| Product Name | Multilayer Ceramic Capacitors |
| Series | General Purpose Series (4V~63V) |
| Available Sizes (Inch/mm) | 0201 (0603) to 1210 (3225) |
| Dielectric Types & Temperature Characteristics | - C0G (NP0): 0 30 ppm/ (-55125)
- C0H (NP0): 0 60 ppm/ (-55125)
- X7R: 15% (-55125)
- X5R: 15% (-5585)
- X7S: 22% (-55125)
- X6S: 22% (-55105)
|
| Model Designation | HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] |
| Available Capacitance Ranges | Refer to Section 8 for detailed ranges per dielectric type and size. |
| Available Rated Voltages (VDC) | 4V to 630V (and higher, e.g., 1k Vdc) |
| Available Sizes (Dimensions in mm) | | 0201 (0603) | 0.600.03 L x 0.300.03 W x 0.300.03 T | | 0402 (1005) | 1.000.05 L x 0.500.05 W x 0.500.05 T | | 0603 (1608) | 1.600.20 L x 0.800.20 W x 0.800.20 T | | 0805 (2012) | 2.000.20 L x 1.250.20 W x 0.700.10 T (or up to 1.250.20 T) | | 1206 (3216) | 3.200.20 L x 1.600.20 W x 0.700.10 T (or up to 1.600.20 P) | | 1210 (3225) | 3.200.30 L x 2.500.30 W x 1.250.20 T (or up to 2.500.30 V) | |
| Termination Types | Cu/Ni/Sn (N), Cu/Resin/Ni/Sn (C) |
| Packaging Options | Paper taping (T), Bulk (B), Embossed taping (S) |
| Reel Sizes | 7 Inch (J, K), 13 Inch (D) |
| Soldering Methods | Reflow Soldering (R), Wave Soldering (W) |
| Reliability Test Standards | Appearance, Dimensions, Capacitance, DF, IR, DWV, Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability. (Refer to Section 9 for detailed requirements) |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% |
| Guaranteed Solderability Period | 6 months (under delivered package condition) |
