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Compact chip common mode choke coil muRata DLW31SN261SQ2L designed for noise suppression in electronics

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Compact chip common mode choke coil muRata DLW31SN261SQ2L designed for noise suppression in electronics

Insulation Resistance(IR) : 10MΩ

Operating Temperature : -40℃~+85℃

DC Resistance(DCR) : 300mΩ

Voltage Rating - DC : 50V

Number of Lines : 2

Voltage Withstand : 125V

Description : 2Line Common Mode Choke Surface Mount-4P 3.2x1.6mm 260Ω@100MHz 310mA DCR 300mΩ

Mfr. Part # : DLW31SN261SQ2L

Model Number : DLW31SN261SQ2L

Package : SMD-4P,3.2x1.6mm

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Product Overview

The DLW31SN Series is a Chip Common Mode Choke Coil designed for noise suppression. It offers reliable performance in a compact form factor, suitable for various electronic applications.

Product Attributes

  • Brand: MURATA MFG.CO.,LTD
  • Type: Wire Wound Chip Common Mode Choke Coil
  • Series: DLW31SN

Technical Specifications

Customer Part NumberMurata Part NumberCommon Mode Impedance (at 100MHz, 25%)Rated Voltage (VDC)Withstanding Voltage (VDC)Rated Current (mA)DC Resistance ( max.)Insulation Resistance (M min.)Operating TemperatureStorage Temperature
DLW31SN222SQ2LDLW31SN222SQ2L2200501252001.210-40 to +85C-40 to +85C
DLW31SN222SQ2BDLW31SN222SQ2B2200501252001.210-40 to +85C-40 to +85C
DLW31SN102SQ2LDLW31SN102SQ2L10002301.0-----
DLW31SN102SQ2BDLW31SN102SQ2B10002301.0-----
DLW31SN601SQ2LDLW31SN601SQ2L6002600.8-----
DLW31SN601SQ2BDLW31SN601SQ2B6002600.8-----
DLW31SN261SQ2LDLW31SN261SQ2L2603100.5-----
DLW31SN261SQ2BDLW31SN261SQ2B2603100.5-----
DLW31SN161SQ2LDLW31SN161SQ2L1603400.4-----
DLW31SN161SQ2BDLW31SN161SQ2B1603400.4-----
DLW31SN900SQ2LDLW31SN900SQ2L903700.3-----
DLW31SN900SQ2BDLW31SN900SQ2B903700.3-----
ItemSpecificationTest Method
Appearance and DimensionsMeet item 5.Visual Inspection and measured with Slide Calipers.
Bonding StrengthNo evidence of coming off substrate. Products shall not be mechanical damaged. It shall be soldered on the substrate. Applying Force(F) : 9.8N Applying Time : 51 seconds-
Bending StrengthMeet Table 1. It shall be soldered on the Glass-epoxy substrate Deflection : 2mm (t=1.0mm) Keeping time : 30 seconds Speed of Applying Force : 0.5mm/s-
DropIt shall be dropped on concrete or steel board. Method : free fall Height : 75 cm The Number of Times : 3 times-
VibrationIt shall be soldered on the substrate. Oscillation Frequency : 10 to 55 to 10Hz for 1 minute Total Amplitude : 1.5mm Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours)-
SolderabilityThe electrodes shall be at least 90% covered with new solder coating. Flux : Ethanol solution of rosin,25(wt)% includes activator equivalent to 0.06 to 0.10(wt)% chlorine Pre-Heating : 80 to 120C 1minute Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 2453C Immersion Time : 41 s Immersion and emersion rates : 25mm / s-
Resistance to Soldering HeatAppearance No damaged Common Mode Impedance Change within 20% I.R. 10M min. Withstanding Voltage No damagedFlux : Ethanol solution of rosin,25(wt)% includes activator equipment to 0.06 to 0.10(wt)% chlorine Pre-Heating : 80 to 120C ,1minute Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 2605C Immersion Time : 50.5 seconds Immersion and emersion rates : 25mm / s Then measured after exposure in the room condition for 4 to 48 hours.
Temperature CycleMeet Table 1. 1 Cycle Step 1 -40C(+0C,-3C) / 303 min Step 2 Ordinary Temp. / 10 to 15 minutes Step 3 +85C(+3C,-0C) / 303 min Step 4 Ordinary Temp. / 10 to 15 minutes Total of 10 cycles Then measured after exposure in the room condition for 4 to 48 hours-
HumidityTemperature : 402C Humidity : 90~95%(RH) Time : 1000(+48 hours,-0 hours) Then measured after exposure in the room condition for 4 to 48 hours.-
Heat lifeTemperature : 852C Applying Voltage : 2times for Rated Voltage Time : 1000(+48 hours,-0 hours) Then measured after exposure in the room condition for 4 to 48 hours.-
Cold ResistanceTemperature : -40 2C Time : 1000(+48 hours,-0 hours) Then measured after exposure in the room condition for 4 to 48 hours.-

2410121613_muRata-DLW31SN261SQ2L_C333986.pdf


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