mΩ

Current Rating : 2A

Description : 220nF ±20% 30mΩ SMD-4P,2x1.2mm Feed Through Capacitors RoHS

Mfr. Part # : NFM21PC224R1C3D

Model Number : NFM21PC224R1C3D

Package : SMD-4P,2x1.2mm

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Product Overview

The NFM21PC224R1C3 is a Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitor (EMIFIL) designed for general electronic equipment. It offers advantages such as low ESL and is suitable for applications requiring high reliability.

Product Attributes

  • Brand: MURATA
  • Packaging: 8mm-wide paper tape, 4000 pcs./Reel
  • Material: Multilayer Ceramic

Technical Specifications

ItemSpecificationTest Method
Nominal Capacitance0.22 uF
Capacitance Tolerance±20 %
DC Rated VoltageDC 16 V
Rated Current (DC)2A
DC Resistance30mΩmax.Measured with 100mA max.
Insulation Resistance1000MΩmin.
Operating Temperature Range-55 to 125 °C
Storage Temperature Range-55 to 125 °C
Dimensions (L x W x T)2.0±0.2 x 1.25±0.1 x 0.85±0.1 mm
Dimensions (e.g., j, d, g)j: 0.25±0.2, d: 0.3±0.2, g: 0.4±0.2 mm
Capacitance MeasurementFrequency: 1.0±0.1kHz, Voltage: 1±0.2V(rms)
Withstanding VoltageRated Voltage x 300% for 1 to 5 sCharge Current: 50 mA max.
AppearanceNo defects or abnormalities.Visual inspection.
Dimensions CheckWithin specified dimensions.Using calipers.
SolderabilityElectrodes shall be at least 90% covered with new solder coating.Flux: Ethanol solution of rosin, 25(wt)%, Pre-heat: 150±10°C, 60 to 90s, Solder: Sn-3.0Ag-0.5Cu, Solder Temperature: 240 ± 3°C, Immersion Time: 3±1 s
Resistance to Soldering HeatNo failure after tested. Appearance No damaged, Cap. Change Within ±7.5%, DC Resistance 0.05Ωmax.Flux: Ethanol solution of rosin, 25(wt)%, Pre-heat: 150±10°C, 60 to 90s, Solder: Sn-3.0Ag-0.5Cu, Solder Temperature: 270 ± 5°C, Immersion Time: 10 ± 1 s
Bending StrengthNo damaged, Cap. Change Within ±7.5%, DC Resistance 0.05Ωmax.Soldered on glass-epoxy substrate (100x40x1.0mm), Deflection: 2 mm, Keeping Time: 30 s
DropNo damaged, Cap. Change Within ±7.5%, DC Resistance 0.05Ωmax.Dropped on concrete or steel board, Height: 75 cm, Method: Free fall
Bonding StrengthNo damaged, Capacitance Meet the initial rated value.Soldered on glass-epoxy substrate, Applying Force (F): 9.8 N, Applying Time: 30 s
VibrationNo damaged, Capacitance Meet the initial rated value.Soldered on glass-epoxy substrate, Oscillation Frequency: 10 to 55 to 10Hz for 1 minute, Double Amplitude: 1.5 mm
Temperature CyclingAppearance No damaged, Cap. Change Within ±12.5%, I.R. 50Ω·F min., DC Resistance 0.05Ωmax.1 Cycle: Min Op Temp +0/-3°C (30+3/-0 min), Room Temp (within 3 min), Max Op Temp +3/-0°C (30+3/-0 min), Room Temp (within 3 min). Total 10 cycles.
HumidityAppearance No damaged, Cap. Change Within ±12.5%, I.R. 50Ω·F min., DC Resistance 0.05Ωmax.Temperature: 40±2°C, Humidity: 90 to 95%(RH), Time: 500+24/-0 hours
Heat LifeAppearance No damaged, Cap. Change Within ±12.5%, I.R. 50Ω·F min., DC Resistance 0.05Ωmax.Temperature: Maximum Operating Temperature ± 2 °C, Test Voltage: Rated Voltage x 200%, Time: 1000+48/-0 hours
Packaging Unit4000 pcs./Reel
Taping SpecificationSprocket holes to the right as tape is pulled toward user. Base tape and top tape have no spliced point. Cavity shall not have burr. Missing components number within 0.1% of reel count or 1 pc., whichever is greater, and not continuous.
Pull Strength of Top Tape and Bottom Tape5N min.
Peeling off force of top tape0.1N to 0.6N (minimum value is typical)Speed of Peeling off: 300 mm / min

2410121932_muRata-NFM21PC224R1C3D_C337966.pdf


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