| Model Designation | HGC Series (e.g., HGC 0805 R7 104 K 500 N T H J) |
| Series | General Purpose Series (4V~63V) |
| Available Sizes (Inch/mm) | 0201 (0603) to 1210 (3225) |
| Dielectric Characteristics | - C0G/C0H: Temperature Coefficient: 0 30 ppm/ (C0G), 0 60 ppm/ (C0H); Operating Temp: -55 to 125
- X7R: Temperature Coefficient: 15%; Operating Temp: -55 to 125
- X5R: Temperature Coefficient: 15%; Operating Temp: -55 to 85
- X7S: Temperature Coefficient: 22%; Operating Temp: -55 to 125
- X6S: Temperature Coefficient: 22%; Operating Temp: -55 to 105
|
| Rated Voltages (VDC) | 4V to 630V (e.g., 4R0, 6R3, 100, 160, 250, 500, 101, 631, 1k, 5k) |
| Capacitance Range | 0.3pF to 220F (varies by dielectric and size) |
| Tolerance Levels | 0.05pF, 0.1pF, 0.25pF, 0.5pF, 1%, 2%, 5%, 10%, 15%, 20%, -20%~+50% |
| Termination Types | Cu/Ni/Sn |
| Packaging Options | Paper Taping, Embossed Taping, Bulk |
| Reel Sizes | 7 Inch, 13 Inch |
| Dimensions (L x W x T in mm) | | 0201 (0603) | 0.600.03 x 0.300.03 x 0.300.03 | | 0402 (1005) | 1.000.05 x 0.500.05 x 0.500.05 | | 0603 (1608) | 1.600.20 x 0.800.20 x 0.800.20 | | 0805 (2012) | 2.000.20 x 1.250.20 x 0.700.10 to 1.250.20 | | 1206 (3216) | 3.200.20 x 1.600.20 x 0.700.10 to 1.600.20 | | 1210 (3225) | 3.200.30 x 2.500.30 x 1.250.20 to 2.500.30 | |
| Soldering Methods | Reflow Soldering (R), Wave Soldering (W) |
| Reliability Tests | Appearance, Dimensions, Capacitance, Dissipation Factor, Insulation Resistance, Dielectric Withstanding Voltage, Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% (Guaranteed solderability for 6 months) |
