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General Purpose Low ESL Large Current Capacitors muRata NFM41PC155B1E3L Multilayer Ceramic Chip Type

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General Purpose Low ESL Large Current Capacitors muRata NFM41PC155B1E3L Multilayer Ceramic Chip Type

Operating Temperature : -55℃~+85℃

Nominal Capacitance : 1.5uF

Voltage Rating : 25V

Tolerance : -20%~+50%

DC Resistance(DCR) : 9mΩ

Current Rating : 6A

Description : 1.5uF -20%~+50% 9mΩ 1806 Feed Through Capacitors RoHS

Mfr. Part # : NFM41PC155B1E3L

Model Number : NFM41PC155B1E3L

Package : 1806

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Product Overview

This product specification is applied to Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitors (EMIFIL) used for General Electronic equipment. These capacitors offer low ESL and are designed for general-purpose applications.

Product Attributes

  • Brand: MURATA
  • Part Number System Example: NFM41PC155B1E3
  • Packaging: 180mm Reel, EMBOSSED W12P4, 4000 pcs./Reel

Technical Specifications

ItemSpecificationTest Method
Electrical Performance
Nominal Capacitance1.5 ±0.3 μFFrequency : 1.0±0.1KHz (Cap.) Voltage : 1±0.2V(rms)
Capacitance Tolerance±20 %-
DC Rated VoltageDC 25 VRated Voltage Time : 2 minutes max.
Rated Current6A(DC)-
DC Resistance9mΩmax.Measured with 100mA max.
Insulation Resistance300MΩmin.-
Withstanding VoltageProducts shall not be damaged.Test Voltage : Rated voltage x 250% Time : 1 to 5 s Charge Current : 50mA max.
Operating Temperature-55 to 85 ℃Shown in Rated value. Includes self-heating
Storage Temperature-55 to 85 ℃Shown in Rated value.
Mechanical Performance
AppearanceNo defects or abnormalities.Visual inspection.
DimensionsWithin the specified dimensions.Using Measuring instrument of dimension.
SolderabilityElectrodes shall be at least 95% covered with new solder coating.Flux : Solution of rosin ethanol 25(mass)% Pre-heat : 150±10℃, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240±3℃ Immersion Time : 3±1s Immersion and emersion rates : 25mm/s
Resistance to soldering heatProducts shall be no failure after tested.Flux : Solution of rosin ethanol 25(mass)% Pre-heat : 150±10℃, 60 to 90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270±5℃ Immersion Time : 10±1s Immersion and emersion rates : 25mm/s
Bending StrengthMeet Table 2.It shall be soldered on the glass-epoxy substrate(t = 1.0mm). Deflection : 2mm Keeping Time : 30s
DropThe electrodes shall be no failure after tested.It shall be dropped on concrete or steel board. Method : Free fall Height : 1m The Number of Time : Total 10 times
Bonding Strength-It shall be soldered on the glass-epoxy substrate. Applying Force (F) : 9.8N Applying Time : 30s
VibrationMeet Table 3.It shall be soldered on the glass-epoxy substrate. Oscillation Frequency : 10 to 2000 to 10Hz for 20 minute. Total amplitude : 1.5 mm or Acceleration amplitude 196m/s² whichever is smaller. Time: 4 hours of the 3 directions for each.
Environment Performance
Temperature CyclingMeet Table 4.1 Cycle: -55+0/-3℃ / 30+3/-0 min, Room Temp. / within 3 min, +85+3/-0℃ / 30+3/-0 min, Room Temp. / within 3 min. Total of 10 cycles.
HumidityMeet Table 5.Temperature : 70±2℃ Humidity : 90 to 95%(RH) Time : 1000+48/-0 hours
Humidity LifeMeet Table 6.Temperature : 70±2℃ Humidity : 90 to 95%(RH) Time : 500+24/-0 hours Test Voltage : Rated Voltage Test Current : Rated Current
Heat lifeMeet Table 4.Temperature : -85±2℃ Time : 1000+48/-0 hours Test Voltage : Rated Voltagex200% Test Current : Rated Current Change Current : 50A
Cold ResistanceMeet Table 6.Temperature : -55±2℃ Time : 500+24/-0 hours
Dimensions (Unit:mm)
L1.5±0.3-
W1.6±0.3-
T1.0±0.2-
e0.4±0.3-
f0.7 min.-
Packaging Code1E3 L-

Standard Testing Condition

Unless otherwise specified
Temperature : Ordinary Temp. / 15 ℃ to 35 ℃
Humidity: Ordinary Humidity / 25 %(RH) to 85 %(RH)
Atmospheric pressure: 86 kPa to 106 kPa

In case of doubt
Temperature: 20 ℃ ± 2 ℃
Humidity: 60 %(RH) to 70 %(RH)


2410121725_muRata-NFM41PC155B1E3L_C98106.pdf


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