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Chip capacitor HenryTech HLCC10050G featuring TiW Pt Au plating for bonding process and conductive adhesive baking

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Chip capacitor HenryTech HLCC10050G featuring TiW Pt Au plating for bonding process and conductive adhesive baking

Voltage Rating : 50V

Capacitance : 100pF

Tolerance : ±20%

Description : 50V 100pF ±20% SMD,0.4x0.4mm Ceramic Capacitors RoHS

Mfr. Part # : HLCC10050G

Model Number : HLCC10050G

Package : SMD,0.4x0.4mm

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Product Overview

The HLCC10050G is a chip capacitor designed for bonding processes. It is suitable for applications requiring conductive adhesive H20E and a baking process at 120 for 30 minutes. The capacitor features a specific plating for its upper and lower layers, with a recommendation for welding wire placement to prevent electrode detachment.

Product Attributes

Brand: HenryTech
Origin: Chengdu City, China

Technical Specifications

Product Name	Part Number	Capacitance (pF) @1kHz,1Vrms,25, No DC Bias	Max Voltage (VDC)	Operating Temperature ()	Type	Upper Layer Coating	Lower Layer Coating
Chip Capacitor	HLCC10050G	10020%	50	-55 to +125	Single sided, bottom edge	TiW-Pt-Au 0.5m Min	TiW-Au 4.0m Min

Notes:

Storage conditions: Temperature 20-25, Humidity 40%-60%.
Suitable for bonding process with conductive adhesive H20E, baked at 120 for 30 minutes.
The welding position of the welding wire should be 25m or further away from the electrode edge to avoid electrode detachment.

2504101957_HenryTech-HLCC10050G_C46641101.pdf

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Chip capacitor HenryTech HLCC10050G featuring TiW Pt Au plating for bonding process and conductive adhesive baking Images

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